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ICICTES 2014 : The International Conference on Information and Communication Technology for Embedded Systems

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Link: http://saki.siit.tu.ac.th/icictes2014
 
When Jan 23, 2014 - Jan 25, 2014
Where Ayutthaya, Thailand
Submission Deadline Nov 24, 2013
Notification Due Dec 14, 2013
Final Version Due Dec 22, 2013
Categories    embedded system   embedded software   automotive engineering   testing techniques
 

Call For Papers

CALL FOR PAPER (FIRST DRAFT)
The fifth International Conference of Information and Communication Technology for Em
bedded Systems (IC-ICTES 2014) is established to provide an international forum for researchers and industry practitioners to share their new ideas, original research results and practical development experiences from all embedded system-related areas including ubiquitous computing, pervasive computing, embedded system design, development of new HW/SW-related theories and techniques in embedded systems , information and
communication technology for supporting development of embedded systems, and information and communication technology used in embedded systems.

AREAS OF INTEREST

The conference calls for research papers reporting original investigation results of research and development on real embedded system applications and their system development. Topics in IC-ICTES 2014 are listed below, but not limited to:
A. Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, embedded microcontrollers.
B. Real-time systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design.
C. Embedded hardware support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, veriable systems, performance modeling, validation, security issues, real-time behavior and safety critical systems.
D. Embedded software: Compilers, assemblers and cross assemblers, programming, memory management, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distribut ed/resource aware OS, OS and middleware support.
E. Hardware/software co-design: Methodologies, test and debug strategies,real-time systems, specification and modeling,design representation, synthesis, partitioning, estimation, design space exploration beyond traditional hardware/software boundary and algorithms.
F. Testing techniques: All aspects of testing, including design-for-test, test synthesis, built-in self-test, embedded test, for embedded and systern-on-a-chip systems.
G. Application-specific processors and devices: Network processors, real-time processor, media and signal processors, application specific hardware accelerators, econfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand-held devices, flash memory chips.
H. Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics.
I. Embedded computing education: Curriculum issues, teaching tools and methods.
J. Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., pervasive or ubiquitous computing, embedded internet tools) and new principle (e.g., embedded Engineering).
K. Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion.
L. Automotive Engineering: Automotive design, new challenges on development of autoparts and automatives, safety engineering, fuel economy/emissions,vehicle dynamics, NVH engineering, automotive performance, shift quality, durability/corrosion engineering, package/ergonomics engineering, climate control, derivability, program timing,
assembly feasibility,automotive embedded systems.

CONFERENCE PUBLICATION AND PAPER SUBMISSION
Proceedings will be published by TAIST Tokyo Tech Program, National Science and Technology Development Agency (NSTDA). The first page should include the paper title, the names and the complete mailing addresses of all authors, and the e-mail address of the corresponding author. Each paper should consist of up to 200-word abstract, up to 5 keywords. All the text, figures and reference must be between 4-6 double-column A4 pages with font size of 10 points. Authors MUST use IEEE manuscript submission guidelines (available at http://www.ieee.org/authors.html ) for their initial submissions. All papers must be submitted electronically in PDF format only, using the conference management tool. The submitted papers must not be published or under consideration to be published elsewhere.

Organizing Committee

Honorary Chairs
Vudtechai Kapilakanchana, Kasetsart University
Nobuo Fujii, Tokyo Institute of Technology
Somkit Lertpaithoon, Thammasat University
Pansak Siriruchatapong, NECTEC

General Chairs (Conference Chairs)
Thanya Kiatiwat, Kasetsart University
Hiroaki Kunieda, Tokyo Institute of Technology
Somnuk Tangtermsirikul, SIIT, Thammasat University
Asanee Kawtrakul, NECTEC
Somnuk Sirisoonthorn, NSTDA

Technical Program Chairs (ICTES)
Tsuyoshi Isshiki, Tokyo Institute of Technology
Thanaruk Theeramunkong, SIIT, Thammasat University
Waree Kongprawechnon, SIIT, Thammasat University
Chalie Charoenlarpnopparut, SIIT, Thammasat University
Kanokvate Tunpimolrut, NECTEC
Kamol Kaemarungsi, NECTEC
Pisut Raphisak, Kasetsart University
Teerasit Kasetkasem, Kasetsart University

Finance Chairs
Gun Srijuntongsiri, SIIT, Thammasat University
Denchai Worasawate, Kasetsart University
Teera Phatrapornnant, NECTEC
International Advisory
Akinori Nishihara, Tokyo Institute of Technology

Local Arrangement Chairs
Boontawee Suntisrivaraporn, SIIT, Thammaset University
Pakinee Aimmanee, SIIT, Thammasat University

Special Session Chair
Nobuhiko Sugino, Tokyo Institute of Technology

Publicity Chairs
Srijidtra Mahapakulchai, Kasetsart University
Itthisek Nilkhamhang, SIIT, Thammasat University

Publication Chairs
Toshiaki Kondo, SIIT, Thammasat University
Siriroj Sirisukpresert, Kasetsart University

Publication Assistants
Nattapong Tongtep, SIIT, Thammasat University
Nongnuch Ketui, SIIT, Thammasat University

Webmaster
Wirat Chinnan, SIIT, Thammasat University

Supporters
National Electronics and Computer Technology Center
ECTI Association
IEEE Thailand Section

Organizers
Sirindhorn International Institute of Technology, Thammasat University (http://www.siit.tu.ac.th)
Department of Electrical Engineering, Kasetsart University (http://www.ee.ku.ac.th)
Tokyo Institute of Technology (http://www.titech.ac.jp)
More Information

Any question can be sent to process at :
Dr. Thanaruk Theeramunkong
Sirindhorn International Institute of Technology, Thammasat University, Thailand
Phone: +66-2-501-3505 ext. 2004 Fax: +66-2-501-3505 ext. 2001 Email: icictes14[at]siit.tu.ac.th

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