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CyberC 2015 : The 7th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery


Conference Series : Cyber-Enabled Distributed Computing and Knowledge Discovery
When Sep 17, 2015 - Sep 19, 2015
Where Xi'an, China
Submission Deadline Jun 8, 2015
Notification Due Jul 15, 2015
Final Version Due Aug 10, 2015
Categories    data mining   networking   security   cloud computing

Call For Papers

CyberC 2015 CFP
We would like to invite you to participate in the 7th CyberC - International Conference on Cyber-enabled distributed computing and knowledge discovery, Xi'AN, China.

Scopes: CyberC promotes the in-depth exploration of the most recent research and development findings in the field of big data, distributed computing, clouds, cyber security, pervasive computing, mobile computing, Internet of Things, and other cyber-based technologies. CyberC welcomes the participation of the industry to showcase and commercialize their relevant technology and products. Scientists, engineers, and students in the areas are encouraged to get involved.

Xi’an: The 7th CyberC will be hold in Xi’an, China, where is famously known for “China's Most Honorable City,”and “The Terra Cotta Warriors”.

Summits: CyberC 2015 co-hosts Big Data and SDN/NFV forums that emphasize innovative and state-of-art big data & SDN/NFV academic research, industry development, showcases, technical transitions, and commercialization.

Tour: A free group tour for CyberC participators to the world largest Samsung semiconductor lab!

Co-hosted Workshops: Cyberc 2015 incorporates four workshops:
• Big Data Workshop 2015: The 3nd International Workshop on Big Data
• Security Workshop 2015: The 4th workshop on Cyber Security and Privacy
• SDN&NFV Workshop 2015: The 1st workshop on Software Defined Network and Network Function Virtualization
• Smart Sensor Workshop 2015: The 4th workshop on Smart Sensor Network.

Information for Authors
The CyberC 2015 Proceedings will be published by IEEE CPS. Full papers for CyberC 2015 must not exceed 10 pages of IEEE 2-column format, while short papers must not exceed 4 pages. Please visit the conference web site at for precise formatting and submission instructions closer to the deadline.

Important Dates
Submission deadline for full (10-page) and short (4-page) papers: June 08 2015
Notification of acceptance: July 15 2015
Camera-ready deadline: August 1 2015

AUTHOR Contacts: Ms. Debbie via

CONFERENCE Contacts: Prof. Youn: (Asian), Dr. Chen: (USA)

Topics of interests:

Big Data and Information Discovery
• Algorithms, models, and systems for big data
• Machine learning and AI for big data
• Cloud and high performance computing for big data
• Big data retrieval, storage, query, and database
• Big data preservation, filter, provenance?, and assurance
• Big data security, protection, integrity and privacy standards and policies
• Graph mining and opinion mining, and distributed data mining
• Data streaming, multimedia, stream, or web mining
• Big data applications, image/multimedia data management
• Database for Big data
• Security and information assurance in data mining

Cyber and Distributed Computing
• Authentication, trust, privacy and other Cyber security issues
• Parallel and distributed algorithms, resource allocation, load-balance, and management
• Clouding computing, mobile cloud, mobility-aware cloud data/streams
• SOA, web services, and mobile services (software, infrastructure, platform as a service)
• Web services and internet computing
• Web-caching, content delivery systems and data distribution systems
• Distributed systems and applications, modeling language, and software engineering
• Pervasive/ubiquitous computing and intelligence

5G and Mobile Computing
• Wireless ad hoc networks, wireless mesh networks, networking theory and algorithms
• Wireless embedded sensor systems, body sensor, new sensing capabilities & security
• Cognitive radio and SDR
• Future generation communications for 5G or 4G beyond (WiMAX, LTE)
• Peer-to-peer network computing and overlaying networks
• Directional antenna and networking
• FDMA/OFDMA modulations, synchronization, and power optimization
• Mobile IP and Internet technology
• Key, attacking models, privacy, confidentiality & security in mobile wireless networks
• Communication, services, middleware, and multimedia on wireless networks
• QoS, reliability, performance, and communication theory
• Wireless network simulations, implementation, and applications

Cloud Computing and Mobile Clouds
• Autonomic, real-time and self-organizing clouds
• Architectural models for public and private cloud computing
• Cloud resource management and allocation
• Utility models and service pricing
• New parallel / concurrent programming models for cloud computing
• Scientific computation and other applications in the cloud
• Mobility modeling, management and measurement for mobile clouds
• Mobile multimedia content delivery, transferring, and migration
• Content delivery networks using storage clouds
• User Experience and Cyber Security
• Performance evaluation, measurement and optimization
• Communications and network security
• Information security, software security, system security, or applied cryptography
• Tools, test-bed, simulations, and experimental environments
• Collaborative and cooperative environments
• QoS, Autonomic, reliability, and fault-tolerance

Program Committee

Honorable General Chairs
• David Lu, AT&T Enterprise IT, USA
• Brian J. Kim, Samsung Electronics, Korea

Summit/Keynote Chairs
• Chi-Ming Chen, AT&T Labs, USA
• Ji Hong Kim, Seoul National Univeristy, Korea

