A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, VLSI design and EDA. Authors are invited to submit papers in the various disciplines of high level design, circuit design, test & verification, design automation tools; processes; flows, device modeling, semiconductor technology, advance packaging, and biomedical & bio-electronic devices.

1. Manufacturing, Semiconductor Process and Devices
1. Design for Manufacturability/Yield & Quality (DFQ)
2. Design
1. System-level Design, Methodologies & Tools (SDM)
2. Package - Design Interactions & Co-Design (PDI)
3. Robust & Power-conscious Devices, Interconnects, and Circuits (PCC)
4. Emerging/Innovative Process & Device Technologies and Design Issues (EDT)
5. Design of Reliable Circuits and Systems (DFR)
3. EDA/CAD
1. EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse (EDA)
2. Design Verification and Design for Testability (DVFT)
3. Physical Design, Methodologies & Tools (PDM)

The details of various topics of paper submission is as follows:
Design for Manufacturability/Yield & Quality (DFQ)

DFM/DFY/DFQ definitions, methodologies, matrices, and standards. Quality-based design methodologies and flows for custom, semi-custom, ASIC, FPGA, RF, memory, networking circuit, etc. Design flows and methodologies for SoC, and SiP. Analysis, modeling, and abstraction of manufacturing process parameters and effects for highly predictable silicon performance. Design and synthesis of ICs considering factors such as: signal integrity, transmission line effects, OPC, phase shifting, and sub-wavelength lithography, manufacturing yield and technology capability. Design for diagnosability, defect detection and tolerance; self-diagnosis, calibration and repair. Design and manufacturabilty issues for Digital, analog, mixed signal, RF, MEMS, opto-electronic, biochemical-electronic, and nanotechnology based ICs. Redundency and other yield improving techniques. Global, social, and economic implications of design quality. Mask making methods and advances impacting manufacturability and yield.
Physical Design, Methodologies & Tools (PDM)

Physical design for manufacturing; Physical synthesis flows for correct-by-construction quality silicon, implementation of large SoC designs. Tool frameworks and data-models for tightly integrated incremental synthesis, placement, routing, timing analysis and verification. Placement, optimization, and routing techniques for noise sensitivity reduction and fixing. Algorithms and flows for harnessing crosstalk-delay during physical synthesis. Tool flows and techniques for antenna rule and electromigration rule avoidance and fixing. Spare-cell strategies for ECO, decoupling capacitance and antenna rule fixing. Physical planning tools for predictable power-aware circuits. Reliable clock tree generation and clock distribution methodologies for Gigahertz designs. EDA tools, design techniques, and methodologies, dealing with issues such as: timing closure, R, L, C extraction, ground/Vdd bounce, signal noise/cross-talk /substrate noise, voltage drop, power rail integrity, electromigration, hot carriers, EOS/ESD, plasma induced damage and other yield limiting effects, high frequency effects, thermal effects, power estimation, EMI/EMC, proximity correction & phase shift methods, verification (layout, circuit, function, etc.).
Design Verification and Design for Testability (DVFT)

Hardware and Software, Formal and simulation based design verification techniques to ensure the functional correctness of hardware early in the design cycle. DFT and BIST for digital and SoC. DFT for analog/mixed-signal ICs and systems-on-chip, DFT/BIST for memories. Test synthesis and synthesis for testability. DFT economics, DFT case studies. DFT and ATE. Fault diagnosis, IDDQ test, novel test methods, effectiveness of test methods, fault models and ATPG, and DPPM prediction. SoC/IP testing strategies. Design methodologies dealing with the link between testability and manufacturing.
EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse (EDA)

EDA tools addressing design for manufacturing, yield, and reliability. Management of design process, design flows and design databases. EDA tools interoperability issues and implications. Effect of emerging technologies, processes & devices on design flows, tools, and tool interoperability. Emerging EDA standards. EDA design methodologies and tools that address issues which impact the quality of the realization of designs into physical integrated circuits. IP modeling and abstraction. Design and maintenance of technology independent hard and soft IP blocks. Methods and tools for analysis, comparison and qualification of libraries and hard IP blocks. Challenges and solutions of the integration, testing, qualifying, and manufacturing of IP blocks from multiple vendors. Third party testing of IP blocks. Risk management of IP reuse. IP authoring tools and methodologies.
Robust & Power-conscious Devices, Interconnects, and Circuits (PCC)

Power grid design, analysis and optimization; timing analysis and optimization; thermal analysis and design techniques for thermal management. Power-conscious design methodologies and tools; low power devices, circuits and systems; power-aware computing and communication; system-level power optimization and management. Design techniques for leakage current management.
Emerging/Innovative Process & Device Technologies and Design Issues (EDT)

Emerging processes & device technologies and implications on IC design with respect to design’s time to market, yield, reliability, and quality. Emerging issues in DSM CMOS: e.g. sub-threshold leakage, gate leakage, technology road mapping and technology extrapolation techniques. New and novel technologies such as SOI, Double-Gate (DG)-MOSFET, Gate-All-Around (GAA)-MOSFET, Vertical-MOSFET, strained CMOS, high-bandwidth metallization, 3D integrated circuits, nanodevices, etc.
Package - Design Interactions & Co-Design (PDI)

Concurrent circuit, package, and PCB/PWB design and effect on quality. EDA tools and methodologies dealing with the IC Packaging electrical and thermal modeling and simulation for improved quality of product. SoC versus system in a package (SiP): design and technology solutions and tradeoffs; MCM, BGA, Flip Chip, and other innovative packaging techniques for various applications such as mixed-signal and RFIC.
Design of Reliable Circuits and Systems (DFR)

Device and process reliability issues and effect on design of reliable circuits and systems. ESD design for digital, mixed signal and RF applications. Exploration of critical factors such as noise, substrate coupling, cross-talk and power supply noise. Significance and trends in process reliability effects such as gate oxide integrity, electromigration, ESD, etc., and their relation to electronic design.
System-level Design, Methodologies & Tools (SDM)

Emerging system-level design paradigms, methods and tools aiming at quality. ESL design process and flow management. System-level design modeling, analysis, synthesis, estimation and verification for correct high-quality hardware/software systems. Development of reliable, responsive, secure, manufacturable, and defect-tolerant systems. New concepts, methods and tools addressing the hardware and system design complexity, multitude of aspects, manufacturability, and usage of technology information and manufacturing feedback in the system-, RTL- and logic level design. The influence of the nanometer technologies’ issues on the system-, RTL- and logic-level design. System-level trade-off analysis and multi-objective (yield, power, delay, area …) optimization. Effective and efficient development, implementation, analysis and validation of large SoCs integrating IP blocks from multiple vendors. Global, social, and economical implications of Electronic System and Design Quality. Emerging standards and regulations influencing system quality.
Submission of Papers

Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 8 pages). To permit a blind review, do not include name(s) or affiliation(s) of the author(s) on the manuscript and abstract. Submit your papers using the on-line paper submission procedure available in the ISQED web site. Please check the as-printed appearance of your paper before submitting the paper. The guidelines for the paper format is provided in this website (see below). Use the on-line paper submission procedure by clicking the following link: ON-LINE. If you have problem accessing the paper submission site it is located at: https://www.softconf.com/a/isqed2011