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MTD 2012 : 3rd International Workshop on Managing Technical Debt

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Link: http://www.sei.cmu.edu/community/td2012/
 
When Jun 5, 2012 - Jun 5, 2012
Where Zurich, Switzerland
Submission Deadline Feb 17, 2012
Notification Due Mar 19, 2012
Final Version Due Mar 29, 2012
Categories    software economics   software development   trade-off analysis   software quality
 

Call For Papers

CALL FOR PAPERS
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3rd International Workshop on Managing Technical Debt (MTD 2012) http://www.sei.cmu.edu/community/td2012/

June 5, 2012
Zurich, Switzerland

In conjunction with the 34th Int. Conf. on Software Engineering (ICSE 2012)
www.ifi.uzh.ch/icse2012
Zurich, Switzerland, June 2-9, 2012

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IMPORTANT DATES

Submission Deadline: Feb 17, 2012
Acceptance Notification: March 19, 2012
Camera-Ready Version: March 29, 2012
Workshop: June 5, 2012
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Delivering complex, large-scale systems faces the ongoing challenge of how best to balance rapid deployment with long-term value. The technical debt metaphor is gaining significant traction in the software development community, as a way to understand and communicate issues of intrinsic quality, value, and cost.

The idea is that developers sometimes accept compromises in a system in one dimension (e.g., modularity) to meet an urgent demand in some other dimension (e.g., a deadline), and that such compromises incur a debt on which interest has to be paid and which should be repaid at some point for the long-term health of the project.

There is increasing necessity to address theoretical foundations and empirical evidence for analyzing and optimizing short-term versus long-term goals in large scale projects. The goal of this third workshop is to discuss managing technical debt as a part of the research agenda for the software engineering field, in particular focusing on eliciting and visualizing debt and creating payback strategies.

MTD 2012 seeks contributions addressing, but not limited to, the following topics:

* Techniques for identifying and monitoring technical debt
* Types of technical debt in industrial settings
* Key parameters that help elicit, communicate, and manage technical debt quantitatively
* Lifetime of technical debt
* Relationship of technical debt to code quality and defect analysis
* Technical debt throughout the software development lifecycle
* Relationship of technical debt to evolution and maintenance activities
* Empirically collecting information about technical debt
* Measurement and payoff strategies for technical debt
* Metrics for analyzing technical debt
* Visualization of technical debt
* Using technical debt strategically
* Relationship of technical debt to different software development activities (requirements debt, architectural debt, testing debt)


SUBMISSIONS
We invite submissions of papers in any areas related to the themes and goals of the workshop in the following categories:

1. research papers-describing innovative and significant original research in the field (8 pages)

2. industrial papers-describing industrial experience, case studies, challenges, problems and solutions (8 pages)

3. position and future trend papers-describing ongoing research, new results, and future trends (4 pages)

Contributors are requested to submit their papers through EasyChair; https://www.easychair.org/conferences/?conf=mtd2012
Please visit http://www.sei.cmu.edu/community/td2012/ for further information.

ORGANIZERS
Philippe Kruchten, University of British Columbia, Canada
Rod Nord, Software Engineering Institute, USA
Ipek Ozkaya, Software Engineering Institute, USA
Joost Visser, Software Improvement Group, Netherlands

PROGRAM COMMITTEE
Eric Bouwers, Technical University Delft, Netherlands
Yuangfang Cal, Drexel University, USA
Rafael Capilla, Universidad Rey Juan Carlos, Spain
Jeromy Carriere, eBay, USA
Bill Curtis, CAST, USA
Hakan Erdogmus, Kalemun Research, Canada
David Garlan, Carnegie Mellon University, USA
Israel Gat, Cutter Consortium, USA
Matthew Heusser, Socialtext, USA
Jim Highsmith, ThoughtWorks, USA
Rick Kazman, University of Hawaii and the Software Engineering Institute, USA
Erin Lim, University of British Columbia, Canada
Alan MacCormack, MIT, USA
Don O'Connell, Boeing, USA
Raghu Sangwan, Penn State University, USA
Carolyn Seaman, University of Maryland, USA
Kevin Sullivan, University of Virginia, USA
Peri Tarr, IBM, USA
Ted Theodoropoulus, Acrowire, USA

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