posted by user: jamespark || 2078 views || tracked by 6 users: [display]

BlockFinTech 2017 : The 2017 International Workshop on Blockchain, Financial Technology, and Services


When May 22, 2017 - May 24, 2017
Where Guilin, China
Submission Deadline Mar 30, 2017
Notification Due Apr 15, 2017
Final Version Due Apr 30, 2017
Categories    blockchain   fintech   digital currencies   payments ecosystem

Call For Papers

BlockFinTech 2017 Call for Papers (Springer LNEE Post Proceedings, SCOPUS Journal Recommendations-50%)
The 2017 International Workshop on
Blockchain, Financial Technology, and Services (BlockFinTech 2017)

May 22-24, 2017, Guilin, China

Published by Springer-LNEE (indexed by EI and SCOPUS)
SCOPUS Journal Recommendatiohns (50%)

Hosted by KIPS-CSWRG

1. SCOPUS Journal Recommendations (50%)

Blockchain and Financial Technology (BlockFin) recently drawn much attention from interested stakeholders in a wide range of industries.
The BlockFin would stand for all of continuously evolving and converging information technologies and Finance including Bitcoin, Digital Currencies, Payments ecosystem, P2P, network forensics, Scalability issues and solutions, Fraud detection and financial crime prevention, Case studies, and New applications of the BlockFinTech.
The BlockFinTech 2017 workshop provides an opportunity for academic and industry professionals to discuss recent progress in the area of BlockFin.

Topics (included, but are not limited to)
-Decentralized Platforms
-Digital Currencies
-Payments ecosystem
-Peer to Peer
-New threat models and attacks in BlockFin
-Defenses and countermeasures
-Network forensics
-Simple payment verification modes
-Anonymity and privacy issues
-Incentive mechanisms
-Scalability issues and solutions
-Fraud detection
-Financial crime prevention
-Applicability of the technology in financial markets
-Legal, ethical, and societal aspects
-Case studies (for instance, of adoption, attacks)
-New applications

Submission, Proceedings, and Special Issues
1.Please DO NOT repeatedly create new paper id with an identical paper in our editorial system. When more than two identical papers are submitted in the editorial system, the papers will be rejected without review process. If any problems, please contact to a leading program chair.
2.In case of more than two withdrawals of accepted papers, the author will be placed on a blacklist in our DB. We will NOT allow your submission to Confs., SIs, and events.

There will be a combination of presentations including scientific papers. Prospective authors are invited, in the first instance, to submit papers for oral presentations in any of the areas of interest for this conference.
Authors should submit a paper based on page limitation including all figures, tables, and references. If you want to submit more than page limitation, you can add up to 2 extra pages with the appropriate fee payment.
All accepted papers will be included in the conference proceedings published by Lecture Notes in Electrical Engineering (LNEE) - Springer (indexed by EI and SCOPUS).

Authors should submit a paper with 5~6 pages in length, including all figures, tables, and references.
If you want to submit more than page limitation, you can add up to 2 extra pages (total MAX. 8 pages) with the extra page charges (100 USD per page).
Papers exceeding the page limits will be rejected without review.

Instructions for papers in the Springer's LNEE is as follows. (Note that the paper format of LNEE is the same as that of LNCS)
Prepare your paper in the exact format as the sample paper for LNEE. Failure to do so may result in the exclusion of your paper from the proceedings. Please read the authors' instructions carefully before preparing your papers.
Springer accepts both Microsoft Word and LaTex format in the Lecture Note Series.
However, we DO NOT accept the use of LaTex. Therefore, you should use the Microsoft Word instead of using LaTex (The paper will be excluded from the proceeding if you use LaTex).
Springer provides the relevant templates and sample files for both PC ( and Mac (sv-lncs) environments.

Please download

If you need more help on preparing your papers, please visit Springer's LNCS web page (

Submission system:
***Author(s) MUST select topic as "BFT2017" at the submssion system****.

== Proceeding ==
All accepted papers will be included in the conference Post-proceedings as one of Lecture Notes in Electrical Engineering (LNEE) series published by Springer (indexed by EI & SCOPUS- procceing type).

== Special Issues Recommendations ==
Distinguished selected papers accepted and presented in BlockFinTech 2017,
after further revisions, will be recommended for the special issues of the following international journals (Confirmed):

1. SCI/E Journal (~10%)
The Journal of Supercomputing - Springer (SCI)
Multimedia Tools and Applications (MTAP) - Springer (SCIE)
Computers & Electrical Engineering - Elsvier (SCIE)
Journal of Ambient Intelligence and Humanized Computing - Springer (SCIE)
Soft Computing - Springer (SCIE)

2. Scopus Journal (50%)
Human-Centric and Information Sciences (HCIS) - Springer (SCOPUS)
Journal of Information Processing Systems (JIPS) - KIPS (SCOPUS)
Other SCOPUS Journals

Important Dates
Paper Submission Due: March 30, 2017
Author Notification: April 15, 2017
Registration Due: April 25, 2017
Camera Ready Due: April 30, 2017
Conference Date: May 22-24, 2017

James J. Park, SeoulTech, Korea
Yi Pan, Georgia State University, USA
Ka Lok Man, Xi'an Jiaotong-Liverpool University, China

==Guilin, China Information ==

Contact Information
If you have any questions about this CFP and papers submission,
please email to the organization of Prof. James Park (

- The End -

Related Resources

Fintech 2020   Sustainaility (Q2): Fintech: Recent Advancements in Modern Techniques, Methods and Real-World Solutions
ICBC 2020   IEEE International Conference on Blockchain and Cryptocurrency 2020
SoCAV 2021   2021 International Symposium on Connected and Autonomous Vehicles (SoCAV 2021)
FinteQC 2021   The 3rd Canadian Conference on Fintech, Insurtech & Financial Services Innovation
SIGL 2021   8th International Conference on Signal and Image Processing
AIBC--Ei Compendex and Scopus 2021   2021 2nd International Artificial Intelligence and Blockchain Conference (AIBC 2021)--EI Compendex, Scopus
FinancialNews&Data-IEEE-BigData 2020   The 4th IEEE International Workshop on Big Data for Financial News and Data
ICBC 2021   IEEE International Conference on Blockchain and Cryptocurrency
AI, Data Analytics and Blockchain JIEM 2020   Emerging Trends and Impacts of the rise of AI, Data Analytics and Blockchain, Journal of Enterprise Information Management (JIEM, Q1)
EI-ICFoIT 2021   2021 International Conference on Frontiers of Industrial Technology (ICFoIT 2021)