2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
Conference Date: Oct. 27 - 30, 2026
Conference Venue: Hangzhou, China
Conference Website: http://www.icsict.org

1. About Conference
2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held on Oct. 27 - 30, 2026 in Hangzhou, China. All aspects of solid-state digital IC & system level design, analog, devices, process technologies and other related research are within the scope of the conference. Over the course of four days, a rich program of contributed and invited presentations will cover the latest advancements in various fields. These presentations will be delivered through both oral and poster sessions, accompanied by panel discussions addressing cutting-edge technology issues and various engaging activities. This comprehensive program aims to foster extensive opportunities for the exchange of technical information and create a stimulating atmosphere for mutual communication among all participants. The presentation of the Excellent Student Paper Award and the Outstanding Young Scholar Paper Award will take place during the conference's closing ceremony. Enterprises with relevance to the event are encouraged to join and actively take part in the exhibition.

2.
■ Co-sponsored by
IEEE China Council, IEEE Beijing Section, Sichuan Institute of Electronics, Wuhan University of Technology

■ Technically Co-sponsored by
IEEE Nanjing Section, Zhejiang University, Fudan University

■ Hosted by
Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China

■ Patrons
Beijing University, IEEE Microwave Theory & Technology Society Hangzhou Chapter

3. Committee
■ Life Honorary Chair
Yangyuan Wang, Peking University, China

■ Advisory Committee Co-Chairs
Ting-Ao Tang, Fudan University, China
Cor Claeys, Proximus, Belgium
Mengqi Zhou, IEEE China Council, China

■ General Chairs
Jan Van der Spiegel, University of Pennsylvania, USA
Bin Zhao, IEEE EDS, USA
Francois Rivet, University of Bordeaux, France
Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

■ General Co-Chairs
Ning Xu, Wuhan University of Technology, China
Cheng Zhuo, Zhejiang University, China
Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Gaofeng Wang, Hangzhou Dianzi University, China

■ Technical Program Committee Chairs
Haruo Kobayashi, Gunma University, Japan
Ming Li, Peking University, China
Bo Zhang, University of Electronic Science and Technology of China, China
Yi Zhao, East China Normal University, China

■ Technical Program Committee Co-Chairs
Bei Yu, The Chinese University of Hong Kong, China
Zheng Wang, University of Electronic Science and Technology of China, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia
Ling Zhang, Zhejiang University, China
Chaoyu Yang, Peking University, China
Jing Jin, Shanghai Jiao Tong University, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Haifeng Ling, Nanjing University of Posts and Telecommunications, China

■ Local Arrangement Chair
Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

■ Subcommittee Chairs
Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Jing Jin, Shanghai Jiao Tong University, China
Chaoyu Yang, Peking University, China

■ Subcommittee Co-Chairs
Hailong Jiao, Peking University, China
Zheng Wang, University of Electronic Science and Technology of China, China
Jin Wei, Peking University, China
Zhihao Yu, Nanjing University of Posts and Telecommunications, China

■ Special Session Chair
Haimeng Huang, University of Electronic Science and Technology of China, China

■ Tutorial Chair
Wei Mao, Xidian University, China

■ Industry Liaison Chairs
Sylvain Eimer, Truth Equipment, China
Preet Yadav, NXP Semiconductors, India

■ Publicity Co-Chairs
Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

■ Publication Committee Chair
Mengqi Zhou, IEEE China Council, China

■ Publication Committee Co-chairs
Lobna A. Said, Nile University, Egypt
Guoqing Deng, Sichuan Institute of Electronics, China

■ Treasurer
Jianhong Zhou, Xihua University, China

■ Secretary General
Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

4. Technical Program Committee

Teme 1: Digital & System Level IC
Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China

■ Track 1: Digital Architectures & Systems
Chair:
Zhiyi Yu, Sun Yat-sen University, China
Co-Chairs:
Yaoyu Tao, Peking University, China
Hongyang Jia, Tsinghua University, China

■ Track 2: Digital Circuits
Chair:
Yongpan Liu, Tsinghua University, China
Co-Chairs:
Yanan Sun, Shanghai Jiao Tong University, China
Fengbin Tu, Hong Kong University of Science and Technology, China

■ Track 3: Design Methodology & EDA
Chair:
Jun Yang, Southeast University, China
Co-Chairs:
Yibo Lin, Peking University, China
Yu Li, Zhejiang University, China

Teme 2: Analog
Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China

■ Track 4: RF & Wireless
Chair:
Keping Wang, Tianjin University, China
Co-Chairs:
Jian Pang, Shanghai Jiao Tong University, China
Kai Tang, Hunan University, China

■ Track 5: Wireline
Chair:
Xiaoyan Gui, Xi'an Jiaotong University, China
Co-Chairs:
Bingyi Ye, East China Normal University, China
Yuekang Guo, Shanghai Jiao Tong University, China

■ Track 6: General Analog
Chair:
Lin Cheng, University of Science and Technology of China, China
Co-Chairs:
Junmin Jiang, Southern University of Science and Technology, China
Ang Hu, Huazhong University of Science and Technology, China

Teme 3: Devices
Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair: Jin Wei, Peking University, China

