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ITherm 2010 : Special Session - Pulsed and Transient Thermal Systems - ITherm 2010

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Link: http://www.ithermconference.org/
 
When Jun 2, 2010 - Jun 5, 2010
Where Las Vegas, NV, USA
Submission Deadline Sep 30, 2009
Notification Due Oct 15, 2009
Final Version Due Dec 14, 2009
Categories    power electronics   thermal management   pulsed power   electronics
 

Call For Papers

Session Description and Scope:
Recent years have seen a rapid increase in the number of applications for pulsed electronic systems typically characterized by low duty cycles but very high power draws. These include military offensive and defensive systems as well as industrial and commercial applications in the fields of manufacturing, materials processing, power conversion and health care. The electrical characteristics of these pulsed systems are opening doors to new technology, but at the same time the high instantaneous heat fluxes and disparate timescales between heat generation and removal create unique challenges for the thermal management community. This session will examine the thermal aspects of pulsed power electronic devices and systems and potential solutions to problems inherent therein.

Topics:

We welcome papers that present new research and investigation into better understanding the pulsed thermal phenomena in electronic systems. The range of potential topics includes but is not limited to:
· Modeling of heat transfer and pulsed thermal propagation in electronic devices and packages
· Experimental evaluation of mechanical and thermal aspects of pulsed packages
· Analysis of the applicability of steady-state cooling technology to pulsed applications
· New experimental techniques for measuring high-rate thermal transients and their effects
· Thermal buffering and load leveling technology
· Systems level management of pulsed thermal loads
· Reliability analysis and assessment of electronic devices, packages or components under pulsed thermal loads
· Commercial, industrial, and military applications of pulsed electronics with emphasis on thermal conditions.

Abstract and subsequent paper submissions are entirely web-based, with the following deadlines. Please submit a 400 word text-only (no figures and tables) abstract to ITherm website: http://www.ithermconference.org

The Abstracts will be considered for oral or poster sessions. The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance.

Some important dates:
• Deadline for Submission of Abstracts: September 30, 2009
• Notification of Abstract Acceptance: October 15, 2009
• Draft Paper Submission: December 14, 2009
• Final Paper Web Submission: March 7, 2010
• ITherm 2010: June 2-5, 2010

Please notify one of the session organizers if planning to submit, as it will aid in session planning.

Session Organizers:
Nicholas Jankowski
Power Components Branch
U.S. Army Research Laboratory
2800 Powder Mill Road, Adelphi, MD 20783
Email: JankowskiN@ASME.org

Stephen Bayne
Department of Electrical Engineering
Texas Tech University
2500 Broadway, Lubbock, TX 79409
Email: Stephen.Bayne@ttu.edu

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