posted by user: seer || 15689 views || tracked by 44 users: [display]

ASP-DAC 2016 : Asia and South Pacific Design Automation Conference


Conference Series : Asia and South Pacific Design Automation Conference
When Jan 25, 2016 - Jan 28, 2016
Where Macao, China
Submission Deadline Jul 8, 2015
Notification Due Sep 14, 2015
Final Version Due Nov 9, 2015
Categories    VLSI   DAC   EDA   design

Call For Papers

Aims of the Conference:
ASP-DAC 2016 is the 21th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC.

Areas of Interest:
Original papers in, but not limited to, the following areas are invited.

[1] System-Level Modeling and Design Methodology:
1.1. HW/SW co-design, co-simulation and co-verification
1.2. System-level design exploration, synthesis and optimization
1.3. Model- and component-based embedded system/software design
1.4. System-level formal verification
1.5. System-level modeling, simulation and validation tools/methodology

[2] Embedded System Architecture and Design:
2.1. Many- and multi-core SoC architecture
2.2. Reconfigurable and self-adaptive SoC architecture
2.3. IP/platform-based SoC design
2.4. Domain-specific architecture
2.5. Dependable architecture
2.6. On-chip memory architecture
2.7. Cyber physical system
2.8. Storage system architecture
2.9. Internet of things

[3] On-chip Communication and Networks-on-Chip:
3.1. On-chip communication network
3.2. Networks-on-chip
3.3. Interface and I/O design
3.4. Optical and RF on-chip communication

[4] Embedded Software:
4.1. Kernel, middleware and virtual machine
4.2. Compiler and toolchain
4.3. Real-time system
4.4. Resource allocation for heterogeneous computing platform
4.5. Storage software and application
4.6. Human-computer interface
4.7. System verification and analysis

[5] Device/Circuit-Level Modeling, Simulation and Verification:
5.1. Device/circuit/interconnect modeling and analysis
5.2. Device/circuit-level simulation tool and methodology
5.3. RTL and gate-leveling modeling, simulation and verification
5.4. Circuit-level formal verification

[6] Analog, RF and Mixed Signal:
6.1. Analog/mixed-signal/RF synthesis
6.2. Analog/mixed-signal/RF testing
6.3. Analog layout verification and simulation technique
6.4. Noise analysis
6.5. High-frequency electromagnetic simulation of circuit
6.6. Mixed-signal design consideration
6.7. Power-aware analog circuit/system design
6.8. Analog/mixed-signal modeling and simulation technique

[7] System-Level Power and Thermal Management:
7.1. System-level low-power design and thermal management
7.2. System-level power modeling, analysis and simulation
7.3. Cross-layer reliability and aging
7.4. Architectural low-power design technique
7.5. Energy harvesting and battery management

[8] Device/Circuit/Gate-Level Low Power Design:
8.1. Low-power design and methodology
8.2. Power modeling, analysis and simulation
8.3. Thermal aware design

[9] Logic/Behavioral/High-Level Synthesis and Optimization:
9.1. High-level synthesis tool and methodology
9.2. Combinational, sequential and asynchronous logic synthesis
9.3. Logic synthesis and physical design technique for FPGA
9.4. Technology mapping

[10] Physical Design:
10.1. Floorplanning, partitioning and placement
10.2. Interconnect planning and synthesis
10.3. Placement and routing optimization
10.4. Clock network synthesis
10.5. Post layout and post-silicon optimization
10.6. Package/PCB/3D-IC routing

[11] Design for Manufacturability and Reliability:
11.1. Reticle enhancement, lithography-related design and optimization
11.2. Resilience under manufacturing variation
11.3. Design for manufacturability, yield, defect tolerance, cost issue, and DFM impact
11.4. Reliability, aging and soft error analysis
11.5. Design for reliability and robustness

[12] Timing and Signal/Power Integrity:
12.1. Deterministic/statistical timing and performance analysis and optimization
12.2. Power/ground and package modeling, analysis and optimization
12.3. Signal/power integrity, EM modeling and analysis
12.4. Extraction, TSV and package modeling
12.5. 2D/3D on-chip power delivery network analysis and optimization

[13] Test and Design for Testability:
13.1. ATPG, BIST and DFT
13.2. Fault modeling and simulation
13.3. System test and 3D IC test
13.4. Online test and fault tolerance
13.5. Memory test and repair
13.6. Analog and mixed-signal test

[14] Security and Fault-Tolerant System:
14.1. Security modeling and analysis
14.2. Architecture, tool and methodology for secure hardware
14.3. Design for security and security primitive
14.4. Cross-layer security
14.5. Fault analysis, detect and tolerance

[15] Emerging Technology:
15.1. New transistor/device and process technology: spintronic, phase-change, single-electron etc.
15.2. CAD for nanotechnology, MEMS, 3D IC, quantum computing etc.

[16] Emerging Application:
16.1. Biomedical application
16.2. Big data application
16.3. Advanced multimedia application
16.4. Energy-storage/smart-grid/smart-building design and optimization
16.5. Datacenter optimization
16.6. Automotive system design and optimization
16.7. Electromobility

ACM, IEEE, and IEICE reserve the right to exclude a paper from distribution after the conference (e.g., removal from ACM Digital Library and IEEE Xplore) if the paper is not presented at the conference by the author of the paper. ASP-DAC does not allow double and/or parallel submissions of similar work to any other conferences, symposia, and journals.

Submission of Papers:
Deadline for submission: 5 PM AOE (Anywhere on earth), July 8 (Wed), 2015
Notification of acceptance: Sep. 14 (Mon), 2015
Deadline for final version: 5 PM AOE (Anywhere on earth), Nov. 9 (Mon), 2015
For detailed instructions for submission, please refer to the “Authors’ Guide” at:

ASP-DAC 2016 Chairs
General Chair: Rui Paulo da Silva Martins (University of Macau, Macao, China)
Technical Program Chair: TingTing Hwang (National Tsing Hua University, Taiwan)
Technical Program Vice Chairs: David Z. Pan (University of Texas at Austin, USA), Pui-In Mak (University of Macau, Macao, China)

Panels, Special Sessions, and Tutorials:
Suggestions and proposals are welcome and have to be addressed to the Conference Secretari at ( no later than May 29 (Fri), 2015.

Conference Secretariat:
TPC Secretariat:

Related Resources

AMS 2024   2024 7th Asia-Pacific Conference on Applied Mathematics and Statistics (AMS 2023)
ACIRS 2024   IEEE--2024 the 9th Asia-Pacific Conference on Intelligent Robot Systems (ACIRS 2024)
SEMIT 2023   4th International Conference on Software Engineering and Managing Information Technology
IEEE ACIRS 2024   IEEE--2024 the 9th Asia-Pacific Conference on Intelligent Robot Systems (ACIRS 2024)
ICDME 2023   2023 the 7th International Conference on Design and Manufacturing Engineering (ICDME 2023)
VLSICS 2023   International Journal of VLSI design & Communication Systems
PAKDD 2024   The 28th Pacific-Asia Conference on Knowledge Discovery and Data Mining
CSIJ 2023   Circuits and Systems: An International Journal (CSIJ)
ISDEA 2024   2024 3rd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2024)