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DataCom 2015 : International Conference on Big Data Intelligence and Computing (IEEE/ACM/Elsevier/Springer Sponsored)


When Dec 19, 2015 - Dec 21, 2015
Where Chengdu, China
Submission Deadline Aug 15, 2015
Notification Due Sep 15, 2015
Final Version Due Sep 30, 2015
Categories    big data   cloud computing   HPC   computer science

Call For Papers

2015 International Conference on Big Data Intelligence and Computing(DataCom 2015)
Dec. 19th-21st, 2015, Chengdu, Sichuan, China
(IEEE/ACM/Elsevier/Springer Sponsored)

- Research paper
- Wild and Works-in-Progress
- Industry and workshop track
- Doctoral symposium
- Demo/Poster

Big data is a rapidly expanding research area spanning the fields of computer science and information management, and has become a ubiquitous term in understanding and solving complex problems in different disciplinary fields such as engineering, applied mathematics, medicine, computational biology, healthcare, social networks, finance, business, government, education, transportation and telecommunications.

The goal of the 2015 International Conference on Big Data Intelligence and Computing (DataCom 2015) is to establish an international forum for engineers and scientists to present their ideas and experiences in the fields of Big Data intelligence and computing. DataCom 2015 welcomes paper submissions on innovative work from researchers in academia, industry and government describing original research work in Big Data. Authors of selected papers will be invited to submit an extended version (with at least 30% new material) for review and publication in special issues of international journals. Welcome to Chengdu, which has great weather, genuine Sichuan cuisine and many famous tourism places, such as Jiuzhai Valley, Chengdu Giant Panda Breeding Research Base, Emei Mountain and so on.

DataCom 2015 will be held on Dec. 19th-21st, 2015 in Chengdu, Sichuan, China. Topics of interest include, but are not limited to:

● The 5Vs of the data landscape: volume, variety, velocity, veracity, value.
● Big data science and foundations, analytics, visualisation and semantics.
● Software and tools for big data management.
● Security, privacy and legal issues specific to big data.
● Big data economy, QoS and business models.
● Intelligence and scientific discovery.
● Software, hardware and algorithm co-design, high-performance computing.
● Large-scale recommendation systems and graph analysis.
● Algorithmic, experimental, prototyping and implementation.
● Data-driven innovation, computational modelling and data integration.
● Data intensive computing theorems and technologies.
● Modelling, simulation and performance evaluation .
● Hardware and infrastructure, green data centres/environmental-friendly perspectives.
● Computing, scheduling and resource management for sustainability.
● Complex applications in areas where massive data is generated.

Research Paper:
Full research manuscripts should explore a specific technology problem and propose a complete solution to it, with extensive experimental results, practical experience reports are expected to provide an in-depth exposition of practitioner experiences and empirical studies.

WIP Paper:
Wild and Works-in-Progess (WIP) Papers are expected to present either work currently in progress or less developed but highly innovative ideas related to areas relevant to IOV, aiming at inspiring discussion among conference attendees and getting people thinking about open research challenges.
Please send your submission as an email attachment in PDF to with the subject: “DataCom WIP Paper Submission.”

Industry presentation:
The objective of the Industry Track is to establish an efficient dialogue between practitioners and researchers concerning the challenges, findings (both positive and negative), encountered obstacles, and lessons learned on IOV. The Industry Track papers and presentations will address the application of IOV practices (which may include work on principles, techniques, tools, methods, processes) to a specific domain or to the development of a substantial IOV system.
Please send your submission as an email attachment in PDF to with the subject: “DataCom Industry Presentation Submission.”

Doctoral Symposium:
The objective of the Doctoral Symposium is to provide constructive feedback and guidance to doctoral students who are performing their dissertation research in the field of IOV and to help students interact with established researchers and practitioners. A research summary should include Student name, university, research advisor, the problem to be addressed by your thesis, Your research hypothesis, The expected contributions of your dissertation research, Your proposed research approach, Summary of results to date, How you plan to evaluate your results and a dissemination plan.
Please send your submission as an email attachment in PDF to with the subject: “DataCom Doctoral Symposium Submission.”

