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WD 2013 : Wireless Days 2013


When Nov 13, 2013 - Nov 15, 2013
Where Valencia, Spain
Submission Deadline Aug 9, 2013
Notification Due Sep 12, 2013
Final Version Due Sep 25, 2013

Call For Papers



Wireless Days 2013
November 13-15, 2013, Valencia, Spain

Technically Co-sponsored by IFIP and IEEE Communications Society

Conference proceedings will be submitted to IEEE Xplore


Important Dates:

Submission deadline (Firm deadline): August 9, 2013
Notification of acceptance: September 12, 2013
Camera-ready version: September 25, 2013



The Wireless Days Conference is a major international conference which aims to bring together researchers, engineers, students, technologists and visionaries from academia, research centers and industry, to exchange, discuss, and share their experiences, ideas and research results on both the theoretical and practical aspects of wireless networking.

After the successful editions of Wireless Days 2008 in Dubai, UAE (43.8% acceptance ratio), Wireless Days 2009 in Paris, France (37.6% acceptance ratio), Wireless Days 2010 in Venice, Italy (32.6% acceptance ratio), Wireless Days 2011 in Niagara Falls, Canada (35% acceptance ratio), and Wireless Days 2012 in Dublin, Ireland (34.8% acceptance ratio), the sixth edition of Wireless Days will be held in Valencia, Spain, on November 13-15, 2013. Wireless Days 2013 will include presentations of both theoretical and experimental achievements, innovative wireless systems, prototyping efforts, case studies and advances in technology related to wireless networking and communication infrastructures.

The Wireless Days program will be split into the following six conference tracks:

- Track 1: Ad Hoc and Sensor Networks
- Track 2: Wireless Network Protocols and Applications
- Track 3: Vehicular and Delay Tolerant Networks
- Track 4: Broadband Wireless
- Track 5: Wireless Models and Simulations
- Track 6: Wireless and Mobile Network Management

Papers Submission:

Submissions should be original and limited to 6 double-column pages (Maximum of 2 additional pages allowed - 8 pages in total - with over-length page fee) and should follow IEEE paper templates. Papers are to be submitted electronically on the EDAS web site of the conference in PDF format.

Special Issues of Journals:

Selected papers will be Awarded and invited to submit an extended version for publication in special issues of the Annals of Telecommunications journal (Springer) – JCR indexed


General Chairs:
Juan-Carlos Cano, Universitat Politecnica de Valencia, Spain

Technical Program co-Chairs:
Carlos T. Calafate, Universitat Politecnica de Valencia, Spain
Luis Henrique Maciel Kosmalski Costa, Federal University of Rio de Janeiro, Brasil

Track Chairs:

Track 1: Ad Hoc and Sensor Networks
Thierry Gayraud, University of Toulouse, France
Xiaoyan Hong, The University of Alabama, USA

Track 2: Wireless Network Protocols and Applications
Dongkyun Kim, Kyungpook National University, South Korea
Rolland Vida, Budapest University of Technology and Economics, Hungary

Track 3: Vehicular and Delay Tolerant Networks
Antonio Skarmeta, Universidad de Murcia, Spain
Falko Dressler, University of Innsbruck, Germany

Track 4: Broadband Wireless
Floriano De Rango, University of Calabria, Italy
Manuel Ricardo, University of Oporto, Portugal

Track 5: Wireless Models and Simulations
Gustavo Marfia, University of Bologna, Italy
Marco Fiore, IEIIT-CNR, Italy

Track 6: Wireless and Mobile Network Management
Luiz DaSilva, Virginia Tech, USA
Daniel Macedo, UFMG, Brazil

Steering committee:
Khaldoun Al-Agha, University Paris 11, France
Ian F. Akyildiz, Georgia Institute of Technology, USA
Boutaba Raouf, University of Waterloo, Canada
Tijani Chahed, Telecom & Management SudParis, France
Pedro Cuenca, Universidad de Castilla-la-Mancha, Spain
Luigi Fratta, Politecnico di Milano, Italy
Mario Gerla, University of California at Los Angeles, USA
Ulf Korner, Lund University, Sweden
Guy Pujolle, University of Paris 6, France
Nadjib Achir, University of Paris 13, France
Khaled Boussetta, University of Paris 13, France

For more information see

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