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IESS 2013 : International Embedded Systems Symposium

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Conference Series : International Embedded Systems Symposium
 
Link: http://www.iess.org/
 
When Jun 17, 2013 - Jun 19, 2013
Where Paderborn, Germany
Submission Deadline Dec 7, 2012
Notification Due Jan 21, 2013
Final Version Due Feb 11, 2013
Categories    embedded systems
 

Call For Papers

International Embedded Systems Symposium (IESS) 2013

June 17 ­ 19, 2013
Paderborn, Germany

http://www.iess.org/
http://www.facebook.com/InternationalEmbeddedSystemsSymposium

Important Dates
---------------

- Paper Submissions: December 7, 2012
- Acceptance of Notifications: January 21, 2013
- Camera Ready Papers: February 11, 2013
- Symposium Dates: June 17-19, 2013

Conference Theme
----------------

Over recent years, embedded systems have gained an enormous amount of
processing power and functionality. Many of the formerly external
components can now be integrated into a single System-on-Chip. This
tendency has resulted in a dramatic reduction in the size and cost of
embedded systems. As a unique technology, the design of embedded systems is
an essential element of many innovations. Embedded systems meet their
performance goals, including real-time constraints, through a combination
of special-purpose hardware and software components tailored to the system
requirements. Both the development of new features and the reuse of
existing intellectual property components are essential to keeping up with
ever demanding customer requirements. Furthermore, design complexities are
steadily growing with an increasing number of components that have to
cooperate properly. Embedded system designers have to cope with multiple
goals and constraints simultaneously, including timing, power, reliability,
dependability, maintenance, packaging and, last but not least, price. The
significance of these constraints varies depending on the application area
a system is targeted for. Typical embedded applications include
multi-media, automotive, medical, and communication devices.

The goals of the International Embedded Systems Symposium are to present
exchange and discuss the state of the art, novel ideas, actual research
results, and future trends in the field of embedded systems. Contributors
and participants from both industry and academia are encouraged to take
active part in this symposium.

Topics
- Specification and modeling of embedded systems
- Design methodology for embedded systems
- Validation and verification of embedded systems
- New technologies and trends for embedded systems
- Hardware/software co-design
- Re-configurable architectures and applications
- Software synthesis for embedded systems
- Distributed and modular controller architectures
- Network and communication systems
- Dependability and fault tolerance
- Power management and optimization
- Virtual reality for embedded systems
- Automotive, Avionic and Medical applications
- Case studies of innovative embedded systems

Submission
----------

The Proceedings will be published by Springer, the official publisher of
IFIP. IMPORTANT: Springer changed the layout for the IFIP series. Full
details on how to format your paper can be found at the web site of the
conference publisher Springer
(http://www.springer.com/computer/lncs?SGWID=0-164-7-72376-0). Springer
will contact you if the paper is not in the proposed layout. Accepted full
papers have a page limit of 12 pages, short papers of 8 pages. Again,
please make sure to use the right paper style. Please submit all source
files (LaTeX or Word only) of your paper including a PDF or PS file into
one zip-archive and upload it using your paper ID and password to the
submission system. Only zip-archive will be accepted by the system.


For further details on submission see: www.iess.org

Location
--------

The conference will be held in "Heinz Nixdorf Museum" (HNF), the largest
computer museum in the world, see also www.hnf.de

Organizing Committee
--------------------

General Chairs
Achim Rettberg, Carl v. Ossietzky University, Oldenburg, Germany
Mauro C. Zanella, ZF Friedrichshafen AG, Friedrichshafen, Germany

General Co-Chair
Franz J. Rammig, University Paderborn, Germany

PC Co-Chair
Marcelo Götz, Federal University of Rio Grande do Sul, Brazil
Gunar Schirner, Northeastern University Boston, USA

Local Arrangement Chair:
Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany

Publicity Chair
Marco Wehrmeister, Santa Catarina State University, Brazil

Web Chair:
Tayfun Gezgin, OFFIS - Insitute for Information Technology - Oldenburg, Germany

Finance Chair:
Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany

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