Submissions must describe working systems and be related to IOV. These systems may be innovative prototype implementations or mature systems that use related technology. The demo paper should provide adequate information on the system's architecture, individual components, the way the system is operated, and the way the system will be demonstrated during the conference.

Please send your submission as an email attachment in PDF to with the subject: “DataCom Demo/Poster Submission.”

Submission deadline: Sep. 15th, 2015 (Research track)
Submission deadline: Sep. 22nd, 2015 (Works-in-Progress)
Submission deadline: Sep. 29th, 2015 (Industry and workshop track)
Submission deadline: Oct. 10th, 2015 (Doctoral Symposium)
Submission deadline: Oct. 14th, 2015 (Demo/Poster)

Author Notification (Research): Oct. 8th, 2015
Author Notification (WIP/Industry/workshop/doctoral/poster): Oct. 24th, 2015

Camera Ready/registration deadline: Oct. 31, 2015

DataCom 2015 Organizing Committee invites proposals for one-day workshops affiliated with the conference and addressing research areas related to the conference. The workshop proceedings will be published by IEEE CS Press. Submit workshop proposals to workshops chairs via emails (E-mail:

Papers need to be prepared according to the IEEE format, no more than 6 pages and submitted in PDF format via the DataCom 2015 submission site:

IEEE formatting information:

For WIP/Industry/workshop/doctoral/Demo/poster tracks,
Please send your submission as an email attachment in PDF to

Accepted and presented papers will be included into the IEEE Conference Proceedings published by IEEE CS Press. Authors of accepted papers, or at least one of them, are requested to register and present their work at the conference, otherwise their papers will be removed from the digital libraries of IEEE CS after the conference.

Distinguished papers accepted and presented in DataCom 2015, after further extensions, will be published in special issues of several SCI/EI Indexed journals including
- IEEE Transactions on Cloud Computing
- Personal and Ubiquitous Computing (SCI, Springer)
- Computer Networks (SCI Indexed, Elsevier)
- Mobile Information Systems (SCI Indexed)
- Journal of Supercomputing (SCI Indexed, Springer)
- Computers and Electrical Engineering (SCI Indexed, Elsevier)
- Microprocessors and Microsystems (SCI Indexed, Elsevier)
- International Journal of Big Data Intelligence (DBLP, InderScience)
- International Journal of Grid and High Performance Computing (EI, Scopus, ACM DL)

Please visit the DataCom 2015 website for the complete listing of all the journals.

Organizing Committees
General Chairs
Geoffrey Fox, Indiana University, USA
Yeh-Ching Chung National, Tsing Hua University, Taiwan
Beniamino Di Martino, Second University of Naples, Italy

Program Chairs
Christophe Cérin, University of Paris XIII, France
Weizhe Zhang, Harbin Institute of Technology, China
Hao Wang, Aalesund University College, Norway

Executive Chair
Xingang Liu, University of Electronic Science and Technology of China, China

Advisory Committee
Robert C. H. Hsu, Chung Hua University, Taiwan
Laurence T. Yang, St. Francis Xavier University, Canada
Irena Bojanova, University of Maryland University College, USA
Jie Li, Tsukuba University, Japan (IEEE TSCBD Chair)
Jinsong Wu, Bell Laboratories, China

Award Chair
Rajkumar Buyya, University of Melbourne, Australia

Publicity Chairs
Yunquan Zhang, Chinese Academy of Sciences, China
Anna Kobusinska, Poznan University of Technology, Poland
Xingde Jia, Texas State University, USA

Publication Chair
Xiaoming Li, University of Delaware, USA

Please visit the IOV 2015 website for the complete listing of organizing committee and TPC members.

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