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ECTC 2009 : IEEE 59th Electronic Components and Technology Conference


When May 26, 2009 - May 29, 2009
Where San Diego, CA, USA
Submission Deadline Oct 15, 2008
Notification Due Dec 15, 2008
Final Version Due Feb 25, 2009
Categories    manufacturing

Call For Papers

Major Topics

Papers presenting new developments and knowledge in the following areas are invited.
Please select two subcommittees that should consider your paper. The work submit-
ted should be original,not previously published,and avoid the inclusion of com-
mercial content.

- Advanced Packaging: Design,development,fabrication,testing,and characterization
of advanced packaging and novel component integration technologies involving elec-
tronics,photonics,MEMS and their innovative configurations for applications related to
computing,sensing,imaging,photovoltaic,high power and bio-medical systems. Special
emphasis will be on solutions for high performance,density,and thermal management
related to systems involving 3D integration,through silicon vias (TSVs),flip-chip,and
fine pitch and high lead count packaging in CSP, WLP, BGA,CGA,LGA and SMT pack-
ages for both Pb-based and Pb-free packages.

- Applied Reliability: Advances in reliability assessment and prediction at the system,
PWB or package level,reliability testing and data analysis,reliability modeling of ac-
celerated testing,reliability issues in emerging technologies,medical electronics and
consumer electronics,reliability physics,reliability predictions,reliability test methods and failure analysis.

- Assembly and Manufacturing Technology:Advanced process and equipment im-
provement for volume production of emerging technology,including: Advanced pack-
aging,system in package,package on package,bumping and flip chip,die thinning and
stacking,low-K device,photonic device ,MEMS and optoelectonics,product and sys-
tem level assembly,electrical/mechanical/green performance and board level assembly.

- Electronic Components & RF: Discrete Passive Components;integrated and
embedded passive and active components integration on silicon ceramic,organic
substrates;electronic components-design,materials,processing,test,characterization;
new technology development for components - silicon through vias,wafer level RDL,
nano materials and processes;tunable materials,structures,devices and switches;
RFID/sensors,RF MEMS,integrated antennas,filters,baluns;components and modules
for WLAN,UWB,mobile PC and multi-band radio applications.

- Emerging Technologies: Design,fabrication,modeling and performance aspects of
materials,devices,systems and packaging in the areas of bioelectronics such as bio-
medical,bioengineering,biosensors and electronics for medical devices;organic/print-
able electronics;portable power supplies such as fuel cells;and other novel packaging.

- Interconnections: Interconnect innovation/design/process on all packaging levels
including wire bonding,flip chip,3D and through Si via connections,first-level package
and printed circuit board. Topics may range from bump and under bump metallurgy,
electromigration,conductive polymers and nano material based interconnects,novel
enabling techniques,electrical performance,to environmental concerns.

- Materials & Processing: Materials and processes for traditional and advanced micro-
electronic systems,3D packages,WLP andTSV,photonics,MEMS,solar and biomedical
packaging that enhance mechanical,thermal,electrical and optical performance and
cost effectiveness. This includes advances in adhesives,nano-materials,embedded
active and passive components,flexible and printed electronics,magnetic,optical and
thermal interface materials,Pb-free solders,alloys and assembly processes.

�?� Modeling & Simulation: Electrical,thermal,optical and mechanical modeling,simula-
tion and characterization of packaging solutions including system-level applications.
Example topics include assembly manufacture modeling,Cu low-K interconnects,drop
impact models,embedded passives,equivalent circuit models,fullwave modeling,lead-
free solders,macromodeling,measurements and thermo-mechanical reliability.

- Optoelectronics: Packaging and technology for optoelectronic modules,components
and devices including amplifiers,transmitters,receivers,integrated photonics,passive
components,fiber optics,optical sensors,chip-chip,backplanes interconnect and stor-
age. Special interest topics include high power lasers,high-brightness LEDs,thermal
management and reliability,micro-optic packaging & manufacturing,silicon photonics,
photovoltaics,integrated optical sensors,nano-optics,RF over fiber,optoelectronics for
space applications and harsh environments,and advanced optoelectronic materials.

- Posters: Papers may be submitted on any of the listed major topics;presentation of
papers in a poster format is highly encouraged at ECTC.

Paper Submission

You are invited to submit a 750-word abstract that describes the
scope,content,and key points of your proposed paper via the
ECTC website at Please check the website for
details on how to submit abstracts electronically. For additional
information regarding abstract and paper submissions,please contact

Abstracts must be received by October 15, 2008. Your
submission must include the mailing address,business telephone
number,facsimile number and email address of the presenting
author and affiliations of all authors. Please indicate two program
subcommittees in order of preference that should evaluate your
paper for acceptance. Authors will be notified of paper acceptance
with instructions for publication by December 15,2008. At the
discretion of the program committee,abstracts submitted may be
considered for poster sessions.

Manuscripts are due in final form for publication in the Conference
Proceedings by February 25,2009. The work submitted should
be original,not previously published,and avoid inclusion of
commercial content. In addition to a printed copy conforming
to the ECTC format,a computer file for the CD-ROM is needed in
the preferred MSWord format.

Special Paper Recognition

Best PaperAward: Each year the ECTC selects the best paper
whose author(s) receive an ECTC personalized wall plaque and
share a check for $2500.

Best Poster Award: Each year the ECTC selects the best poster
paper whose author(s) receive an ECTC personalized wall plaque
and share a check for $1500.

Outstanding Paper Award: An outstanding conference paper
is also selected for special recognition by the ECTC. The author(s)
receive a personalized wall plaque and share a check for $1000.

Outstanding Poster Award: An outstanding poster paper is also
selected for special recognition by the ECTC. The author(s) receive
a personalized wall plaque and share a check for $1000.

Intel Best Student PaperAward: Intel Corporation is
sponsoring an award for the best paper submitted and presented by
a student at the ECTC. The winning student will be presented with
a wall plaque and a check for $2500. See next column for details.

IEEE CPMT Transactions: In addition to the publication of
papers in the Conference Proceedings,a selection of the top papers
is published in a special issue of the IEEE CPMTTransactions.

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