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SESP 2013 : First International Workshop on Security in Embedded Systems and Smartphones

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Link: http://doe.cs.northwestern.edu/SESP/
 
When May 7, 2013 - May 7, 2013
Where Hangzhou, China
Submission Deadline Feb 1, 2013
Notification Due Feb 27, 2013
Final Version Due Mar 10, 2013
 

Call For Papers

Embedded computing has recently become more and more present in devices used in everyday life. A wide variety of applications, from consumer electronics to biomedical systems, require building up powerful yet cheap embedded devices. In this context, embedded software has turned out to be more and more complex, posing new security challenging issues. We broadly view that smartphones as mobile embedded systems.

This workshop aims to bring together the research efforts from both the academia and industry in all security and privacy aspects related to embedded systems and smart phones. We encourage submissions on all theoretical and practical aspects, as well as experimental studies of deployed systems. Topics of interests include (but are not limited to) the following subject categories related to embedded systems and smart phone:

Secure embedded system architecture
System‐level security design and simulation techniques for Embedded Systems
Verification and validation of Embedded Systems
Security and privacy for Cyber physical systems (Internet of Things) and networked sensor devices
Security implications for multicore, SoC‐based, and heterogeneous Embedded Systems and applications
Secure data management in Embedded Systems
Middleware and virtual machines security in Embedded Systems
Secure management of virtualized resources
Authenticating users to devices and services
Mobile Web Browsers
Usability
Rogue application detection and recovery
Vulnerability detection and remediation
Secure application development
Cloud support for mobile and embedded system security

Authors are invited to submit either Research Papers or Position Papers or both. Position Papers that define new problems in embedded systems and smartphones security or provide visions and clarifications of embedded systems and smartphones security are solicited. Regular Research Papers that present novel research results on security and privacy in embedded systems and smartphones.

Submission
Submissions must be written in English with at most 8 pages including the bibliography and appendices. Submissions must be in double‐column ACM format with a font no smaller than 9 point. Please use the ACM SIG Proceedings Templates (download here). Only PDF files will be accepted. Accepted papers will be published by ACM Press as conference proceedings in USB thumb drives and in the ACM Digital Library. Electronic submission site: http://seclab.soic.indiana.edu/sesp13/.

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