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IEEE ICICM 2024 : IEEE--2024 The 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024) | |||||||||||
Link: http://icicm.net/ | |||||||||||
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Call For Papers | |||||||||||
★ICICM2024--Ei Compendex,Scopus--Wuhan, China★
★Full name: 2024 The 9th International Conference on Integrated Circuits and Microsystems ★Abbreviation: ICICM 2024 **Place: Wuhan, China **Time: October 25-27, 2024 **Website: http://icicm.net/ ★Co-Sponsored by: ==Southeast University, China ==University of Electronic Science and Technology of China, China ==Wuhan University of Technology, China ==Submission== 1. Full paper (publication and presentation) 2. Abstract (presentation only) Electronic submission system: https://easychair.org/conferences/?conf=icicm2024 Email submission: icicm_conf@vip.163.com More detail about submission, please visit at http://icicm.net/submission.html =Publication= The accepted and registered papers will be publication in Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc. ***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already! =Topics (include but not limit)= ► Devices and Circuits for Wirless System ► Application Specific Circuits and Systems for Communication ► Digital, Analog, Mixed Signal IC and SOC design technology ► Silicon integrated circuits and manufacturing ► Low-power, RF devices & circuits ► IC Computer-Aided –Design technology, DFM ► Silicon/germanium devices and device physics ► Interconnect, Low K, High K and other process technologies ► Unconventional and nano-electronics ► Organic semiconductor devices and technologies ► Compound semiconductor devices and circuits ► Displays, sensors and MEMS ► Semiconductor materials and material characterization ► Packaging and testing technology ► Solar cell & other devices for new energy sources ► Modeling and simulation ► Equipment technology ► Reliability ► Displays, sensors and MEMS ► Advance memories technology For more topics, please visit at: http://icicm.net/call-for-papers.html ==Organizing Committee== Advisory Chairs Junfa Mao, Shenzhen University, China Yue Hao, Xidian University, China Conference Chairs Zhigong Wang, Southeast University, China Ning Xu, Wuhan University of Technology, China Conference Co-Chairs Yu Wang,Tsinghua University,China Letian Huang, University of Electronic Science and Technology of China, China Program Chairs Jiliang Zhang, Hunan University, China Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China Sheng Chang, Wuhan University, China Yingmei Chen, Southeast University, China Xiulong Wu, Anhui University, China Zhikuang Cai, Nanjing University of Posts and Telecommunications, China Zhuo Zou, Fudan University, China Jianguo Hu, Sun Yat-sen University , China Bei Yu,The Chinese University of Hong Kong, China Program Co-Chairs Junyong Deng, Xi'an University of Posts & Telecommunications, China Jun Xu, Nanjing University, China Zhixiong Di, Southwest Jiaotong University, China Guojie Luo, Peking University, China Xiaojun Zhai, University of Essex, UK Wei Xing, The University of Sheffield, UK Program Committee Shi Pu, Wuhan University of Technology , China Haizhi Song, University Of Electronic Science And Technology Of China, China Lu Zhu, Sun Yat-sen University, China Youming Zhang, Southeast University, China Jianshi Tang, Tsinghua University, China Weiguang Sheng, Shanghai Jiao Tong University, China Hao Gao, Austria & Eindhoven University of Technology, The Netherland Yun Fang, Silicon Austria Labs, Austria Jeff Kilby, Auckland University of Technology, New Zealand Zhijun Zhou, Southeast University, China Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China Wei Hu, Northwestern Polytechnical University, China Local Chair Bowen Jia, Wuhan University of Technology , China Student Program Chairs Keping Wang, Tianjin University, China Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China Fanyi Meng, Tianjin University, China Student Program Committee Li Du, Nanjing University, China Lei Wang, Nanjing University Of Posts And Telecommunications, China Xianbo Li, Sun Yat-sen University, China Tiehu Li, Chongqing University of Technology, China Moufu Kong, University of Electronic Science and Technology of China, China Jiaxin Liu, University of Electronic Science and Technology of China, China Maliang Liu, Xidian University, China More Organizing Committee list, please visit: https://icicm.net/committee.html ==History== ICICM2016 | Chengdu on November 23-25, 2016 ICICM2017 | Nanjing on November 8-11, 2017 ICICM2018 | Shanghai on November 24-26, 2018 ICICM2019 | Beijing on October 25-27,2019 ICICM2020 | Nanjing on October 23-25, 2020 ICICM2021 | Nanjing on October 22-24, 2021 ICICM2022 | Xi'an on October 28-31, 2022 ICICM2023 | Nanjing on October 20-23, 2023 =CONTACT US= Ms. Jenny Chow Email: icicm_conf@vip.163.com Web: http://icicm.net/ Tel: (86)134-0855-5552 |
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