posted by user: seblopez || 4834 views || tracked by 8 users: [display]



Conference Series : Digital Systems Design
When Sep 1, 2010 - Sep 3, 2010
Where Lille, France
Submission Deadline Mar 15, 2010
Notification Due Apr 26, 2010
Final Version Due May 31, 2010
Categories    system and circuit synthesis   systems-on-a-chip and networks   programmable/re-configurable/a   applications of (embedded) dig

Call For Papers

Architectures, Methods and Tools
Polytech'Lille, Lille, 1st-3rd September, 2010


- Special sessions proposals: January 14th, 2010
- Submission of papers: March 15th, 2010
- Notification of acceptance: April 26th, 2010
- Camera ready papers: May 31st, 2010


The Euromicro Conference on Digital System Design (DSD) addresses all aspects of digital system design from embedded and mixed hardware/software system engineering, down to microarchitectures, digital circuits and VLSI techniques. It focuses on advanced circuit and system design and design automation concepts, paradigms, methods and tools, as well as on modern implementation technologies from full custom in nanometer technology nodes to FPGA and to multicore infrastructures. Compiler assisted ASIP, CMP, SMP, SMT, DSP-VLIW, GPU and platform based system design research results are welcome. Design and Verification Languages and Standards, Modeling, High Level Synthesis, Productive Design Technology and Engineering Flows, Efficiency, Density, Signal Integrity, Testability, Timing Analysis and Timing Closure, Power Consumption, Computational Power Speed and Performance, Manufacturability, Cost, Reliability, Error Resilience, Complexity, or Process Variability issues are covered in DSD.

CPS, Conference Publishing Services, publishes the DSD Proceedings which are available worldwide through the IEEE Xplore Digital Library. An extended version of the best papers will be published in a special issue of the ISI-indexed "Microprocessors and Microsystems: Embedded Hardware Design" journal, printed by Elsevier.


T1: (SCS) System and circuit synthesis: high-level, behavioral, register-transfer, logic and physical circuit synthesis; arithmetic, signal processing and vector processing units; graphics processing units and hardware accelerators; memory design; communication architecture and protocols; specific circuits and processors; multi-objective optimization observing power, performance, communication traffic, interconnect architecture, layout, technology, reliability, robustness, security, testability and other issues; management of parallel computational resources, memory allocation and hierarchy; hardware/software co-design; mapping of applications to architectures; algorithm architecture matching; transaction level modeling and higher-level modeling; virtual system prototyping; design space exploration; synthesis of asynchronous and dataflow driven systems.

T2: (SoC & NoC) Systems-on-a-chip and networks-on-a-chip: multiprocessor systems-on-a-chip (MPSoC), generic system platforms and platform-based design; CMP, SMP, SMT, DSP and VLIW (multi)processor architecture and enhancements; 3D MPSoCs; software design and programming models for multicore platforms; GPUs; cell-based platforms; NoC architectural issues, quality of service in NoCs; 3D NoCs; power dissipation and energy issues in SoCs and NoCs; IP design, standardization and reuse; virtual components; system on a system; compiler assisted MPSoC; hardware support for embedded kernels; embedded software features; static, run-time and dynamic optimizations of embedded systems.

T3: (RC) Programmable/re-configurable/adaptable architectures: design methodologies and tools for reconfigurable computing, run-time, partial and dynamic reconfigurability; fine-grained, mixed-grained and coarse-grained reconfigurable architectures; reconfigurable interconnections and NoCs; FPGAs; systems on re-configurable chip; system FPGAs and structured ASICs and co-processors; processing arrays; programmable fabrics; novel logic block architectures, combination of FPGA fabric and system blocks (DSP, processors, memories, etc.); adaptive computing devices, systems and software; optimization of FPGA-based cores; novel design algorithms for FPGA features; CAD for placement, routing, retiming, logic optimization, technology mapping, system-level partitioning, logic generators, testing and verification; CAD for modeling, analysis and optimization of timing and power; high-level models and tools for FPGAs; rapid prototyping systems and platforms.

T4: (SMVT) System, hardware and embedded-software specification, modeling, verification and test: design and verification languages; functional, structural and parametric specification and modeling; simulation, emulation, prototyping, and testing at the system, register-transfer, logic and physical levels; co-simulation and co-verification.

T5 (APP): Applications of (embedded) digital systems with emphasis on design challenges posed by demanding and new applications in fields such as: (wireless) communication and networking; measurement and control; health-care and medicine; military, space, avionics and automotive systems; surveillance and security; networked and electronic media; multimedia design; image and video processing; real time signal processing hardware; digital video technology; consumer electronics; ambient intelligence; wireless sensor networks; ubiquitous, wearable and implanted systems; automotive; environmental; transportation and traffic control.

T6 (ET): Important issues introduced by emerging technologies (e.g. nanometer CMOS and beyond CMOS technologies, 3D integration, optical, etc) for the circuit and system design, and design methods and EDA tools for solving these issues.


DSD 2010 will include special sessions focused on hot topics and emerging fields of interest to the digital systems design research community. Proposals for special sessions must include a title, contact information for the session chair(s), and a list of authors who have been or will be contacted to present papers if the session is accepted. Proposals for special sessions should be submitted to the Program Chair ( before January 14th, 2010.


Regular Papers:
Prospective authors are encouraged to submit their manuscripts for review electronically trough the following web page ( or by sending the paper to the Program Chair via email (, only if an unexpected web access problem is encountered) before the deadline for submission. Each manuscript should include the complete paper text, all illustrations, and references. The manuscript should conform to the required IEEE format: single-spaced, double column, A4/US letter page size, 10-point size Times Roman font, up to 8 pages. In order to conduct a blind review, no indication of the authors' names should appear in the submitted manuscript, references included.

