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ITherm 2010 : 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems


When Jun 2, 2010 - Jun 5, 2010
Where Las Vegas, NV, USA
Submission Deadline Sep 30, 2009
Notification Due Oct 15, 2009
Final Version Due Dec 14, 2009
Categories    manufacturing

Call For Papers

ITherm 2010 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2010 will be held along with the 60th Electronic Components and Technology Conference (ECTC 2010 -, a premier electronic packaging conference. In additon to paper and poster presentations and vendor exhibits, ITherm 2008 will include panel discussions, keynote lectures by prominent speakers, and professional short courses.

It will be held from June 2-5, 2010 in Las Vegas, Nevada, USA at Bally's.

ITherm 2010 will feature original papers addressing latest developments in research and technology

Thermal Management
Emerging Technologies: Thermal, Thermomechanical and/or related underlying multidisciplinary issues
Panel Discussions
Poster Sessions

Oral and poster presentations will be featured. The first day of the conference will have short courses. Several keynote speeches on topics of current by experts in the field will be part of the conference program.

Important Dates:
Deadline for submission of Abstracts - September 30, 2009
Notification of Abstract Acceptance - October 15, 2009
Draft Paper Submission - December 14, 2009
Final Paper Submission - March 7, 2010
ITherm 2010 - June 2-5, 2010

Abstract and subsequent paper submissions are entirely web-based, with the above deadlines. Please submit a 400 word text-only (no figures and tables) abstract by clicking below. The Abstracts will be considered for oral or poster sessions. The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance.

Additional information on the conference will be posted on these pages in the future.

We hope to bring international experts in the fields of thermal management, mechanical and material aspects in electronic components and systems of pertinence to the current and emerging technologies. We look forward to your participation to make ITherm 2010 lively and intellectually stimulating.

Prof. Yogendra Joshi
Program Chair, ITherm 2008
G. W. Woodruff School of Mechanical Engineering
Georgia Institute of TEchnology
Atlanta, GA 30332 USA
Phone; 404-385-2810

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