IEEE Sensors MIS 2014 : IEEE Sensors Special Issue Material Integrated Sensing
Call For Papers
Call for Papers IEEE Sensors Journal Special Issue on Material-Integrated Sensing
!!! Deadline extended to 31/8/2013 !!!
Realizing truly intelligent materials requires endowing them with the capability to gather information about themselves and their environment, complemented by material-integrated data evaluation and ability for internal/external communications. This allows context-dependent response and thus distinguishes this class of materials from e.g. self-healing concepts, in which response is hard-wired. Currently, context-dependent capabilities are realized on a component or structural level. However, in the near- to mid-term future, material integration to a system level will become possible by trends such as component miniaturization.
This Special Issue aims to provide an overview of the current achievements along this top-down approach, towards material-integrated intelligence. It will target review articles reflecting the present state of trend setting research and defining technological fields within their scope. We also invite accompanying research papers detailing the latest developments in the field, as well as case studies describing the application of material-integrated systems.
• Sensors and electronics for material integration: compliance with process/material, case studies
• Interfacing technologies: interconnects (electrical/optical), packaging and compliance
• Reliable and robust data processing: real-time evaluation, artificial intelligence methods
• Reliable and robust communication: communication protocols and hardware solutions
• Energy supply: energy harvesting, management, distribution and storage
• Application scenarios: structural health monitoring, “fly-by-feel“, vibroacoustic control
Other topics, clearly falling under the title of the Specal Issue, shall be considered for inclusion.
Paper submission must be done online:
When submitting, please indicate in the “Manuscript Type” roll-down menu, and also by e-mail to Ms. Alison Larkin (email@example.com), that the paper is intended for the “Material-integrated Sensing” Special Issue.
The guidelines for paper preparation and submission are available here:
• Walter Lang, IMSAS, University of Bremen, GER
• Fu-Kuo Chang, Stanford University, USA
• Paul C.-P. Chao, National Ciao Tung University, TWN
• Stefan Bosse, WG Robotics, University of Bremen, GER
• Dirk Lehmhus, ISIS, University of Bremen, GER