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ICKEM 2013 : 2013 3rd International Conference on Key Engineering Materials


When Mar 8, 2013 - Mar 9, 2013
Where Kota Kinabalu, Malaysia
Submission Deadline Jan 1, 2013
Notification Due Jan 20, 2013
Final Version Due Feb 5, 2013
Categories    engineering   nanotechnology   manufacturing   materials

Call For Papers

2013 3rd International Conference on Key Engineering Materials
ICKEM 2013
Kota Kinabalu, Malaysia. March 8-9, 2013

Call for Papers

2013 3rd International Conference on Key Engineering Materials (ICKEM 2013) is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Key Engineering Materials. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:

Advanced Characterization
Biological Materials
Biotechnology and Life Sciences
Bulk Crystal Growth
Computational Materials Science
Corrosion and Environmental Effects
Economics of Materials
Electronic Materials
Electronic, Optical, and Magnetic Properties
Energy and Environmental Technology
Information and Telecommunications Technology
Magnetic Materials
Magnetic Properties
Materials Culture
Materials for Energy and Environmental Applications
Materials Processing
Materials Theory
Mechanical Behavior of Materials
Mechanical Properties and Nanomechanics
Optical and Photonic Materials
Organic Polymer Materials
Phase Transformations
Self Assembly
Shape Deposition Manufacturing
Surfaces, Interfaces, and Thin Films
Thin-Film Deposition
Transport Properties

All accepted papers of ICKEM 2013 will be published by Advanced Materials Research Journal, which will be indexed by EI Compendex.

Advanced Materials Research (ISSN: 1022-6680) is Indexed by Elsevier: SCOPUS and Ei Compendex (CPX) Cambridge Scientific Abstracts (CSA), Chemical Abstracts (CA), Google and Google Scholar, ISI (ISTP, CPCI, Web of Science), Institution of Electrical Engineers (IEE), etc.


1. Electronic Submission System; ( .pdf)

If you can't login the submission system, please try to submit through method 2.

2. Email: ( .pdf and .doc)

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