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COOL Chips 22 2019 : IEEE Symposium on Low-Power and High-Speed Chips and Systems

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Link: http://www.coolchips.org/
 
When Apr 17, 2019 - Apr 19, 2019
Where Yokohama, Japan
Submission Deadline Feb 8, 2019
Notification Due Mar 15, 2019
Final Version Due Mar 29, 2019
Categories    computer architecture   microarchitecture    software   VLSI
 

Call For Papers

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IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 22

Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan)
April 17 - 19, 2019
http://www.coolchips.org

CALL FOR CONTRIBUTIONS
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Important Dates:

* Technical Papers:
- Feb. 8th, 2019: Extended Abstract Submission (through website)
- Mar. 15th, 2019: Acceptance Notified (by e-mail)
- Mar. 29th, 2019: Final Manuscript Submission

* Posters:
- Mar. 22nd, 2019: Poster Abstract Submission (through website)
- Mar. 25th, 2019: Poster Acceptance Notified (by e-mail)

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COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips and systems.
The symposium covers leading-edge technologies in all areas of
microprocessors and their applications. The COOL Chips 22 is to be
held in Yokohama on April 17-19, 2019, and is targeted at the
architecture, design and implementation of chips with special emphasis
on the areas listed below. All papers are published online via IEEE
Xplore. Especially, selected academic papers are strongly invited to
submit to the special section in IEICE Transactions, and selected
commercial papers are for publication in IEEE Micro.

Contributions are solicited in the following areas:

- Low Power-High Performance Processors for AI, IoT, Multimedia,
Digital Consumer Electronics, Mobile, Graphics, Encryption,
Robotics, Automotive, Networking, Medical, Healthcare, and
Biometrics.

- Novel Architectures and Schemes for Single Core, Multi/Many-Core,
NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and 3D Integration.

- Cool Software including Parallel Schedulers, Embedded Real-time
Operating System, Binary Translations, Compiler Issues and Low
Power Application Techniques.

Proposals should consist of a title, an extended abstract (up to 3
pages) describing the product or topic to be presented and the name,
job title, address, phone number, FAX number, and e-mail address of
the presenter. Please prepare the extended abstract using the given
guidelines and template. We will upload author's kit here.

In the extended abstract, the status of the product or topic should
precisely be described. If this is a not-yet-announced product, and
you would like to keep the submission confidential, please indicate
it. We will do our best to maintain confidentiality.

Proposals will be selected by the program committee’s evaluation of
interest to the audience. Submission should be made through submission
site.

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