posted by user: FUN0524 || 2562 views || tracked by 3 users: [display]

MatDes--EI, Scopus 2020 : 2020 2nd International Workshop on Materials and Design (MatDes 2020)--Scopus and Ei Compendex

FacebookTwitterLinkedInGoogle

Link: http://www.matdes.org/
 
When Mar 26, 2020 - Mar 29, 2020
Where Madrid, Spain
Submission Deadline Feb 10, 2020
Categories    materials   industrial engineering   engineering   design
 

Call For Papers

* *MatDes 2020 alongside 10th ICKEM2020**

2020 2nd International Workshop on Materials and Design (MatDes 2020) --Scopus and Ei Compendex
Website:http://www.matdes.org/
Time:March 26-29, 2020
Place: Madrid, Spain


PROCEEDINGS
Submitted papers will be Peer-Reviewed (Double blind, and conducted by the technical program committee) and the accepted ones will be published in the conference proceedings,
which will be submitted for indexing in Ei Compendex, Scopus, IET etc. major databases.

JOURNAL COOPERATION-SPECIAL ISSUE
Materials & Design (ISSN: 0264-1275)
CiteScore: 6.25
Impact Factor: 5.77
5-Year Impact Factor: 5.83
Source Normalized Impact per Paper (SNIP): 2.43
SCImago Journal Rank (SJR): 1.951

Indexing: SciSearch/Science Citation Index Expanded
SCISEARCH, Materials Science Citation Index, Current Contents/Engineering, Computing & Technology, INSPEC - Physics Abstracts
Metals Abstracts, Cast Metals Journal, Research Alert, Scopus, EI Compendex.


**Committee**
Conference Chair
Prof. Alexander M. Korsunsky, Trinity College, Oxford University, UK

Conference Co-Chair
Prof. Kwang Leong Choy, University College London, UK

Program Chairs
Prof. Marco Casini, Sapienza University of Rome, Italy
Prof. Geoffrey Mitchell, Institute Polytechnic of Leiria, Portugal

Local Chair
Assoc. Prof. Ramirez-Castellanos Julio, Universidad Complutense, Spain


Technical Committee
Prof. Ruda Harry E., University of Toronto, Canada
Prof. Jian Lu, City University of Hong Kong, Hong Kong
Asst. Prof.Hamid Abdolvand, Western University, Canada
Prof. Igor Tsukrov, University of New Hampshire, USA
Prof. Michael Zaiser, Friedrich-Alexander-University Erlangen-Nürnberg, Germany
Dr. Mehran Monavari, Friedrich-Alexander University Erlangen-Nuremberg, Germany
Prof.Wenjun Zhang, City University of Hong Kong, Hong Kong
Prof. Michael Atzmon, University of Michigan, USA
Asst. Prof.Liang Qi, University of Michigan, USA
Assoc. Prof. Alejandro Sosnik, Technion Israel Institute of Technology, Israel
Asst. Prof. Maytal Caspary Toroker, Technion Israel Institute of Technology, Israel
Assoc. Prof. Shlomo Berger, Technion Israel Institute of Technology, Israel
Assoc. Prof. Ichiro Daigo, The University of Tokyo, Japan
Assoc. Prof. Maria Benelmekki, Norwegian University of Science and Technology, Norway
Prof.Gennady Chitov, Laurentian University, Canada
Prof. Mohamed Azzouz, Laurentian University, Canada
Prof. Zhili Zhang, Beijing Jiaotong University, China
For more members, please visit the offical website

*Scope
1. Micro- and nano-scale multi-physics phenomena, and the analysis structure, morphology, and the role of interfaces in relation to design at all scales, e.g. electrochemical energy storage, phase transformation and associated processes
2. Operando and in situ studies of processes and structural evolution
3. Processing of alloys and compounds for microstructure and property control, e.g. friction stir and severe plastic deformation
4. Lightweight materials, e.g. alloys containing magnesium and lithium, as well as composites of all types of matrix (polymer, metal and ceramic) and reinforcement, including continuous and discontinuous fibres, low aspect ratio inclusions and nano-structured reinforcements
5. Multifunctional materials, e.g. alloys, polymers and ceramics displaying shape memory effects, as well as bio-composites, composites of green or sustainable origin, and biomimetic materials
6. Intelligent materials design to optimise performance, including hierarchical microstructural optimisation, self-healing, energy absorption, for durability, against damage and environmental extremes


**Submission**
1. Full paper(publication and presentation)
2. Abstract (presentation)

Submit paper via online system: http://confsys.iconf.org/submission/matdes2020
More detail about submission, please visit at http://www.matdes.org/instructions-for-authors.html

**Contact**
Geely Deng (Conference Secretary)
E-mail: matdes@young.ac.cn

Related Resources

ICSRS--Scopus & EI Compendex 2021   2021 5th International Conference on System Reliability and Safety (ICSRS 2021)--Scopus & EI Compendex
MSF--ICNMM--Scopus, EI Compendex 2021   MSF--2021 4th International Conference on Nanomaterials, Materials and Manufacturing Engineering (ICNMM 2021)--Scopus, EI Compendex
ICRE--EI Compendex, Scopus 2021   2021 5th International Conference on Reliability Engineering (ICRE 2021)--EI Compendex, Scopus
ICCSEA 2020   10th International Conference on Computer Science, Engineering and Applications
ITAS--EI Compendex, Scopus 2021   2021 Information Technology & Applications Symposium (ITAS 2021)--EI Compendex, Scopus
ACM--ICRAI--Ei Compendex and Scopus 2020   ACM--2020 6th International Conference on Robotics and Artificial Intelligence (ICRAI 2020)--EI Compendex, Scopus
CCBD--Ei Compendex & Scopus 2021   2021 The 8th International Conference on Cloud Computing and Big Data (CCBD 2021)--Ei Compendex & Scopus
IEEE--ICIEA(EU)--Ei Compendex, Scopus 2021   IEEE--2021 The 8th International Conference on Industrial Engineering and Applications (Europe)(ICIEA 2021)--Ei Compendex, Scopus
ICFSP--IEEE, Ei, Scopus 2021   IEEE--2021 6th International Conference on Frontiers of Signal Processing (ICFSP 2021)--Ei Compendex, Scopus
ICRE--EI, Scopus 2021   2021 5th International Conference on Reliability Engineering (ICRE 2021)--EI Compendex, Scopus