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IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 20
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan)
April 19 - 21, 2017
http://www.coolchips.org

CALL FOR PAPERS
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Important Dates:

* Technical Papers:
- Feb. 6th, 2017: Extended Abstract Submission (through website)
- Mar. 8th, 2017: Acceptance Notified (by e-mail)
- Mar. 31st, 2017: Final Manuscript Submission

* Posters:
- Mar. 15th, 2017: Poster Abstract Submission (through website)
- Mar. 22nd, 2017: Poster Acceptance Notified (by e-mail)

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COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips. The symposium covers
leading-edge technologies in all areas of microprocessors and their
applications. The COOL Chips 20 is to be held in Yokohama on April
19-21, 2017, and is targeted at the architecture, design and
implementation of chips with special emphasis on the areas listed
below. All papers will be published online via IEEE Xplore. From this
year's symposium, the COOL Chips Program Committee will ask the IEEE
Transactions on Multi-Scale Computing Systems (TMSCS,
https://www.computer.org/web/tmscs) to publish selected papers in a
special issue on COOL Chips 20. Authors of industrial best papers will
be recommended to submit an extended version to a COOL Chips special
issue of IEEE Micro.

Contributions are solicited in the following areas:

- Low Power-High Performance Processors for Multimedia, Digital
Consumer Electronics, Mobile, Graphics, Encryption, Robotics,
Automotive, Networking, Medical, Healthcare, and Biometrics.

- Novel Architectures and Schemes for Single Core, Multi/Many-Core,
Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and Wireless.

- Cool Software including Parallel Schedulers, Embedded Real-time
Operating System, Binary Translations, Compiler Issues and Low Power
Techniques.

Proposals should consist of a title, an extended abstract (up to 3
pages) describing the product or topic to be presented and the name,
job title, address, phone number, FAX number, and e-mail address of
the presenter. The status of the product or topic should precisely be
described. If this is a not-yet-announced product, and you would like
to keep the submission confidential, please indicate it. We will do
our best to maintain confidentiality. Proposals will be selected by
the program committee's evaluation of interest to the
audience. Submission should be made through website. Detailed
instructions are in author's kit to be uploaded to
http://www.coolchips.org/ .

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