posted by user: EMCWA || 1882 views || tracked by 2 users: [display]



When Oct 18, 2010 - Oct 20, 2010
Where Dallas, TX
Submission Deadline Jul 1, 2010
Final Version Due Aug 1, 2010
Categories    automatic coil winding systems   adhesive bonding   balancing methods   many more

Call For Papers

Here's your chance to be part of the 2010 EMCWA Conference. Opportunities are available for individual papers, panel discussions, keynotes, tutorial and workshop sessions.

By participating in the EMCWA 2010 Conference, you can:
• Present a paper
• Share your knowledge
• Network with your peers
• Enhance your industry visibility

Preference will be given to: hands-on success stories... unique projects that you've seen through to completion... technological innovations... industry updates... and solutions to common problems.

Subjects can include:
Adhesive Bonding Dispensing Equipment
Automatic Coil Winding Systems ISO 9000
Balancing Methods Magnet Wires
Coating and Impregnating Motor Components
Cost Saving Tips Motor Design & Assembly Technologies
Computer-Aided Manufacturing

Magnetic Materials Taping Machines
Plastics and Resins Transformers
Quality Control Ultrasonic Bonding
Soldering Tools Wire Stripping

Paper Specifications
Your paper must be original, unpublished, non-commercial and objective. Manuscripts selected for presentation will also be published on the EMCWA 2010 Proceedings Compact Disc. This Disc will be distributed to all EMCWA 2010 Conference attendees. Additional distribution includes EMCWA members, industry representatives, plus universities and libraries throughout the world.

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