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ICSP 2016 : Industry Case Studies Program – Industry Day Industry Applications and Standard initiatives for Cooperative Information Systems - The future for the Cyber Physical Systems | |||||||||||||||
Link: http://otmconferences.org/index.php/industry-2016 | |||||||||||||||
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Call For Papers | |||||||||||||||
Supported by
Object management Group (OMG) (http://www.omg.org) Industrial Internet Consortium (http://www.iiconsortium.org) IFAC TC 5.3 on “Enterprise Integration and Networking” (http://www.ifac-tc53.org) SIG INTEROP Grande-Région on “Enterprise Systems Interoperability” (http://www.interop-grande-region.eu) Greek Interoperability Centre on “Interoperability” (http://www.iocenter.eu/) (to be confirmed) With a special plenary session on October 26th, 2015 “Future Perspectives on Cyber-Physical Systems for Cooperative Information Systems” Together with CoopIS’2016 and EI2N’2016 Cooperative Information Systems provide enterprises and communities of users with flexible, scalable and intelligent services in large-scale networking environments. The OTM conference series has established itself as a major international forum for exchanging ideas and results on scientific research for practitioners in fields such as computer supported cooperative work (CSCW), middleware, Internet/Web data management, electronic commerce, workflow management, knowledge flow, agent technologies and software architectures, to name a few. The recent popularity and interest in service-oriented architectures & domains require capabilities for on-demand composition of services. Furthermore, cloud computing environments are becoming more prevalent, in which information technology resources must be configured to meet user-driven needs. These emerging technologies represent a significant need for highly interoperable systems. This edition will address a particular set of topics and applications related to Interoperability for Cyber Physical Systems. As a part of OnTheMove 2015, we are organizing an Industry Case Studies Program in order to emphasize the Research/Industry cooperation on these future trends. The focus of the program will be a discussion of ideas where research areas address interoperable information systems and infrastructure. Industry leaders, standardisation initiatives, European and international projects consortiums are invited to submit 4-6 pages position papers discussing how projects within their organizations address software, systems and architecture interoperability. IMPORTANT DATES Short Paper Submission Deadline June 31th, 2016 Acceptance Notification August 15th, 2016 Camera Ready Due September 1st , 2016 Registration Due September 1st , 2016 OTM Conferences October 24 - 38, 2016 SPONSORSHIP PACKAGES ARE AVAILABLE TO PROMOTE YOUR COMPANY, YOUR PRODUCTS, OR YOUR BUSINESS. PLEASE CONTACT US FOR MORE INFORMATION. YOU CAN ALSO HAVE A LOOK AT: http://www.otmconferences.org/index.php/homepage/sponsorship-opportunities SUBMISSION GUIDELINES Each submitted paper will be refereed by at least three members of the Program Committee, based on its originality, significance, technical soundness, and clarity of expression. Submissions must be in English, and may discuss industrial experience or academic research should not exceed 4 pages in the final camera-ready format. Only electronic submissions in Adobe PDF format are acceptable. The final workshop proceedings will be published by Springer Verlag as LNCS (Lecture Notes in Computer Science). Author instructions can be found at: http://www.springer.de/comp/lncs/authors.html All authors will also participate in a panel that will occur at the end of the session. For more information, please send a short abstract to the Program Chair. Prof. Hervé Panetto, PhD University of Lorraine, France E-mail: Herve.Panetto@univ-lorraine.fr PROGRAM COMMITTEE (TO BE CONFIRMED AND COMPLETED) The program committee is composed of representatives of industry, standard initiatives and European or international R&D projects Industry Gash Bhullar, Control 2K, UK Christoph Bussler, Oracle Corporation, USA Eva Coscia, Holonix, Italy Francesco Danza, Expert System, Italy Piero De Sabbata, ENEA, Italy Donald Ferguson, DELL, USA Pascal Gendre, Airbus, France Ted Goranson, Sirius Beta, USA Mathias Kohler, SAP Research, Germany Dimitrov Marin, Ontotext, Bulgaria Juan-Carlos Mendez, AdN International, Mexico Yannick Naudet, LIST, Luxemburg François B. Vernadat, European Court of Auditors, Luxemburg Georg Weichhart, Profactor AG, Germany Detlef Zühlke, DFKI, Germany Michael Alexander, IBM, Austria Sinuhe Arroyo, Playence, USA Frédéric Autran, Cassidian, France Ian Bayley, Model Futures, UK Emmanuel Blanvillain, EADS, France Serge Boverie, Contiental Engineering Services, France Ben Calloni, Lockheed Martin, USA David Cohen, Microsoft, France Tuan Dang, EDF Research, France Jacques Durand, Futjisu, USA Dominique Ernadote, EADS-Cassidian Kurt Fessl, Industrie Informatik, Germany Sanford Friedenthal, Lockheed Martin, USA Fabrizio Gagliardi, Microsoft, Switzerland Jean-Luc Garnier, Thales Group, France Mattew Hause, ATEGO, USA Harald Kuehn, BOC AG, Austria Antoine Lonjon, MEGA, France Gottfried Luef, IBM, Austria Jishnu Mukerji, HP, USA Silvana Muscella, Trust - IT Services, UK Ed Parsons, Google, UK Andrea Persidis, Biovista, Greece Daniel Sáez Domingo, ITI, Spain Joe Salvo, GE, USA Ayelet Sapir, Pangea, Israel Stan Schneider, RTI, USA Mark Schulte, Boeing, USA Dirk Slama, Bosch, Germany Standards Richard Soley, OMG, USA Martin Zelm, INTEROP Vlab Peter Benson, ECCMA Dennis Brandl, MESA, USA Marc Delbaere, SWIFT, Belgium Sheron Koshy, ECCMA India Richard Martin, ISO TC184/SC5 Academics Luis Camarinha-Matos, Uninova, Portugal Vincent Chapurlat, EMA, France Yannis Charalabidis, University of the Aegean, Greece Andres Garcia Higuera, University Castilla-La Mancha, Spain Ricardo Goncalves, New University of Lisbon, UNINOVA, Portugal Peter Loos, IWi at DFKI, Saarland University Eduardo Loures, PUC-PR, Brazil Arturo Molina, Tecnologico de Monterrey, Mexico Yasuyuki Nishioka, Hosei University, Japan Hervé Panetto, University of Lorraine, France Sobah Abbas Pertersen, SINTEF, Norway Jean Simao, UTFPR, Brazil Lawrence Whitman, University of Arkansas at LR, USA Milan Zdravkovic, University of Nis, Serbia Michele Dassisti, Politecnico di Bari, Italy Janos Sztipanovits, Vanderbilt Scho |
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