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ICAM 2014 : International Conference on Advanced and Agile Manufacturing System | |||||||||||||||||
Link: http://www.oakland.edu/secs/icam2014 | |||||||||||||||||
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Call For Papers | |||||||||||||||||
2014 International Conference on Advanced and Agile Manufacturing Systems, ICAM-2014, May 28-30, 2014
Oakland University, Rochester, MI 48309, USA Sponsored by the International Society of Agile Manufacturing (ISAM), International Society for Productivity Enhancement (ISPE) and Oakland University, USA. CALL FOR PAPERS Papers should be submitted at: https://www.easychair.org/conferences/?conf=icam2014 To submit your abstract/full paper, you need to create an account as author at easychair.org web site. You need to submit at least 3 keywords , one per line in the keyword box. Identify the paper as “abstract” or “first draft” or “final paper”. If you experience any problem in submitting at the easychair.org, please contact Professor Subra Ganesan at: ganesan@oakland.edu IMPORTANT DATES Abstract deadline: January 15, Extended to March 5 2014 Acceptance of Notification is done by March 21, 2014 Submit the first draft of the paper for review by March 5 Extended to March 30, 2014 Reviewers comments and acceptance done by April 15, 2014 Submit the final paper by May 1, 2014 Conference Web site: http://www.oakland.edu/secs/icam2014 Paper Template to be used for submission is available at this link - Click to get it TO LEARN MORE CONTACT: Professor Subra Ganesan, Oakland University Phone: (248) 370-2206 (office) or (248) 635-5890 (cell), Email:ganesan@oakland.edu Registration Information Early registration April 15 $350 $300 $200 Next registration May 22 $400 $350 $225 Registration at event May 28-30 $425 $375 $225 **************** Sponsored by the International Society of Agile Manufacturing (ISAM), International Society for Productivity Enhancement (ISPE) and Oakland University, USA. CALL FOR PAPERS ICAM-2014 welcomes original papers on the following topics: • Agile Manufacturing Manufacturing Agility * The Agile Production System * Managing System-wide Change * Implementing Technology to Enhance Agility * Strategic Direction * Performance Measures Managing the Agile Organization * A 21st century paradigm * Agile Manufacturing and Change Management * Agile Manufacturing Enterprise Design * Issues, problems and future developments * Integrating Technology, Organization and People * Agile Customer-Supplier Relations * Mass Customization: The New Imperative in Business * Agile Product Development for Mass Customization * Virtual Manufacturing/Augmented Reality * Agile Manufacturing Facility, Synchronous Flow/Agile Manufacturing, * Agile Manufacturing Information Systems * Agile Practices * Agile Processes * Agile Enabling Technologies • Advanced Manufacturing Systems World Class Manufacturing * Next Generation Manufacturing * Innovative Processes Micro-Manufacturing * Intelligent Sensors and Controls * Robotics * Intelligent Control, Flexible and Agile Assembly in Manufacturing Systems * Virtual Environment and Systems * Embedded and Ubiquitous Computing * Evolutionary Computing, Neural Network * Fuzzy Logic * Genetic Algorithms * Decision Support Constraints and Optimization * Flexible Manufacturing Systems • Manufacturing Automation, Modeling and Simulation *CAD/CAM, *CAE, *CAPP, *CNC, *DNC, *FMS, *CIM, *Robotics, *AGVs, *AS/RS, * Mechatronics and low-cost automation, * System modeling and simulation, *Sensors for intelligent manufacturing. • Agility in Manufacturing processes, Tools and system *Casting, *Forming * Joining *Processing of non-metals *Composites and advanced materials * Material treatment & surface modification/ Engineering *Severe Plastic Deformation Processes * Process modeling & simulation * Kinematics Drives & controls, * Design and development of conventional and unconventional machine tools, * Cutting tools, * Tooling for production, * Assembly and disassembly, * Machine tool vibration, * Machine tools for micromachining, * Noise & Condition monitoring. • Quality Engineering *Metrology, * Ultra precision measurements * Machine Vision * Ergonomics * Reliability engineering. • Concurrent Engineering Collaborative Decision Making * Planning and Scheduling * Product and Process Integration * Organization and Management * Information and Process Modeling * Networking and Distribution * Reasoning and Negotiation * Concurrent Engineering Framework * Data Exchange Process * Practical Applications * Design Automation * Design Theory and Methodology * Rapid Prototyping • Integrated Product and Process Development and Product Innovation Product Development into the 21st Century * Integrated Product &- Process Design and Development Team Method * Product Cost Analysis * Product Functional Requirements and Decomposition * Translating Customer Requirements into Products * Product Conception and Embodiments * Design for Assembly and Disassembly * Manufacturing Process and Design * Product and Process Improvement • Virtual Reality and Its Applications Virtual and augmented reality * Virtual humans and artificial life * Real-time collision detection algorithms * Case studies and emerging technologies * Graphics algorithms and applications * Image data structures for computer graphics * Visual computing and graphics * Curves and meshes * 3D reconstruction * Illumination and reflection techniques * Shadows, translucency and visibility * Modeling of natural scenes and phenomena * Surface modeling * Visualization * Modeling techniques * Sound rendering technologies * Rendering methods • Agile Software Development Agile software development approaches and methodologies * Agile testing and quality assurance * Requirements management in agile development * Agile development for safety-critical systems * Industrial experiences in agile software development * Experiments and quasi-experiments * Software architecture in agile development * Scaling up agile methodologies * Benefits of agile development * Transitioning from traditional to agile development * Agile software product development • Manufacturing Education STEM Education * New Developments in Engineering and Technology Curriculum * Accreditation issues * Workforce Development * Project Based Learning * Engineering Competitions • Miscellaneous topics Clean and Green Manufacturing to mitigate Global Pollution, Soft Computing applications in manufacturing, General Systems Theory and it’s Applications including Socio-economic systems and Business systems • Review Procedure Scientific papers will undergo a review process before being finally accepted. Also papers of a more practical content will be welcomed, such as case studies and descriptions, experiences with agile systems, etc. • Proceedings Pre-conference Proceedings will be published on a CD and will be distributed to the attendees. • Invitation for paper submission and presentations Papers and presentations from government, academia and industry are invited. The deadline to submit abstract, not exceeding 250 words is March 5, 2014. Please send the abstract along with contact information to: GANESAN@OAKLAND.EDU OR Please visit conference website http://www.oakland.edu/secs/icam2014 and submit the abstract / full paper at https://www.easychair.org/conferences/?conf=icam2014 You will be assigned an ID for the abstract and receive notification through e-mail. Selected papers from this conference will be published in the "International Journal of Agile Manufacturing (IJAM)” www.Isam1.org the International Journal of Advanced Manufacturing Systems (IJAMS)" and other member journal of IAJC www.iajc.org. Call for presentations from Industry and Government (Presentations only): One page proposals can be submitted by March 15, 2014. Please send the proposals along with contact information to: ganesan@oakland.edu Important Dates: Submission of abstract: March 5, 2014 Notification of abstract: March 21, 2014 Submission of full paper for review: MARCH 30, 2014 Notification of acceptance to authors with reviewers’ comments :APRIL 15, 2014 Submit final manuscript, copyright form: May 1, 2014 Registration fee “Registration is compulsory for one author per paper for a paper to appear in Electronic Proceedings (CD) and be considered for journal publication. Registration fee Details Before April 15, 2014 Up to May 22, 2014 At the Conference door Authors and Delegates USD 350 USD 400 USD 425 Non-USA authors/Delegates USD 300 USD 350 USD 375 Student Delegates USD 200 USD 225 USD 225 Registration fee may be sent as Demand draft/Cheque/Check be sent favor of "ICAM 2014" and mail to: Dr. Subra Ganesan Professor Department of Electrical and Computer Engineering Oakland University 2200 Squirrel Road, Rochester Hills, MI 48309, USA Phone 248 635 5890 Cell E-mail: ganesan@oakland.edu Registration using credit card is also possible and information will be made available later. Invitation for Special Sessions Active researchers and practitioners are invited to organize sessions as part of the main conference. Each session should have five quality papers. If you are interested to organize a session and wish to chair or co-chair sessions please contact the Conference Chairmen. Accommodation A number of hotels are located close to the conference venue,. A detailed list of hotels will be available on the conference website. Accommodation in these hotels can be booked for discounted pricing through online. Organizing Committee General Chairman Dr. Subra Ganesan, Professor Department of Electrical and Computer Engineering Oakland University, Rochester, MI 48309, USA ganesan@oakland.edu Chairman ISAM & ISPE (USA) and Conference Honorary Chairman Dr. Suren Dwivedi, P.E Past President ISAM, Chief Editor IJAMS University of Louisiana, Email: suren7483@gmail.com Conference Honorary Chairman (India) and President ISAM Dr. K. Hans Raj, Professor Department of Mechanical Engineering Dayalbagh Educational Institute Dayalbagh, Agra, UP, India Email: khansraj@rediffmail.com Technical Committee Dr. S.K.Sharma, Professor , Mechanical Engineering, IIT BHU Banaras, India. Sksharma.me@ibhu.ac.in Technical Committee Dr. Biren Prasad Dr. Robert Vantil Dr. Chris Wagner Dr. Syed Nassar. Prof. Pavel Ikonomov, Western Michigan University, USA. Technical committee Prof. J.L. Chenot, Advisor, CEMEF Laboratory, Ecole De Mines Des Paris, Sophia Antipolis, France. Prof. Anand Srivastava, Department of Computer Science, University of Kiel, Germany. More members to be added. |
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