■ Track 7: CMOS Logic Devices & Sensors
Chair:
Heng Wu, Peking University, China
Co-Chairs:
Wang Kang, Beihang University, China
Xiaosheng Zhang, University of Electronic Science and Technology of China, China

■ Track 8: Power Devices & Power IC
Chair:
Long Zhang, Southeast University, China
Co-Chairs:
Jiafei Yao, Nanjing University of Posts and Telecommunications, China
Zekun Zhou, University of Electronic Science and Technology of China, China

■ Track 9: Device Reliability & Security
Chair:
Mengyuan Hua, Southern University of Science and Technology, China
Co-Chairs:
Junmin Jiang, Southern University of Science and Technology, China
Zhao Qi, University of Electronic Science and Technology of China, China

Teme 4: Process & Technologies
Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China

■ Track 10: Semiconductor Process Technologies
Chair:
Bobo Tian, East China Normal University, China
Co-Chairs:
Min Liao, Xidian University, China
Li Zhu, Nanjing University of Posts and Telecommunications, China

■ Track 11: Optoelectronics and Silicon Photonics Integration
Chair:
Linfeng Sun, Beijing Institute of Technology, China
Co-Chairs:
Ming Xu, Huazhong University of Science and Technology, China
Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

■ Track 12: Packaging Technologies
Chair:
Jun Zhang, Nanjing University of Posts and Telecommunications, China
Co-Chairs:
Shenyang Mo, NARI Semiconductor R&D Center, China
Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

5. Conference Scope
The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas)

Theme 1: Digital Architectures & Systems
■ Track 1：Digital Integrated Circuits & Systems
FPGA Circuits Design & Application
Processors, Accelerators & SoCs
Memory System & Process in Memory
System Level Testability & Reliability

■ Track 2：Digital Circuits
Digital Blocks
Logical/Physical-Level Security
Non-volatile Memory & Volatile Memory
Circuit Level Reliability Design

■ Track 3：Design Methodology & EDA
Design for Testability, Reliability & Manufacturability
Modeling，Simulation & Emulation
Design & Technology Co-Optimization
Artificial Intelligence Algorithms for EDA

Theme 2: Analog
■ Track 4：RF & Wireless
Building Blocks at RF, mm-wave and THz
Rx, Tx or TRx for Wireless Systems
Wireless Sensor, Radar, Imager
Device/Packaging/Modeling at RF, mm-wave and THz

■ Track 5：Wireline
Electrical/Optical Transmitters/Receivers for Wireline
Clock Generation and Distribution Circuits
Building Blocks for High-Speed Wireline Communications

■ Track 6：General Analog
Advanced Analog Circuits
High-Speed, High-Precision Data Converters
Imagers, Medical Devices & Display Systems
Efficient Power Management Circuits

Theme 3: Devices
■ Track 7：CMOS Logic Devices & Sensors
Advanced CMOS Logic Devices
2D & Thin Film Devices & Technologies
Flash & Non-Volatile & 3D Memory Technologies
Sensor, Sensing Microsystem, MEMS, and Bioelectronics
Smart/Intelligent Sensors & Actuators
Device Modeling & Simulation

■ Track 8：Power Devices & Power IC
Silicon-based Power Devices
Wide Bandgap Power Devices
Power Integrated Circuits、modules & Systems
Power Integrating & Packaging Technology
Power Device Reliability
Power Device Modeling & Simulation

■ Track 9：Device Reliability & Security
Back-End of Line Reliability & ESD
Aging & Remaining Useful Lifetime Prediction
PUF & Hardware Security
Devices Radiation Reliability

Theme 4: Process & Technologies
■ Track 10：Semiconductor Process Technologies
Compound Semiconductor Materials & Technologies
Advanced Memory Materials & Technologies
Advanced Process Technologies
Advanced Interconnect Technologies
Process Modeling & Simulation

■ Track 11：Optoelectronics and Silicon Photonics Integration
High-Speed Optoelectronic Devices
Silicon Photonics & Integration
Photonic Sensors & Image Sensors
Optical Computing Devices
Display Process & Integration

■ Track 12：Packaging Technologies
2.5D & 3D Integration
Heterogeneous Integration Packaging
Advanced Wire Bonding Technology
Modeling and Simulation for Advanced Packaging
Testing and Reliability in Advanced Packaging

6. Paper Submission
Prospective authors are requested to submit at least 3 pages camera-ready full length paper in English. Accepted papers will be included in conference proceedings.
■ On-line submission at http://www.icsict.org
■ Download the Paper Template through https://www.icsict.org/ICSICT_Paper_Template.docx
■ Important Dates
Deadline for Full-Length Paper Submission: June 25, 2026
Notification of Acceptance: July 25, 2026

7. Call for Special Sessions
The ICSICT 2026 organizing committee invites proposals for special sessions to complement the regular program with emerging topics of interest, featuring state-of-the-art research from academia and industry.
■ Submission Deadline: February 1, 2026
■ Submit Proposal to: ieeeicsict@outlook.com
■ Download Proposal Template through https://www.icsict.org/ICSICT_2026_Special_Session_Proposal_Template.docx

8. Contact Us
Conference Secretary: Ms. Joyce
Phone: +86-186 282 638 76
Email:icsict2026@csj.uestc.edu.cn | ieeeicsict@outlook.com