Call for Papers: MultiPLE 2013

1st International Workshop on Multi Product Line Engineering

https://sites.google.com/site/wMultiPLE2013/

co-located with SPLC 2013, 26-30 August 2013, Tokyo, Japan

Motivation

A multi product line is a product line that integrates assets
which themselves have been developed as product lines, or as
parts of product lines, by independent teams or organizations.
Multi product lines differ from single product lines in the
sense that these assets are managed independently of each
other, and have their own requirements and stakeholders. The
cross-organizational distribution of reusable assets
introduces several challenges, such as inconsistent
configuration of components and development artifacts, costly
and time-consuming integration processes, diverging evolution
speed and direction, and inadequate testing.

The goal of this workshop is to identify and better understand
the challenges that are involved with managing the development
and evolution of multi product lines and the distribution of
assets used for their production across organizations. To this
end, we aim at bringing together researchers, practitioners,
and experts from various fields of software engineering to
discuss practical challenges, investigate potential solutions,
and establish a common research agenda on Multi Product Line
Engineering.

Topics

We particularly encourage position papers and experience
reports, which identify and structure open challenges and
research questions. We are interested in all topics related to
multi product line engineering, including but not limited to:

* scoping for multi product lines
· domain requirements engineering for MPLs
* (cross-organizational) modeling of multi product lines
· commonality and variability analysis
* MPL integration and interoperability management
· product derivation & configuration management
· asset management
· transition strategies
* (cross-organizational) evolution of MPLs
· model maintenance
· change impact analysis
· metrics and measurement
* MPL certification, verification and validation
* industrial experiences & empirical studies on MPLs
* MPLs and software ecosystems
· MPLs in the open source world
* non-technical issues surrounding MPLs
· economic and legal issues
· organizational, managerial, and process issues
· MPL training for organizations

Submission guidelines

We are looking for position papers and experience reports
(2-4 pages) in ACM SIGS proceedings format. Submissions will
be selected based on the relevance to the workshop topics and
the suitability to trigger discussions. All submissions will
be reviewed by at least three members of the program
committee. Accepted papers will be published in the ACM
Digital Library as part of the SPLC workshop proceedings.
Papers should be submitted via Easychair at:
www.easychair.org/conferences/?conf=multiple2013

Important Dates

Submission deadline: May 27, 2013
Author notifications: June 24, 2013
Camera-ready copies: July 8th, 2013
Workshop date: August 27th, 2013

Workshop format

The MultiPLE workshop is a one-day event with strong focus on
discussion and interaction. The workshop starts with an
interactive introduction session, which is followed by three
focused sessions containing short presentations ("lightning
talks"). Each talk will be followed by time for clarification
questions. The second half of each session is reserved for an
open discussion on the focus area, not just about the papers
that were presented. After lunch, we will have three working
sessions that are built around interactive discussion
techniques such as collaborative affinity diagramming and
fishbowl panel discussions. These sessions are respectively
aimed at building a common understanding of the challenges,
discussing directions for potential solutions and establishing
a common research agenda.

Contact Information

To contact the organizers, please send an email to:
MultiPLE2013-organizers@googlegroups.com

Organizing Committee

· Leon Moonen, Simula Research Laboratory, Norway
· Razieh Behjati, Simula Research Laboratory, Norway
· Rick Rabiser, Johannes Kepler University, Austria
· Mithun Acharya, ABB Corporate Research, USA
· Bedir Tekinerdogan, Bilkent University, Turkey
· Kyo-Chul Kang, POSTECH, Korea

Program Committee

· Jan Bosch, Chalmers University of Technology, Sweden
· Goetz Botterweck, Lero, Ireland
· Rubby Casallas, Universidad de los Andes, Colombia
· De-Jiu Chen, KTH Royal Institute of Technology, Sweden
· Paul Clements, BigLever, USA
· Deepak Dhungana, Siemens AG, Austria
· Christoph Elsner, Siemens AG, Germany
· Paul Grünbacher, Johannes Kepler University, Austria
· Gerald Holl, Johannes Kepler University, Austria
· Arnaud Hubaux, ASML, the Netherlands
· Christian Kästner, Carnegie Mellon University, USA
· Ramtin Khosravi, University of Tehran, Iran
· Jens Krinke, University College London, United Kingdom
· Toacy Oliveira, University of Rio de Janeiro, Brazil
· Klaus Pohl, University of Duisburg-Essen, Germany
· Xiao Qu, ABB Corporate Research, USA
· Mark-Oliver Reiser, Technical University Berlin, Germany
· Jean-Claude Royer, Ecole des Mines de Nantes, France
· Klaus Schmid, University of Hildesheim, Germany
· Norbert Siegmund, University of Magdeburg, Germany
· Olaf Spinczyk, Technical University Dortmund, Germany
· Salvador Trujillo, Ikerlan Research Centre, Spain
· Liming Zhu, Australian Technology Park, Australia