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DAC 2018 : Design Automation Conference

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Conference Series : Design Automation Conference
 
Link: https://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=18071
 
When Jun 24, 2018 - Jun 28, 2018
Where San Francisco, CA, USA
Submission Deadline TBD
 

Call For Papers

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

Call For Contributions
DAC is accepting submissions for the Research Program, Designer Program, and IP Program on the following topic areas: Automotive, Design, Electronic Design Automation (EDA), Electronic Systems and Software (ESS), the Internet of Things (IoT), IP, Machine Learning/AI, and Security/Privacy.

Research Paper Abstract Submission Deadline: November 14
Research Paper Manuscript Submission Deadline: November 21
View specific Research Paper Submission Categories.

Invited Session Proposals Deadline: November 21
View proposal information for Special Sessions/Invited Presentations, Panels, Workshops, Tutorials, and Colocated Conferences.

Designer Track and IP Track Presentation Submission Deadline: January 23, 2018
View specific Designer Track Submission Categories and IP Track Submission Categories.


Conference Details
Dates
24 Jun - 28 Jun 2018

Location
Moscone Center
San Francisco, CA, USA

Web site
www.dac.com

Contact
Kevin Lepine
1721 Boxelder St Suite 107
Louisville CO USA 80027
+1 303 530 4562
kevin@dac.com
+1 303 530 4334 (fax)

Conference #
18071

Attendance
7000


Please see the conference Web site for full details.
Call for Papers for Conference Authors
Find details for paper and abstract submission.
View call for papers



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