IMPACT 2008 : 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.

posted by system || 2220 views || tracked by 2 users: [display]

IMPACT 2008 : 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.

Link: http://www.impact-emap.org/2008/CallPaper/

When	Oct 22, 2008 - Oct 24, 2008
Where	Taipei, Taiwan
Submission Deadline	May 31, 2008

Categories manufacturing

Call For Papers

[Empty]

Related Resources

AITA 2025 3rd International Conference on Artificial Intelligence: Theory and Applications

MSEJ 2025 Advances in Materials Science and Engineering: An International Journal

SSGRB 2026 3rd Sustainable Solutions for Growth - Research and Business

IEEE-EI/Scopus-ISF 2025 2025 Information Science Frontier Forum and the Academic Conference on Information Security and Intelligent Control-IEEE Xplore/EI/Scopus

ISCMI 2025 2025 12th International Conference on Soft Computing & Machine Intelligence (ISCMI 2025)

EI/Scopus-ICDSIC 2025 2025 International Conference on Digital Society and Intelligent Computing-EI/Scopus

EduTeach 2025 9th Canadian Conference on Advances in Education, Teaching & Technology 2025

IEEE-EI/Scopus-ETAE 2025 2025 2nd International Conference on Electrical Technology and Automation Engineering-EI/Scopus

Ei/Scopus-IPCML 2025 2025 International Conference on Image Processing, Communications and Machine Learning (IPCML 2025)

ICoSR 2025 2025 4th International Conference on Service Robotics