posted by system || 2038 views || tracked by 4 users: [display]

EP 2008 : IEEE Electrical Performance of Electronic Packaging

FacebookTwitterLinkedInGoogle

Link: http://www.epep.org/
 
When Oct 27, 2008 - Oct 29, 2008
Where San Jose, CA, USA
Submission Deadline Jul 18, 2008
Categories    manufacturing   microwave
 

Call For Papers

[Empty]

Related Resources

LINGUISTICS-EP 2021   CALL FOR PAPERS - LANGUAGE AND TECHNOLOGY
MSF--ICNMM--Scopus, EI Compendex 2021   MSF--2021 4th International Conference on Nanomaterials, Materials and Manufacturing Engineering (ICNMM 2021)--Scopus, EI Compendex
ASE 2021   The 36th IEEE/ACM International Conference on Automated Software Engineering
IEEE--ICIII--Ei Compendex, Scopus 2021   2021 International Conference on Information Management, Innovation Management and Industrial Engineering (ICIII 2021)--IEEE, Ei Compendex, Scopus
ICFSP--IEEE, Ei, Scopus 2021   IEEE--2021 6th International Conference on Frontiers of Signal Processing (ICFSP 2021)--Ei Compendex, Scopus
RSAE--ACM, EI, Scopus 2021   ACM--2021 The 3rd International Conference on Robotics Systems and Automation Engineering (RSAE 2021)--EI Compendex, Scopus
SMC 2021   IEEE International Conference on Systems, Man, and Cybernetics
CEAC--IOP, Scopus 2021   2021 International Civil Engineering and Architecture Conference (CEAC 2021)--IOP, Scopus
ICCIS--IEEE, Ei and Scopus 2021   IEEE--2021 5th International Conference on Communication and Information Systems (ICCIS 2020)--Ei Compendex, Scopus
ICPE 2021   International Conference on Performance Engineering