Program Co-Chairs
• Bin Xie, InfoBeyond Technology LLC, USA
• Hee Yong Youn, Sungkyunkwan University, Korea
• Min Chen, Huazhong University of Science and Technology, China

Workshop Co-Chairs
• Chi-Tsun (Ben) Cheng, The Hong Kong Polytechnic University, Hong Kong
• Xiaolong Tang, InfoBeyond Technology LLC, USA
• Qi Yang, Xi'an Jiaotong University, China
• Yong Zhao, University of Electronic Science and Technology of China, China

Publicity Co-Chairs
• Bin Xia, Shanghai Jiaotong University, China
• Sammy Yang, Board Chinese Institute of Engineers, USA
• Donghoon Lee, Korea University, Korea
• Xiuhua Li, Beijing University of Posts and Telecommunications, China
• Lijun Zhang, Chinese Academy of Sciences, China

Local Coordination Co-Chairs
• Dongmei Sun, Beijing Jiaotong University, China
• Yuehua Dai, Samsung Electronics, China
• Hui Li, Xidian University, China
• Cheolkon Jung, Xidian University, China

Steering Committee
• Anup Kumar, (Chair) University of Louisville, USA
• Chi-Ming Chen, AT&T Labs, USA
• Chung-Min Chen, Iconectiv, USA
• Alok Srivastava, Microsoft, USA
• Jiangzhou Wang, University of Kent, UK

Financial Co-Chairs
• Sanjuli Agrawal, Indiana University Southeast, USA
• Yingbing Yu, Austin Peay State University, USA
• Kyungtae Kim, Sungkyunkwan University, Korea

Big Data Summit Co-Chairs
• Chung-Min Chen, Iconectiv, USA
• Jie Hu, Zynga Inc, USA
• Jean (Yujing) Liu, Comrise, USA

SDN&NFV Summit Co-Chair
• Yiqing Zhou, Chinese Academy of Sciences, China

Student Volunteer Co-Chairs
• Lu Liu, Beijing Jiaotong University, China
• Weiqian Shi, Beijing Jiaotong University, China
• Yin Zhang, Huazhong University of Science and Technology, China

Sansung-Xi'an Tour Chair
• Yuehua Dai, Samsung Electronics, China

Secretary and Coordinator
• Di Qiu, InfoBeyond Technology LLC, USA

Technical Program Committee
• Ahmed Badi, Florida Atlantic University, USA
• AlexandreKandalintsev, University of Trento, Italy
• AtillaElci, Aksaray University, Turkey
• Atta urRehman Khan, University of Malaya, Malaysia
• Antonio Abramo, University of Udine, Italy
• Benoit Hudzia, SAP Research, UK
• Bo Jiang, Intel, USA
• Chen Qian, University of Kentucky, USA
• Chukwuemeka David Emele, University of Aberdeen, UK
• Dejing Dou, University of Oregon, USA
• Ding-Yaeh Hung, WuFeng University, Taiwan
• Donglin Wang, New York Institute of Technology, USA
• DorsafAzzabi, Canadian University of Dubai, UAE
• Hsung-Pin Chang, National Chung Hsing University, Taiwan
• Hufeng Zhou, Brigham and Women's Hospital and Harvard Medical School, USA
• Hui Lu, Beihang University, P.R. China
• Cheng Chang, National DongHwa University, Taiwan
• Jing He, Kennesaw State University, USA
• JorgDummler, Chemnitz University of Technology, Germany
• Jun He, University of New Brunswick, Canada
• Manar Ibrahim FawziHosny, King Saud University, Saudi Arabia
• Man Ho Au, University of Wollongong, Australia
• Maurizio Dusi, NEC Laboratories Europe, Germany
• Min Wu, Oracle Corporation, USA
• Mohammad Shoeb khan, University of Louisville, USA
• Nicolas Sklavos, Technological Educational Institute of Patras, Greece
• Nuno Vasco Lopes, University of Minho, Portugal
• Omid Mahdi Ebadati E., THamdard University, India
• RajdeepBhowmik, Cisco Systems Inc., USA
• Ricardo Lopes Pereira, INESC-ID/Instituto Superior Técnico, Portugal
• Ricardo Rodriguez, Technological University of Ciudad Juarez, Mexico
• ShanmugasundaramHariharan, TRP Engineering College, India
• Song Cui, Stanford University, USA
• SubinShen, Nanjing University of Posts & Telecommunications, China
• Timothy W. Hnat, University of Memphis, USA
• Tuan T. Tran, InfoBeyond Technology LLC, USA
• Vic Grout, Glyndwr University, UK
• Wei-Da Hao, Texas A&M University-Kingsville, USA
• Weirong Jiang, Xilinx, USA
• Xian-Hua Han, Ritsumeikan University, Japan
• XinyuQue, IBM, USA
• Xuewen (Sean) Gong, Huawei Technologies, China
• YaserJararweh, Jordan University of Science and Technology, Jordan
• ZhanlinJi, University of Limerick, Ireland
• Zhefu Shi, Microsoft, USA
• Zhengyu He, Google, USA

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