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EI--MEAMT2019 2019 : 2019 3rd International Conference on Material Engineering and Advanced Manufacturing Technology(MEAMT 2019)

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Link: http://www.meamt.org/
 
When Apr 26, 2019 - Apr 28, 2019
Where Shanghai, China
Submission Deadline Feb 28, 2019
Notification Due Feb 28, 2019
Final Version Due Feb 28, 2019
Categories    material engineering   material engineering
 

Call For Papers

★2019 3rd International Conference on Material Engineering and Advanced Manufacturing Technology(MEAMT 2019)
April 26-28, 2019. |Shanghai, China|http://www.meamt.org/

★The conference aims to provide a forum for many of the leading researchers, scientists and engineers from across the field of Material Engineering and Advanced Manufacturing Technology. We welcome you to join us this year for a program that includes keynote speakers, oral presentations and poster sessions. Join others in the scientific community by presenting your research through submitting papers for evaluation. MEAMT 2019 promises to be a key opportunity to create new business relationships, learn about cutting edge research and find global partners for future projects.

★Publication and Indexing
All accepted papers will be published in the digital conference proceedings which will be sent to be Indexed by all major citation databases such as Ei Compendex, SCOPUS, Google Scholar, Cambridge Scientific Abstracts (CSA), Inspec, SCImago Journal & Country Rank (SJR), EBSCO, CrossRef, Thomson Reuters (WoS), etc.
A selection of papers will be recommended to be published in international journals.

★Program Preview/ Program at a glance
April. 26, 2019: Registration + Icebreaker Reception
April. 27, 2019: Opening Ceremony+ KN Speech+ Technical Sessions
April. 28, 2019: Technical Sessions+ Half day tour/Lab tours

★Paper Submission
1.PDF version submit via CMT: https://cmt3.research.microsoft.com/MEAMT2019
2.Submit Via email directly to: meamt@iased.org

★CONTACT US
Ms. Yedda Q.Ye
Email: meamt@iased.org
Website:http://www.meamt.org/

Call for papers(http://www.meamt.org/cfp.html):

Materials Science and Engineering
•Materials behavior
•Casting and solidification
•Powder metallurgy and ceramic forming
•Surface, subsurface, and interface phenomena
•Coatings and surface engineering
•Composite materials
•Materials forming
•Machining
•Nanomaterials and nanomanufacturing
•Biomedical manufacturing
•Environmentally sustainable manufacturing processes and systems
•Manufacturing process planning and scheduling
•Meso/micro manufacturing equipment and processes
•Modeling, analysis, and simulation of manufacturing processes
•Computer-aided design, manufacturing, and engineering
•Semiconductor materials manufacturing
•Laser based manufacturing
•Precision molding processes
•Joining processes
•Rapid manufacturing technologies
•Nontraditional manufacturing
•Nanofabrication, nanometrology and applications
•Metrology and measurement
•Mechanical and Electronic Engineering Control
•Smart materials: shape memory alloys and polymers, electro and magnetorheological materials, piezoelectrics, ferroelectrics, multiferroics, piezomagnetics, electro and magnetostrictive materials, thermoelectrics, photovoltaics, electro and magnetocaloric materials, electrochromics, electroactive polymers, energy storage materials, self-healing materials and multifunctional materials in general
•Application of smart materials, structures and related technology
•Fundamentals of smart materials
•Intelligent systems, integrated with sensors, actuators and controllers, applied to automation and robotic systems that utilize smart material systems
•Modeling/formulation and characterization of smart actuators, sensors and smart material systems
•Smart material systems that utilize biomimetics and bioinspiration
•Smart materials utilized as sensors and actuators with applications at any scale
•Smart optical materials for modification in spectral shifts and refractive index shift
•Trends and development in composite materials, intelligent hydrogels, interfacial phenomena, phase boundaries and boundary layers of phase boundaries, control, micro- and nano-systems, electronics
•Destructive and non-destructive testing, Microstructural characterization, Failure analysis

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