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ICSMA--SCOPUS, Ei Compendex 2020 : 2020 The 3rd International Conference on Smart Materials Applications (ICSMA 2020)--Ei Compendex, Scopus

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Link: http://www.icsma.org
 
When Jan 13, 2020 - Jan 16, 2020
Where Yonsei University, Seoul, South Korea
Submission Deadline Nov 15, 2019
Categories    materials science   nanotechnology   robotics   mechatronics
 

Call For Papers

2020 The 3rd International Conference on Smart Materials Applications (ICSMA 2020)--Ei Compendex, Scopus

The 3rd International Conference on Smart Materials Applications (ICSMA 2020) will take place in Yonsei University, Seoul, South Korea during January 13-16, 2020.


ICSMA 2020 is co-organized by South Asia Institute of Science and Engineering (SAISE) and Yonsei University, South Korea.


More details, please visit: http://www.icsma.org


Conference Proceedings
All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, which is indexed by Ei Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.


Call for Papers:

Topics of interest for submission include, but are not limited to:

Materials Science and Engineering
Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nano-materials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterials, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials

Materials Properties, Measuring Methods and Applications
Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications

Methodology of Research and Analysis and Modeling
Electron Microscopy, X-ray Phase Analysis, Metallographic, Quantitative Metallographic, Image Analysis, Computer Assistance in the Engineering Tasks and Scientific Research, Numerical Techniques, Statistic Methods, Residual Life Analysis, Process Systems Design, Mould Flow Analysis, Rapid Prototyping, CAM, CAMS, CAQ, Engineering Design, Technological Design, Materials Design, Computational Material Science, Materials and Engineering Databases, Expert Systems, Artificial Intelligence Methods

Materials Manufacturing and Processing
Casting, Powder Metallurgy, Welding, Sintering, Heat Treatment, Thermo-Chemical Treatment, Thin & Thick Coatings, Surface Treatment, Machining, Plastic Forming, Quality Assessment, Automation Engineering Processes, Robotics, Mechatronics, Technological Devices and Equipment, Theoretical Fundamentals of Cleaner Production, Industrial Application of Cleaner Production Methods, Production and Operations Management, Production Planning and Control, Manufacturing Technology Management, Quality Management, Environmental Management, Safety and Health Management, Project Management, Physical Distribution and Logistics Management, Supply Chain Management, Productivity and Performance Management


For more topics, please visit http:http://www.icsma.org/cfp.html

Submission

By Email: icsma@saise.org

By online submission system: http://confsys.iconf.org/submission/icsma2020

Conference Schedule

January 13, 2020 | Monday Participants Registration and Conference Kits Collection

January 14, 2020 | Tuesday Opening Remarks & Keynote Speeches
Oral & Poster Sessions
January 15, 2020 | Wednesday Opening Remarks & Keynote Speeches
Oral & Poster Sessions
January 16, 2020 | Thursday Visit (Pending)


Contact
Ms. Chelsea Wang
Conference Secretary of ICSMA

(1) Via Email: icsma@saise.org

(2) Tel: +852-30717761 (Hong Kong) / +86-18062000004 (China)

(Office Time 9:30 - 18:00, Time zone: GMT+8; Monday to Friday)


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