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CyberC 2009 : International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery


Conference Series : Cyber-Enabled Distributed Computing and Knowledge Discovery
When Oct 10, 2009 - Oct 12, 2009
Where China
Submission Deadline Jul 1, 2009
Notification Due Jul 20, 2009
Final Version Due Aug 10, 2009
Categories    data mining   distributed systems   wireless   networking

Call For Papers


In the last decade, network-enabled distributed computing and knowledge discovery technologies have received extensive attention in both the academia and industry due to explosive growth of computer and network systems. Various hardware and software designs, algorithms, protocols, simulation approaches, test-beds, and implementations are being developed for distributed computing in an interconnected and distributed network environment.

In cooperation with the IEEE Computer Society Technical Committee on Simulation (TCSIM), CyberC 2009 aims to provide a forum for presentation and discussion of innovative ideas, research results, applications, and experiences from around the world as well as highlight activities in the related areas. The accepted papers will be published in IEEE Digital Library, i.e., IEEE Xplore, indexed by EI and ISTP. The conference focuses on all aspects of distributed computing and knowledge mining and their scientific, engineering, and commercial applications. The topics of interests include, but not limited to:

Data Mining and Information Discovery
 Parallel and distributed data mining algorithms
 Data streaming, multimedia, stream, or web mining
 Information discovery in data Mining
 Data mining applications for bioinformations and biometrics
 Parallel and distributed system or software architectures
 Database applications and data mining
 Security and information assurance in data mining

Parallel and Distributed Computing
 Parallel and distributed algorithms
 Resource allocation, load-balance, and management in distributed computing
 Grid and cluster computing
 Clouding computing
 Web services and internet computing
 Distributed systems and applications
 Pervasive/ubiquitous computing and intelligence
 Biological/molecular computing

Mobile and Internet Computing
 Wireless ad hoc networks, wireless mesh networks,
 Wireless embedded systems
 Future generation communications for 4G or beyond
 Peer-to-peer network computing
 Mobile IP and Internet technology
 Security in Mobile Wireless Networks
 Wireless Network Simulations

Performance and Tools in Distributed Computing
 Performance evaluation, measurement and Optimization
 Tools, test-bed, simulations, and environments
 Collaborative and cooperative environments
 Autonomic, reliability and fault-tolerance
 Authentication, Trust, privacy and other security issues

Important Dates

July 1, 2009 - Conference Paper Submission Deadline
July 20, 2009 - Notification of Acceptance/Rejection
July 30, 2009 - Camera-Ready Paper Submission
August 2, 2009 - Registration Starts
September 15 2009 - Early Registration and Camera-Ready Paper Submission Deadline

Program Committee

General Co-Chairs:
Mahmoud Daneshmand, AT&T Labs, USA
Tang Yong, Sun Yat-Sen University, China

Program Co-Chairs
Chi-Ming Chen, AT&T Labs, USA
Bin Xie, InfoByond Technology, USA
Yue Wu, University of Electronic Science and Technology of China, China
Lin Wang, Xiamen University, China

Registration Co-Chairs
Sanjuli Agarwal, Indiana University Southeast, USA
Zhixiang Hou, Changsha University of Science and Technology, China

Local Coordination Co-Chair
Dongmei Sun, Beijing Jiaotong University, China

Publicity Co-Chairs
Jong Hyuk Park, Kyungnam University, Korea
Abraham George, Keyocera, India

Steering Chairs
Anup Kumar, University of Louisville, USA
Patrick Hung, University of Ontario Institute of Technology (UOIT), Canada

Program Committee
Ratan Ghosh, Indian Institute of Technology, Kanpur, India
William Zhu, University of Electronic Science and Technology of China, China
Zhu Min, SiChuan University, China
Jia Zhang, Northern Illinois University, USA
Alok Srivastava, Microsoft Research, USA
Khaled Kamel, Texas Southern University, USA
Zhengding Qiu, Beijing Jiaotong University, China
Yunhong Wang, Beihang University (Beijing University of Aeronautics and Astronautics), China
Iyad Alkhayat, University of Louisville, USA
Ahmed Salem, Hood College, USA
Alaaeldin Sleem, Texas Southern University, USA
Lin Xu, National Natural Science Foundation of China, China
Jingli, Li, Emerson Electric Co., USA
Sherif S. Rashad, Morehead State University, USA
Sanjay Ahuja, University of North Florida, USA
Fu Hongguang, University of Electronic Science and Technology of China, China
Changqin Huang, South China Normal University, China,
Sudeep Bharti, Microsoft India, India
Yilong Yin, Shandong University, China
Shiguang Shan, Chinese Academy of Sciences, China
Yangfeng Hou, Monessen Hearth System, USA
Saleem Hariri, University of Arizona, USA
Shaohua Teng, Guangdong University of Technology, China
Shaozi Li, Xiamen University, China
Rui Aguiar, Universidade de Aveiro, Italy
Hussein Mouftah, University of Ottawa, Canada
Xinbing Wang, Shanghai Jiaotong University, China
Ashok Kumar, University of Toledo, USA
DongQing Chen, University of Louisville, USA
Lijun Zhang, University of Louisville, USA

Manuscript Guidelines

All submitted manuscripts should be prepared as technical papers and may not exceed 8 letter size (8.5 x 11) pages including figures, tables and references using the IEEE format for conference proceedings (print area of 6-1/2 inches (16.51 cm) wide by 8-7/8 inches (22.51 cm) high, two-column format with columns 3-1/16 inches (7.85 cm) wide with a 3/8 inch (0.81 cm) space between them, single-spaced 10-point Times fully justified text). For more information please see Outgoing/proceedings/. Submissions not conforming to these guidelines may be returned without review. The submitted manuscripts can be prepared in Word, or Latex using the IEEE templates, but authors should finally submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 x 11) paper. The official language of the meeting is English.

Manuscript submission procedure is available over the Web at We encourage you to use edas online submission by selecting “CyberC 2009”. If you have trouble in using the edas based Web submission, you can also submit your paper to or contact us. Electronic submissions must be in the form of a readable PDF file. Manuscripts must be received by June 1, 2009.

Submitted manuscripts must contain the original unpublished research that is not currently under review for any other conference or journal. Papers not following these guidelines will be rejected without review and further action may be taken. Authors may contact the Program Chair Dr. Bin Xie ( for further information or clarification.

Paper Acceptance

Manuscripts should present the current research in the areas identified in the call for papers. All submitted manuscripts will be reviewed by experts in the fields and will be judged from the aspects of problem significance, contributions, originality, correctness, technical strength, quality of presentation, and relevance to the conference attendees. Notification of review decisions will be emailed by July 1, 2009. Camera-ready papers are due by July 30, 2009. Papers will be accepted as Regular Papers, Short Papers, and Post Papers with maximum allowed limit of 8 pages, 4 pages, and 2 pages respectively for the final camera ready version.

A published proceeding will be available at the conference and all accepted and presented papers will be included into the IEEE Digital library (indexed by EI). Authors of accepted papers, or at least one of them, should register and present their work at the conference, otherwise their papers will be removed from the digital libraries of IEEE CS and EI after the conference.

Journal Special Issue:
Outstanding papers will be published in the journal of Information Systems Frontiers. The invitations of journal extension will be sent out by the end of October 2009 and the targeted special issue will be published by 2010. Please visit for more information about the journal.

For more information about the conference, please visit or contact Dr. Bin Xie at

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