posted by user: kolossac || 3921 views || tracked by 8 users: [display]

ECWC 2014 : 13th Electronic Circuits World Convention

FacebookTwitterLinkedInGoogle

Link: http://www.ecwc13.org
 
When May 7, 2013 - May 9, 2013
Where Nuremberg, Germany
Submission Deadline Sep 13, 2013
Notification Due Sep 13, 2013
Final Version Due Sep 13, 2013
Categories    electrical engineering   electronics   pcb   packaging
 

Call For Papers

*****************************************************
CALL FOR PAPERS
13th Electronic Circuits World Convention (ECWC13)
May 7 - 9 2014, Nuremberg, Germany
Organizer: EIPC - European Institute of Printed Circuits
*****************************************************

THE CONFERENCE
The 13th Electronic Circuits World Convention (ECWC13) will take place from 7 - 9 May 2014 in conjunction with the SMT Hybrid Packaging exhibition. The conference is organized every three years alternately by the members of the WECC association. In 2014, for the first time in eleven years the conference will be hosted in Europe.

==========

THE TOPICS

Management
M1 Global Market Trends and Outlook
M2 Supply Chain Management
M3 Environment, Health and Safety
M4 Business Models and Strategy
M5 Certification and Qualifications
M6 Total Cost of Ownership and Overall Equipment Efficiency


Technology
T1 Design and Development Tools
T2 Materials, Components and Traceability
T3 Manufacturing
T3.1 Equipment
T3.2 Technology
T3.3 Process Development
T3.4 Automation
T4 Quality, Test and Life Cycle Management
T5 PCB Processes
T5.1 Chemical Technology
T5.2 Mechanical Technology
T5.3 Optical Technology
T6 Surface Mounting, Assembly and Interconnection
T7 Packaging Technology
T7.1 System in Package
T7.2 Wafer-Level Packaging
T7.3 Panel-Level Packaging
T8 Energy and Resource Efficiency
T9 Application Specific Areas
T9.1 Automotive Electronics and Electromobility
T9.2 Industrial and Power Electronics
T9.3 Aerospace and Defence
T9.4 Medical Electronics
T9.5 Consumer Electronics
T10 Advanced and Emerging Technologies

==========

SUBMISSION
Abstracts need to use the provided submission template.
PDFs of the abstract to be uploaded online at http://www.mesago.de/en/ECWC/The_Conference/Submission/index.htm
or www.ecwc13.org

==========

CONFERENCE LANGUAGE
English

==========

PRESENTATION TYPES
Oral presenation, poster presentation

==========

Related Resources

MIPRO 2020   43rd International Convention on Information, Communication and Electronic Technology
EI--ICVISP 2020   2020 4th International Conference on Vision, Image and Signal Processing (ICVISP 2020)
ASYNC 2020   26th IEEE International Symposium on Asynchronous Circuits and Systems
IEEE ICSGSC--EI, Scopus 2020   2020 The 4th. IEEE International Conference on Smart Grid and Smart Cities (ICSGSC 2020)--EI Compendex, Scopus
ESIC 2020   International Conference on Electronic Systems and Intelligent Computing
CIPSBSN 2020   Special Issue Computational Intelligence for Physiological Sensors and Body Sensor Network
WCCI 2020   World Congress on Computational Intelligence
SPIES--IEEE, Ei Compendex and Scopus 2020   IEEE--2020 2nd International Conference on Smart Power & Internet Energy Systems (SPIES 2020)--Ei Compendex, Scopus
2nd ICTEL 02-03 March, Melbourne 2020   2nd ICTEL 2020 – International Conference on Teaching, Education & Learning, 02-03 March, Melbourne
AECCC--ACM, Ei and Scopus 2020   ACM--2020 2nd African Electronics, Computer and Communication Conference (AECCC 2020)--Ei Compendex and Scopus