********* ICPP '25: 54th International Conference on Parallel Processing **********
In cooperation with ACM SIGHPC
September 8-11, 2025
Catamaran Resort, San Diego, CA
https://icpp2025.sdsc.edu

============================
CALL FOR PAPERS AND POSTERS
============================


https://icpp2025.sdsc.edu/

The International Conference on Parallel Processing (ICPP) is one of the oldest continuously running computer science conferences in parallel computing in the world. It is a premier forum for researchers, scientists, and practitioners in academia, industry, and government to present their latest research findings in all aspects of the field.

The conference theme this year is “Looking Ahead in a Changing Landscape”, highlighting the opportunities and changes taking place under the influence of AI and quantum computing and creating collaborative opportunities within our multidisciplinary community.

ICPP 2025 will be organized around eight tracks which includes System Architecture & Hardware Components, Programming Environments & System Software, Multidisciplinary, Algorithms, Performance, Application & Use cases, AI in Computing and Quantum Computing.

## Important Dates
Workshop proposal submissions: March 17, 2025
Workshop proposal notifications: March 24, 2025
Poster submissions: June 30, 2025
Poster notifications: July 15, 2025

Paper Submission: Apr. 21, 2024
Author Notification: June 10th, 2024
Camera-ready Deadline: July 10th, 2024
Conference: September 8-11, 2025



## Paper Submissions
Paper length should be no more than 10 pages (including references) in the ACM SigConf format located at: https://www.acm.org/publications/proceedings-template

## Poster Submission
Extended abstract length should be no more than 2 pages (including references) using ACM format from https://www.acm.org/publications/proceedings-template

## Submission link
All submissions should be made at https://ssl.linklings.net/conferences/icpp/

## Main Tracks
System Architecture & Hardware Components: Parallel Computer Architecture and Accelerator Designs, Large-Scale System Architectures, Datacenter/Warehouse Computing Architecture, Machine Learning Architectures, Micro-Architecture for Parallel Computing, Architectural Support for Networking, New Memory and Storage Technologies, Near-Memory Computing, Parallel I/O, Architectures for Edge Computing, Post-Moore, Architectural Support for Reliability and Security.

Programming Environments & System Software: Software: System Software, Middleware, Runtimes for parallel computing, Parallel and Distributed Programming Languages & Models, Programming Systems, Compilers, Libraries, Programming Infrastructures and Tools, Operating and Real-Time Systems.

Multidisciplinary: Multidisciplinary: Innovation combining multiple disciplines, Converged HPC Cloud Edge computing, Complex Workflows, Methodologies for Performance Portability and/or Productivity across Architectures.

Algorithms: Parallel and Distributed Algorithms, Parallel and Distributed Combinatorial & Numerical Methods, Scheduling Algorithms for Parallel and Distributed Applications and Platforms, Algorithmic Innovations for Parallel and Distributed Machine Learning, Post-Moore parallel algorithms.

Performance: Performance: Performance Modeling of Parallel or Distributed Computing, Performance Evaluation of Parallel or Distributed Systems; Scalability, Simulation Models, Analytical Models, Measurement-Based Evaluation.

Applications & Use Cases: Parallel, Distributed and Accelerated Applications, Scalable Data Analytics & Applied Machine Learning, Computational and Data-Driven Science & Engineering in computational sciences including, but not limited to Astrophysics, Computational Chemistry and Physics, Life Sciences, Earth Science, Materials Science, Finance, Geology and Engineering.

AI in Computing: AI for Application & Use Case, AI for System Architecture & Hardware Components, AI for Multidisciplinary, AI for Performance and AI for Programming Environments & Systems Software

Quantum Computing: parallel simulators of quantum computers, use of parallel computing for quantum compilation and optimization, co-design of parallel- and quantum-computing applications, hybrid parallel/quantum software-development tools.

## ORGANIZATION AND PROGRAM COMMITTEES

## GENERAL CHAIR
Ilkay Altintas, San Diego Supercomputer Center, UC San Diego, USA

## PROGRAM CO-CHAIRS
Sunita Chandrasekaran, University of Delaware
Sameer Shende, University of Oregon

## PROGRAM TRACKS

System Architecture & Hardware Components
Dong Dai, University of Delaware, USA
John Shalf, Lawrence Berkeley National Laboratory, USA

Programming Environments & System Software
Hartwig Anzt, TU Munich, Germany
Ivy Peng, Lawrence Livermore National Lab, USA

Multidisciplinary
Gokcen Kestor, Barcelona Supercomputing Center, Spain
Hari Sundar, University of Utah, USA

Algorithms
Kengo Nakajima, RIKEN, Japan
Sanjukta Bhowmick - University of North Texas, USA

Performance
Ana Gainaru, Oak Ridge National Laboratory, USA
Keichi Takahashi, Osaka University, Japan

Application & Use cases
Meifeng Lin, Brookhaven National Laboratory, USA
Maciej Cytowski, Pawsey Supercomputing Center, Australia

AI in Computing
Min Si, Meta, USA
Pedro Lara Valero, Oak Ridge National Laboratory, USA

Quantum Computing
Scott Pakin, Los Alamos National Laboratory, USA
Anastasiia Butko, Lawrence Berkeley National Laboratory, USA


## POSTER CHAIRS
Rafael Ferreira Da Silva, Oak Ridge National Laboratory, USA
Ivona Brandic, TU Wien, Austria

## WORKSHOP CHAIRS
Fred Suter (Oak Ridge National Laboratory, Oak Ridge, USA)
Camille Coti (École de Technologie Supérieure, Montréal, Canada)

## PUBLICITY CHAIR
Ioan Raicu, Illinois Tech, USA
Jidong Zhai, Tsinghua University, China
Nicolás Erdödy, Multicore World, New Zealand
Ayesha Afzal, FAU, Germany

## WEB CHAIR
Charles Erwin, SDSC, UC San Diego, USA

## PROCEEDINGS CHAIR
Rosa Filgueira (EPCC, UK)


## STEERING COMMITTEE
Chair: Wuchun Feng, Virginia Tech, USA
Sameer Shende, University of Oregon and ParaTools, USA
Allen D. Malony, University of Oregon and ParaTools, USA
Manish Parashar, University of Utah, USA
Daniel Reed, University of Utah, USA
Taisuke Boku, U. Tsukuba, Japan
Guillaume Pallez, INRIA, France
Emmanuel Jeannot, INRIA, France
Xian-He Sun, Illinois Tech, USA
Rudolf Eigenmann, University of Delaware. USA