Submission Processing

2nd ICMSE 2017 will bring together top researchers from Pacific areas, North America, Europe and all around the world to exchange research results and address open issues in all aspects of international conference on Material Science and Engineering.

Paper Submission E-mail: icmse2017@icmse-conf.org

Paper Submission Information

Once the paper is accepted by 2nd ICMSE 2017 committee, we are pleased to send the crucial file for publication to authors separately via e-mail. The acceptance letter and other document will be sent 2-3 days after paper submission. TTP ID and PASSWORD will be sent you in 2-3 days through your e-mail which you have submitted your paper to the ICMSE 2017. Scientific Net system allow you to submit a manuscript by one TTP ID so that you may let us know your TTP ID if you have, other than that we might issue your TTP ID and sent you by your e-mail address.

Manuscript Form Instruction
1. The manuscript length should be minimum 5 pages and average 6 pages.
2. The manuscript should be including a figure, table, and reference.
3. There is an additional charge for the paper over 5 pages.
4. All the paper should be written in English Only.
5. All the paper should be in MS Word file and an identical PDF file according to the following instructions;
- All the paper has a file name – (Topic Field) Paper Title.doc
- Paper submission form has a file name – (Topic Field) Paper Submission Form.xls Please refer to Call for Paper to fill in Topic Field.
- Any submission must not have been, or will not be published elsewhere or submitted to another conference before the review notification date of this conference

Incomplete or published manuscript cannot be accepted. Before the Scientific.net Upload Date Due, author is able to revise the paper by June 10, 2017. However, after the manuscript submission, the author will receive a request of revise own papers by e-mail. There will be last opportunity to correct your paper. While submitting the manuscript, be sure to submit a completed Copyright Agreement to TTP/ Scientific.net.


TOPICS: The conference is soliciting state-of-the-art research papers in the following areas of interest:
1. Advanced Engineering Materials
(1) Advanced Construction Materials
(2) Biomaterials
(3) Building Materials
(4) Ceramic
(5) Chemical Materials
(6) Composites
(7) Computer Aided Design of Materials
(8) Earthquake Resistant Structures, Materials and Design
(9) Energy Materials
(10) Environmental Catalysis and Environmental Friendly Materials
(11) High Performance Elastomers & Polymers
(12) Hydrogen and Fuel Cell Science, Engineering & Technology
(13) Iron and Steel
(14) Material Processing
(15) Materials Testing and Evaluation
(16) Metal alloy Materials
(17) Micro / Nano Materials
(18) Microwave Processing of Materials
(19) New Energy Materials
(20) New Functional Materials
(21) Optical/Electronic/Magnetic Materials
(22) Process Modeling, Analysis and Simulation
(23) Seismic Materials
(24) Smart/Intelligent Materials/Intelligent Systems
(25) Surface Engineering / Coatings Technology
(26) Textile Materials
(27) Thin Films
(28) Welding and Mechanical Connections
2. Materials Processing Technology
(29) Absorption Materials
(30) Adsorption and diffusion in Nanoporous Materials
(31) Alloy and Composite Materials
(32) Amorphous and Crystalline Materials
(33) Amorphous magnetic Materials
(34) Amorphous vs Crystalline Polymers
(35) Applications of Biomaterials Materials science
(36) Biomimetic (Assembly)
(37) Catalytic Ceramic
(38) Chemical Synthesis
(39) Chemical Vapor Deposition (CVD) (Deposition)
(40) Colloid and Materials Science
(41) Composite Materials Science and Applications
(42) Conductivity of materials
(43) Corrosion Resistant Materials
(44) Crystal growth
(45) Crystallographic structure
(46) Defects in Crystals
(47) Diamond Mmaterials Technology
(48) Diffusion Bonding of Materials
(49) Dislocations and Mechanical Behaviour of Materials
(50) Dopant
(51) Dynamic Analysis of Processing
(52) Dynamic Mechanical Analysis, Optimization and Control
(53) Elastic Properties
(54) Electrodeposition - the Materials Science of Coatings and Substrates
(55) Electronic Material
(56) Energy Generation
(57) Energy Storage
(58) Laser Processing Technology
(59) Material Design of Computer Aided
(60) Material Physics & Chemistry
(61) Materials Devices and Nanotechnology
(62) Materials for Adhesion Bonding
(63) Materials Forming
(64) Materials Machining
(65) Mechanical Behavior & Fracture
(66) Microwave Processing of Materials
(67) Modeling, Analysis and Simulation of Manufacturing Processes
(68) Molecular beam epitaxy (mbe)
(69) Morphology Material
(70) Nanoindentation Material
(71) Nanostructure
(72) Nitride
(73) Nucleation & growth
(74) Optical Material
(75) Optical properties
(76) Optoelectronic
(77) Organic Material
(78) Oxidation
(79) Piezoelectric
(80) Polymer
(81) Porosity
(82) Precision Manufacturing Technology and Measurements
(83) Radiation effects
(84) Stress/strain relationship
(85) Structural
(86) Surface Chemistry Thermal
(87) Surface Engineering/Coatings
(88) Theory and Application of Friction and Wear
(89) Thermal Engineering Theory and Applications
(90) Thermoelectric
(91) Tooling Testing and Evaluation of Materials
(92) Transmission Electron Microscopy (TEM)
(93) Waste Management
(94) Welding & Joining
(95) X-ray diffraction (xrd)