Case Studies and Application Papers: Submissions can be made which report on state-of-the-art digital systems, digital designs, architectures, design methods and/or tools, and (embedded) applications. Papers discussing lessons learned from practical experience, demanding or new applications, and experimental research are particularly encouraged. Manuscripts may be submitted in the same way as regular papers.

The Program Committee will decide if papers will be accepted for a long presentation (30 minutes), short presentation (15 minutes) or as a poster. For long and short presentations, 8 pages will be assigned in the published proceedings. A poster presentation will be assigned 4 pages. Papers exceeding the page limit will be charged 50 Euro per page in excess. If the paper is accepted, at least one of the authors must pre-register and pay the conference fee before the deadline for submitting the camera-ready paper. Otherwise the paper will not be published in the proceedings.


Chairman: Lech Józwiak, Eindhoven U. of Tech. (NL)
Krzysztof Kuchcinski, Lund U. (SE)
Antonio Nunez, IUMA/U. of Las Palmas GC (ES)

Henri Basson, U. of Lille North of France, Littoral, (FR)
Smail Niar, U. of Lille North of France, Valenciennes, (FR)

Program Chairman: Sebastian Lopez, IUMA/U. of Las Palmas GC (ES)
Deputy Program Chairman: Paris Kitsos, Hellenic Open Univ. (GR)


A. Akkas, Koc U., (TK)
A. Lastovetsky, University College Dublin, (IR)
A. Nunez, IUMA/U. of Las Palmas G.C., (ES)
A. Orailoglu, U. of California, San Diego, (US)
A. Pawlak, ITE & SUT, (PL)
A. Postula, U. of Queensland, (AU)
A. Shrivastava, Arizona State U., (US)
B. de Sutter, U. of Ghent, (BE)
B. Juurlink, TU Delft, (NL)
C. Bouganis, Imperial College, (UK)
C. Cornelius, U. of Rostock, (DE)
C. Wolinski, IRISA, Rennes, (FR)
D. Houzet, Grenoble Institute of Technology, (FR)
D. Quaglia, U. of Verona, (IT)
E. Martins, U. of Aveiro, (PT)
F. Leporati, U. of Pavia, (IT)
G. Danese, U. Of Pavia, (IT)
H. Basson, U. of Littoral, (FR)
H. Kubatova, CTU Prague, (CZ)
H.T. Vierhaus, Brandenburg U. of Tech., (DE)
J. Rabaey, U. of California, Berkeley, (US)
J. Sahuquillo, Pol. U. of Valencia, (ES)
J. Tiberghien, U. Libre de Bruxelles, (BE)
J.L. Dekeyser, U. of Lille, (FR)
J.S. Matos, U. of Porto, (PT)
K.Kent, U. of New Brunswick, (CA)
K. Kuchcinski, Lund U., (SE)
K. Popovici, Mathworks Inc., (US)
L. Benini, U. of Bologna, (IT)
L. Fanucci, U. of Pisa, (IT)
L. Józwiak, Eindh. U. of Tech., (NL)
L. Sousa, U. of Lisboa, (PT)
L.-G. Chen, National Taiwan U., (TW)
M. Figueroa, U. of Concepcion, (CL)
M. Perkowski, Portland St. U., (US)
M. Valero, Pol. U. of Catalunya, (ES)
M. Velev, Aries Design Automation, (US)
N. Bergmann, U. of Queensland, (AU)
N. Dutt, U. of Calif., Irvine, (US)
N. Nedjah, State U. of Rio de Janeiro, (BR)
N. Sklavos, Tech. Inst. Patras, (GR)
O. Koufopavlou, U. Patras, (GR)
P. Athanas, Virginia Tech, (US)
P. Carballo, IUMA/U. of Las Palmas GC, (ES)
P. Kitsos, Hellenic Open U., (GR)
P. Schumacher, Xilinx Inc., (US)
R. Drechsler, U. of Bremen, (DE)
R. Ubar, Tallinn Tech. U., (EE)
S. Kumar, Jonkoping U., (SE)
S. Lopez, IUMA/U. of Las Palmas G.C., (ES)
S. Niar, U. Valenciennes, (FR)
S. Vitabile, U. of Palermo, (IT)
T. El-Ghazawi, George Washington U., (US)
T. Luba, Warsaw U. of Tech., (PL)
T. Sasao, Kyushu Ins. of Tech., (JP)
V. Muthukumar, U. of Nevada Las Vegas, (US)
W. Luk, Imperial College, (UK)
W. Stechele, Technical U. Munich, (DE)
Z. Kotasek, Brno U. of Tech., (CZ)

DSD permanent homepage is at:
US mirror:
Euromicro homepage is at:

Related Resources

DSD 2022   25th Euromicro Conference on Digital System Design
CoMSE 2023   2023 International Conference on Materials Science and Engineering (CoMSE 2023)
IEEE CCNC STP-CPS 2023   5th International Workshop on Security Trust Privacy for Cyber-Physical Systems (STP-CPS'23) with IEEE CCNC 2023, 8-11 January, Las Vegas, NV, USA
CFDSP 2023   2023 International Conference on Frontiers of Digital Signal Processing (CFDSP 2023)
PLDI 2023   The 44th ACM SIGPLAN Conference on Programming Language Design and Implementation
EAI TRIDENTCOM 2022   17th EAI International Conference on Tools for Design, Implementation and Verification of Emerging Information Technologies
DARCH NOVEMBER 2022   3rd International Conference on Architecture and Design
AI-DH 2022   MDPI Big Data and Cognitive Computing - Special Issue on Artificial Intelligence in Digital Humanities
EICC 2023   European Interdisciplinary Cybersecurity Conference (EICC 2023)
evoMUSART 2023   12th International Conference on Artificial Intelligence in Music, Sound, Art and Design