![]() |
| |||||||||||||
MIXDES 2011 : 18th International Conference Mixed Design of Integrated Circuits and Systems | |||||||||||||
Link: http://www.mixdes.org | |||||||||||||
| |||||||||||||
Call For Papers | |||||||||||||
The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to continue the tradition of inviting you to the most attractive places in Poland and the will take place in Gliwice.
The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices. The MIXDES conference papers are indexed in Thomson Reuters Conference Proceedings Citation Index and available in IEEE Xplore since MIXDES 2005. The topics of the MIXDES 2011 Conference include: 1. Design of Integrated Circuits and Microsystems Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse. 2. Thermal Issues in Microelectronics Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits. 3. Analysis and Modelling of ICs and Microsystems Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification. 4. Microelectronics Technology and Packaging New microelectronic technologies. Packaging. Sensors and actuators. 5. Testing and Reliability Design for testability and manufacturability. Measurement instruments and techniques. 6. Power Electronics Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration. 7. Signal Processing Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions. 8. Embedded Systems Design, verification and applications. 9. Medical Applications Medical and biotechnology applications. Thermography in medicine. 10. Student Projects |
|