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SMARTCOMP 2017 : The 3rd IEEE International Conference on Smart Computing


When May 29, 2017 - May 31, 2017
Where Hong Kong, China
Abstract Registration Due Feb 3, 2017
Submission Deadline Feb 10, 2017
Notification Due Mar 27, 2017
Final Version Due Apr 28, 2017

Call For Papers


The 3rd IEEE International Conference on Smart Computing (SMARTCOMP 2017)

29 – 31 May 2017. Hong Kong, China

Sponsored by IEEE Computer Society and in-cooperation with ACM SigAPP (pending)



SMARTCOMP is targeted to be a premier conference on smart computing, which represents the next wave of computing driven by the advances in the knowledge and technology of sensing, Internet of Things (IoT), big data, machine learning, cognitive computing and Artificial Intelligence (AI). It is emerging as an important multidisciplinary area, covering three major topics: how to design novel concepts, models and algorithms for smart computing; how to build and validate smart computing systems, platforms and frameworks; and how to innovate computing technology for diverse societal applications to improve the human experience. Applications of smart computing span different societal domains including, but not limited to, transportation, energy, environmental protection, smart and connected communities, healthcare, banking, entertainment, and social media. Algorithmic and system advancements of cloud computing, mobile/pervasive computing, cyber-physical systems, sensor networking a!
nd social computing are bringing smart computing approaches to a newer dimension and improving our ways of living.

SMARTCOMP 2017 invites high quality papers on original research in advance algorithms, system platforms, and technologies for smart computing. With the theme “Smart Living through Computing”, SMARTCOMP 2017 will be a forum for the presentation and exchange of cutting-edge ideas. The conference will also feature forums and panel with distinguished scholars and industrial experts.

SMARTCOMP 2017 will include smart computing innovations in all different technology aspects including pervasive/ubiquitous computing, cloud computing, sensor networks, internet of things, big data analytics, security and privacy, social computing, cognitive computing, cyber-physical systems with their validation within smart computing environments, and applications such as smart buildings, smart cities, smart grids, precision agriculture and other societal applications contributing to smart living. Submissions may be targeted within, but not limited to, the following three major topics and their sub-topics:


* Future Smart Computing Paradigms

* Models of Smart Environments

* Algorithms for Smart Computing


* Security, Privacy, and Economics in Smart Environments

* Cyber-physical System Platforms for Smart Environments

* Middleware Platforms for Smart Environments

* Mobile and Ubiquitous Platforms for Smart Environments


* Smart Precision Agriculture

* Smart Transportation

* Smart FinTech

* Smart Food-Energy-Water Nexus

* Smart Health

* Smart Communities

* Smart Human Environments, Entertainment, and Social Activities

* Smart Energy Management and Analytics


Paper submissions should be no longer than 8 pages and formatted according to the IEEE conference template. Papers must be submitted electronically as PDF files, through EasyChair. (Please see the conference webpage for detailed instructions.)

All submitted papers will be subject to peer reviews by Technical Program Committee members and other experts in the field. All presented papers will be published in the conference proceedings and submitted to the IEEE Xplore Digital Library. Selected high-quality papers will be invited to submit (with substantial extension) to a special issue of the Elsevier Journal on Pervasive and Mobile Computing (SCI indexed).


All accepted papers will be considered for the Best Paper Award. The program committee will select a number of candidates for the award among the accepted papers. The winners will be selected at the conference, taking into consideration both the paper and the presentation.

We will also have the Best Community Paper Award. The program committee will select the one with strong application context that contributes the most to the broader research community in terms of real data, new software/hardware or artifacts.


The authors of each accepted paper are required to submit a 1-minute video to introduce the research presented in their paper to the general public. These videos will be placed on the conference website, and will be played during the conference.


Abstract Registration Deadline: Friday, 3 February 2017

Paper Submission Deadline: Friday, 10 February 2017

Acceptance Notification: Monday, 27 March 2017

Camera Ready Deadline: Friday, 28 April 2017

Video Submission Deadline: Friday, 5 May 2017


General Co-Chairs

Jiannong Cao, The Hong Kong Polytechnic University, Hong Kong

Julie McCann, Imperial College London, UK

Technical Program Co-Chairs

Klara Nahrstedt, University of Illinois at Urbana-Champaign, USA

Xue Liu, McGill University, Canada

Workshop Co-Chairs

Antonio Puliafito, University of Messina, Italy

Shusen Yang, Xian Jiaotong University, China

Panel Co-Chairs

Chunming Rong, University of Stavanger, Norway

Daqing Zhang, Peking University, China

WIP/Demo Co-Chairs

Dario Bruneo, University of Messina, Italy

Lei Yang, The Hong Kong Polytechnic University, Hong Kong

Publication Chair

Wen-Huang Cheng, Academia Sinica, Taiwan

Publicity Co-Chairs

Giovanni Pau, University Pierre et Marie Curie, France

Ichiro Sato, National Institute of Informatics, Japan

Haiying Shen, University of Virginia, USA

PhD Forum Co-Chairs

Paul Bauman, Technische Universität Dresden, Germany

Mo Li, Nanyang Technological University, Singapore

Industry Liaison Co-Chairs

Henry Chan, The Hong Kong Polytechnic University, Hong Kong

Zixia Huang, Google Fiber, USA

Registration and Finance Chair

Maciej Zawodniok, Missouri University of Science and Technology, USA

Local Arrangement Chair

Carmen Au, The Hong Kong Polytechnic University, Hong Kong

Steering Committee

Jiannong Cao, Hong Kong Polytechnic University, Hong Kong (Co-Chair)

Sajal K. Das, Missouri University of Science and Technology, USA (Co-Chair)

Giuseppe Anastasi, University of Pisa, Italy

Vijayakumar Bhagavatula, Carnegie Mellon University, USA

Victor Leung, The University of British Columbia, Canada

Neeraj Suri, Technische Universität Darmstadt, Germany

Albert Zomaya, The University of Sydney, Australia


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