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IMPACT 2010 : 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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Link: http://www.impact.org.tw/2010/General/
 
When Oct 20, 2010 - Oct 22, 2010
Where Taipei, Taiwan
Submission Deadline Jun 11, 2010
Notification Due Jul 15, 2010
Final Version Due Aug 31, 2010
Categories    microsystems   packaging   assembly   impact
 

Call For Papers

2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.

IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.

Embrace IMPACT, Create Possibilities


Date: Wednesday-Friday, October 20-22, 2010


Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan


Conference: The 5th IMPACT Conference


Exhibition: TPCA Show 2010

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