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MII 2013 : 2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics (MII 2013)

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Link: http://www.mii-conf.org/index.htm
 
When Sep 1, 2013 - Sep 2, 2013
Where Hong Kong
Abstract Registration Due Jul 1, 2013
Submission Deadline Jul 15, 2013
Notification Due Jul 18, 2013
Final Version Due Jul 30, 2013
Categories    mechanical engineering   industrial materials   industrial electronics
 

Call For Papers

Date:September 1-2, 2013 Place: Hong Kong
Book:"Applied Mechanics and Materials" Sponsors: TTP& IERI
Main topics:New Materials and Advanced Materials, Mechanical Engineering and Industrial Electronics
Email:mii2013vip@163.com Tel:+86 13638690309 or 027-87772193

2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics (MII 2013) will be held on September 1-2, 2013, Hong Kong.All accepted papers will be published on international journal"Applied Mechanics and Materials" and will be sent for index in the major academic databases, including EICompendex, Thomson ISI (ISTP) and other indexing services. We look forward to meeting you in Hong Kong.


2013年机械工程、工业材料以及工业电子学术研讨会征文启事

2013年机械工程、工业材料以及工业电子学术研讨会将于2013年9月1-2日在香港举行。所有被录用的文章,将发表在TTP出版社出版的国际期刊“应用力学和材料”并送检EI和ISTP。我们期待您的参与,香港见。更多的信息请点击官方网站http://www.mii-conf.org/index.htm
Email:mii2013vip@163.com
Tel:+86 13638690309 or 027-87772193

MII2013组委会

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