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BSN 2010 : Body Sensor Networks


Conference Series : Wearable and Implantable Body Sensor Networks
When Jun 7, 2009 - Jun 9, 2009
Where Singapore
Submission Deadline Jan 31, 2010
Notification Due Mar 15, 2010
Final Version Due Mar 31, 2010

Call For Papers


2010 International Conference on Wearable
and Implantable Body Sensor Networks (BSN 2010)

June 7-9, 2010

Biopolis, Singapore


IMPORTANT DATES (Kindly note the new dates!)
Full paper submission deadline: January 31, 2010
Acceptance/rejection notification: March 15, 2010
Camera-ready version submission deadline: March 31, 2010

Following the successes of 6 annual BSN workshops held at Imperial
College in London (2004, 2005), MIT in Boston (2006), RWTH Aachen
University (2007), Chinese University in Hong Kong (2008) and the
University of California at Berkeley (2009), BSN 2010 will be back
in Asia and held in Singapore.

Body sensor networks (BSN) technology has gained tremendous
international interest in recent years from researchers both in
academia and industry. With the development of innovative
wearable/wireless/implantable biosensors, the applications for
BSNs extend from in-vivo monitoring and intervention to everyday
healthcare, as well as fitness, sport and security. This
conference will address the fast-growing BSN research field,
and offers participants a unique forum to discuss the key
issues and innovative solutions in current BSN research. We
invite submissions of novel, original and unpublished works
in (though not limited to) the following areas:

- Networking, security and wireless communications
- Smart fabrics and wearables
- Lower power electronics, power sources and energy harvesting
- BSN architecture and platforms
- Hardware and software development environments for BSN
- Medical applications
- Sport and leisure applications
- Sensor technology and biocompatibility
- Home monitoring and assisted living applications
- Debugging, and testing of BSN platforms and applications
- Clinical trials and experiences of BSN platforms
- Novel BSN platforms and applications in non-medical domains

All submissions must be original, unpublished, and are not under
consideration elsewhere, with the exception of internal technical
reports. Submissions should be no more than 6 pages formatted to
the two-column IEEE conference style. Two page poster submissions
are also welcome. All submissions will be subjected to a rigorous
double-blind peer-review process. Authors must take special care
not to reveal their identities. For accepted papers, at least one
of the authors (with no double-counting allowed) must register for
the conference by the early registration deadline in order for the
paper to be included in the conference and its proceedings.


Steering Committee
Paolo Bonato, Harvard Medical School, U.S.A.
Thomas Falck, Philips Research Aachen, Germany
Steffen Leonhardt, RWTH Aachen University, Germany
Joseph Paradiso, MIT, U.S.A.
Paul Wright, UC Berkeley, U.S.A.
Guang-Zhong Yang, Imperial College London, U.K.
Eric Yeatman, Imperial College London, U.K.
Yuan-Ting Zhang, Chinese University of Hong Kong, China

General Chair
Keck Voon Ling, Nanyang Technological University, Singapore

Technical Program Chair
Weng-Fai Wong, National University of Singapore, Singapore

Technical Program Committee
Rajesh Krishna Balan, Singapore Management University, Singapore
Daniel Berckmans, K.U. Leuven, Belgium
Dinesh Bhatia, UT Dallas, U.S.A.
Gert Cauwenberghs, UC San Diego, U.S.A.
Samarjit Chakraborty, Technical University of Munich, Germany
Mun Choon Chan, National University of Singapore, Singapore
Dermot Diamond, Dublin City University, Ireland
Scott Drawer, UK Sport, U.K.
Mongkol Ekpanyapong, Asian Institute of Technology, Thailand
Sandeep Gupta, Arizona State University, U.S.A
Jörg Habetha, Philips, The Netherlands
Yang Hao, Queen Mary University of London, U.K.
Roozbeh Jafari, UT Dallas, U.S.A.
Emil Jovanov, University of Alabama in Huntsville, U.S.A.
Bill Kaiser, UCLA, U.S.A.
John Lach, University of Virginia, U.S.A.
Insup Lee, University of Pennsylvania, U.S.A.
Hock Beng Lim, Nanyang Technological University, Singapore
Thomas Lindh, KTH, Sweden
Torsten Linz, Fraunhofer IZM, Germany
Benny Lo, Imperial College London, U.K.
Paul Lukowicz, Universität Passau, Germany
Mehul Motani, National University of Singapore, Singapore
Paul Mitcheson, Imperial College London, U.K.
Majid Sarrafzadeh, UCLA, U.S.A.
Alireza Seyedi, University of Rochester, U.S.A.
Chi-Sheng Shih, National Tsinghua University, Taiwan
Morris Sloman, Imperial College London, U.K.
Toshiyo Tamura, Chiba University, Japan
Surapa Thiemjarus, Sirindhorn Intl Institute of Technology, Thailand
Lorenzo Turicchia, MIT, U.S.A.
Nalini Venkatasubramanian, UC Irvine, U.S.A.
René Vieroth, Fraunhofer IZM, Germany
Lei Wang, Chinese Academy of Sciences, China
Andy West, University of Loughborough, U.K.
Lawrence Wong, National University of Singapore, Singapore
Winson Zhu, Shanghai Jiaotong University, China

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