ICRREDM 2026 brings together researchers, academicians, industry professionals and students to present innovations in next-generation engineering devices and intelligent material systems. The conference promotes interdisciplinary research in electronics, smart materials, sensors, advanced manufacturing, CMOS scaling, memory devices, THz/mmWave materials, 5G/6G materials and AI-driven material informatics.

All submissions will undergo a double-blind peer-review by two reviewers. Only registered and presented papers will be included in the AIP Conference Proceedings (Scopus indexed).

Hybrid mode is available for international authors.

Track 1: Electronics & Electrical
Track 2: Advanced Materials for Sensors
Track 3: Mechanics & Materials
Track 4: AI/ML / Deep Learning in Materials & Devices


📍 Chennai | 🗓 March 30–31, 2026
📖 AIP Conference Proceedings (Scopus Indexed)

5G/6G materials
CMOS scaling
Chiplet & heterogeneous integration
Material informatics
Memory devices
THz materials
IoT devices
Nanomaterials
Additive manufacturing
Smart materials
Sensor systems