IEEE 2025 International Conference on Advanced Semiconductor Devices and Integration Technology (ASDIT 2025) will be held from September 19 to 21, 2025, in Wuxi, Jiangsu, China.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/3iiEnm

This conference aims to bring together top scholars, industry experts, and business leaders from around the world in the semiconductor field to discuss the latest research findings and technological advancements. The conference will cover the design, manufacture, materials, and innovations of advanced semiconductor devices in various applications, including cutting-edge technologies such as artificial intelligence, quantum computing, and 5G communications.

---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕ Advanced Semiconductor Devices
· New Semiconductor Materials and Their Applications in Devices
· High-Performance MOSFET Design and Optimization
· Power Device Technologies for Energy Efficiency Optimization
· III-V Compound Semiconductor Devices Beyond Silicon
· Micro-Optoelectronic Semiconductor Sensors and Their Applications
· Semiconductor Lasers and Their Emerging Application Areas
......

◕ Integration Technology
· Three-Dimensional Integrated Circuits and Their Manufacturing Processes
· System on Chip (SoC) and Integration Methods
· Chip Heterogeneous Integration Technology
· Development and Innovation in Package-Level Integration Technologies
· Thermal Management Technologies in Integrated Circuits
· Radio Frequency Integrated Circuits and Their Design Optimization
......

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in IEEE(ISBN: 979-8-3315-9671-2), and submitted to EI Compendex, Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Registration Deadline: September 12, 2025
Final Paper Submission Date: September 12, 2025
Conference Dates: September 19-21, 2025

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/3iiEnm