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COINS 2019 : COINS 2019 Conference: Internet of Things | Artificial Intelligence & ML | Big Data | Blockchain | Edge & Cloud Computing | Security | Embedded Systems | EDA | VLSI


When May 5, 2019 - May 7, 2019
Where Crete, Greece
Submission Deadline Dec 31, 2018
Categories    internet of things   big data   machine learning   security

Call For Papers

In Cooperation with: IEEE and IEEE Council on Electronic Design Automation (IEEE CEDA)

Proceedings: ACM

Best papers: will be published in Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO)

Student Grants: registration grants for highly skilled students


COINS is the premier conference devoted to omni-layer techniques for smart IoT
systems, by identifying new perspectives and highlighting impending research issues
and challenges. COINS main topics include the following but are not limited to:

Track 1: Internet of Things: From Device, to Edge, and Cloud
Track 2: Omni-Layer Security, Privacy, and Trust
Track 3: Omni-layer Reliability in IoT Era
Track 4: VLSI, EDA, Embedded Systems, and Computer Architecture
Track 5: Real-time Systems
Track 6: Alternative and Approximate Computing
Track 7: Cloud Computing
Track 8: Programming Language and Software Engineering
Track 9: Big Data
Track 10: Artificial Intelligence, Machine Learning, Cognitive Computing, and Advanced Analytics
Track 11: Evolutionary Computer Vision, Image Processing and Pattern Recognition
Track 12: Automation Systems
Track 13: Automotive Systems
Track 14: Intelligent IoT eHealth
Track 15: Enterprise Architecture

Special Tracks:

1) The special track “Blockchain and Internet of Things” (

2) The special track “cyber-physical and embedded systems” (

3) The special track “Critical System Design” (

4) The special track “Face Recognition” (

5) The special track “Advanced Stacking Many-core Systemsand Architectures” (

COINS is sponsored by IEEE Council on Electronic Design Automation (CEDA). Moreover, the proceeding will be published in ACM. Accepted papers are allowed six pages in the conference proceedings free of charge. Each additional page beyond six pages is subject to the page charge at 150 Euro per page up to the eight-page limit. ACM will hold the copyright for COINS proceedings. Authors of accepted papers must sign an ACM copyright release form for their paper.

Extended versions of selected best papers will be published in a special issue of the ISI indexed Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO) having the 2016 Impact Factor as high as 1.025

COINS Executive Committee is pleased to announce registration grants for highly skilled students who have an accepted paper. The number of grants is limited, therefore the funding is awarded on a competition basis. We are especially looking forward to applications from the Middle East and Asia.

Conference Board:
Prof. Krishnendu Chakrabarty, Duke University, USA
Prof. Jan M. Rabaey, UC Berkeley, USA
Prof. David Z. Pan, University of Texas at Austin, USA
Prof. Majid Sarrafzadeh, UCLA, USA
Dr.-Ing. Farshad Firouzi, mVISE AG, Germany

General Chairs:
Dr.-Ing. Farshad Firouzi, mVISE AG, Germany
Prof. Krishnendu Chakrabarty, Duke University, USA

Technical Chairs:
Dr. Bahar Farahani, Shahid Beheshti University, Iran
Dr. Fangming Ye, Huawei, USA
Dr. Vasilis Pavlidis, University of Manchester , UK

Local Chair:
Prof. Paris Kitsos, Technological Educational Institute of Western Greece, Greece

Publicity Chair:
Prof. Nicolas Sklavos, University of Patras, Hellas, Greece

Track Chairs:
Prof. Jörg Henkel, KIT, Germany
Prof. Akash Kumar, TU Dresden, Germany
Prof. Davide Brunelli, University of Trento, Italy
Prof. Kostas Siozios, Aristotle University of Thessaloniki, Greece
Prof. Matthias König, FH-Bielefeld University, Germany
Prof. Maria K. Michael, University of Cyprus, Cyprus
Prof. Jiang Li, Shanghai Jiaotong University, China
Prof. Luís Ferreira Pires, University of Twente, Netherlands
Prof. Federica Cena, Universita' di Torino, Italy
Prof. Mehrnoush Shamsfard, SBU, Iran
Prof. Pasi Liljeberg, University of Turku, Finland
Prof. Fereidoon Shams Aliee, SBU, Iran
Dr. Farzad Samie, KIT, Germany

All questions about submissions should be emailed to Dr.-Ing. Farshad Firouzi (

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