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THERMINIC 2012 : 18th International Workshop on Thermal Investigations of ICs and Systems


When Sep 25, 2012 - Sep 27, 2012
Where Budapest, Hungary
Submission Deadline Apr 1, 2012
Notification Due May 30, 2012
Final Version Due Jun 30, 2012

Call For Papers

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. This year THERMINIC will address in addition to the “traditional” thermal management problems, also stress and thermal-stress-related-reliability issues, both in micro- and opto-electronics fields.


include, but are not limited to, the following topics:

Thermal and Temperature Sensors
Acquisition and analysis of Thermal data
Thermal Simulation
Temperature Mapping
Electro-thermal Simulation
Novel and Advanced Cooling Techniques
Thermal Modelling & Investigation of Packages
Thermal Performance of Interconnects
Reliability Issues
Heat Transfer Enhancement
High Temperature Electronics
Validation of Thermal Software
Heat Transfer Education
Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects
Flow Visualisation Techniques
Turbulence Modelling in Complex Geometrics
Thermal Stress: Theory and Experiment
Defect and failure modelling
Thermal Stress Failures: Prediction and Prevention
Reliability evolution and prediction
Multiphysics simulation
Nanotechnology Applications
Nanoengineering issues
Noise control
3DIC, power electronics.
Measurement of Thermal Properties

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