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ICSP 2016 : Industry Case Studies Program – Industry Day Industry Applications and Standard initiatives for Cooperative Information Systems - The future for the Cyber Physical Systems

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Link: http://otmconferences.org/index.php/industry-2016
 
When Oct 25, 2016 - Oct 25, 2016
Where Rhodes, Greece
Submission Deadline Jul 31, 2016
Notification Due Aug 15, 2016
Final Version Due Sep 1, 2016
Categories    cycber physical systems   IOT   interoperability   information systems
 

Call For Papers

Supported by
Object management Group (OMG) (http://www.omg.org)
Industrial Internet Consortium (http://www.iiconsortium.org)
IFAC TC 5.3 on “Enterprise Integration and Networking” (http://www.ifac-tc53.org)
SIG INTEROP Grande-Région on “Enterprise Systems Interoperability” (http://www.interop-grande-region.eu)
Greek Interoperability Centre on “Interoperability” (http://www.iocenter.eu/) (to be confirmed)

With a special plenary session on October 26th, 2015
“Future Perspectives on Cyber-Physical Systems for Cooperative Information Systems”
Together with CoopIS’2016 and EI2N’2016


Cooperative Information Systems provide enterprises and communities of users with flexible, scalable and intelligent services in large-scale networking environments. The OTM conference series has established itself as a major international forum for exchanging ideas and results on scientific research for practitioners in fields such as computer supported cooperative work (CSCW), middleware, Internet/Web data management, electronic commerce, workflow management, knowledge flow, agent technologies and software architectures, to name a few.
The recent popularity and interest in service-oriented architectures & domains require capabilities for on-demand composition of services. Furthermore, cloud computing environments are becoming more prevalent, in which information technology resources must be configured to meet user-driven needs. These emerging technologies represent a significant need for highly interoperable systems. This edition will address a particular set of topics and applications related to Interoperability for Cyber Physical Systems.
As a part of OnTheMove 2015, we are organizing an Industry Case Studies Program in order to emphasize the Research/Industry cooperation on these future trends. The focus of the program will be a discussion of ideas where research areas address interoperable information systems and infrastructure. Industry leaders, standardisation initiatives, European and international projects consortiums are invited to submit 4-6 pages position papers discussing how projects within their organizations address software, systems and architecture interoperability.
IMPORTANT DATES

Short Paper Submission Deadline June 31th, 2016
Acceptance Notification August 15th, 2016
Camera Ready Due September 1st , 2016
Registration Due September 1st , 2016
OTM Conferences October 24 - 38, 2016

SPONSORSHIP PACKAGES ARE AVAILABLE TO PROMOTE YOUR COMPANY, YOUR PRODUCTS, OR YOUR BUSINESS. PLEASE CONTACT US FOR MORE INFORMATION.
YOU CAN ALSO HAVE A LOOK AT:
http://www.otmconferences.org/index.php/homepage/sponsorship-opportunities

SUBMISSION GUIDELINES
Each submitted paper will be refereed by at least three members of the Program Committee, based on its originality, significance, technical soundness, and clarity of expression. Submissions must be in English, and may discuss industrial experience or academic research should not exceed 4 pages in the final camera-ready format. Only electronic submissions in Adobe PDF format are acceptable.
The final workshop proceedings will be published by Springer Verlag as LNCS (Lecture Notes in Computer Science). Author instructions can be found at:
http://www.springer.de/comp/lncs/authors.html
All authors will also participate in a panel that will occur at the end of the session.

For more information, please send a short abstract to the Program Chair.
Prof. Hervé Panetto, PhD
University of Lorraine, France
E-mail: Herve.Panetto@univ-lorraine.fr PROGRAM COMMITTEE (TO BE CONFIRMED AND COMPLETED)

The program committee is composed of representatives of industry, standard initiatives and European or international R&D projects

Industry
Gash Bhullar, Control 2K, UK
Christoph Bussler, Oracle Corporation, USA
Eva Coscia, Holonix, Italy
Francesco Danza, Expert System, Italy
Piero De Sabbata, ENEA, Italy
Donald Ferguson, DELL, USA
Pascal Gendre, Airbus, France
Ted Goranson, Sirius Beta, USA
Mathias Kohler, SAP Research, Germany
Dimitrov Marin, Ontotext, Bulgaria
Juan-Carlos Mendez, AdN International, Mexico
Yannick Naudet, LIST, Luxemburg
François B. Vernadat, European Court of Auditors, Luxemburg
Georg Weichhart, Profactor AG, Germany
Detlef Zühlke, DFKI, Germany
Michael Alexander, IBM, Austria
Sinuhe Arroyo, Playence, USA
Frédéric Autran, Cassidian, France
Ian Bayley, Model Futures, UK
Emmanuel Blanvillain, EADS, France
Serge Boverie, Contiental Engineering Services, France
Ben Calloni, Lockheed Martin, USA
David Cohen, Microsoft, France
Tuan Dang, EDF Research, France
Jacques Durand, Futjisu, USA
Dominique Ernadote, EADS-Cassidian
Kurt Fessl, Industrie Informatik, Germany
Sanford Friedenthal, Lockheed Martin, USA
Fabrizio Gagliardi, Microsoft, Switzerland
Jean-Luc Garnier, Thales Group, France
Mattew Hause, ATEGO, USA
Harald Kuehn, BOC AG, Austria
Antoine Lonjon, MEGA, France
Gottfried Luef, IBM, Austria
Jishnu Mukerji, HP, USA
Silvana Muscella, Trust - IT Services, UK
Ed Parsons, Google, UK
Andrea Persidis, Biovista, Greece
Daniel Sáez Domingo, ITI, Spain
Joe Salvo, GE, USA
Ayelet Sapir, Pangea, Israel
Stan Schneider, RTI, USA
Mark Schulte, Boeing, USA
Dirk Slama, Bosch, Germany

Standards
Richard Soley, OMG, USA
Martin Zelm, INTEROP Vlab
Peter Benson, ECCMA
Dennis Brandl, MESA, USA
Marc Delbaere, SWIFT, Belgium
Sheron Koshy, ECCMA India
Richard Martin, ISO TC184/SC5

Academics
Luis Camarinha-Matos, Uninova, Portugal
Vincent Chapurlat, EMA, France
Yannis Charalabidis, University of the Aegean, Greece
Andres Garcia Higuera, University Castilla-La Mancha, Spain
Ricardo Goncalves, New University of Lisbon, UNINOVA, Portugal
Peter Loos, IWi at DFKI, Saarland University
Eduardo Loures, PUC-PR, Brazil
Arturo Molina, Tecnologico de Monterrey, Mexico
Yasuyuki Nishioka, Hosei University, Japan
Hervé Panetto, University of Lorraine, France
Sobah Abbas Pertersen, SINTEF, Norway
Jean Simao, UTFPR, Brazil
Lawrence Whitman, University of Arkansas at LR, USA
Milan Zdravkovic, University of Nis, Serbia
Michele Dassisti, Politecnico di Bari, Italy
Janos Sztipanovits, Vanderbilt Scho

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