CALL FOR PAPERS – SPECIAL ISSUE

Journal: Fluid Dynamics & Materials Processing (FDMP)
Publisher: Tech Science Press

Special Issue: Advanced Thermal-Fluid Engineering and Heat Transfer: Experimental, Computational, and Intelligent Approaches

Guest Editor: Asst. Prof. Dr. Surachet Sichamnan
Rajamangala University of Technology Isan, Sakon Nakhon Campus, Thailand

Submission Deadline: 15 June 2027

This Special Issue invites original research and review articles addressing recent advances in thermal-fluid engineering and heat transfer, with particular emphasis on experimental, computational, and intelligent approaches.

Topics include:
- Advanced heat transfer enhancement
- Thermal-fluid system design and optimization
- Computational fluid dynamics (CFD) and multiphysics simulation
- Artificial intelligence and machine learning
- Internet of Things (IoT), smart sensing, and digital twins
- Renewable energy and solar thermal applications
- Thermal energy storage and waste heat recovery
- Multiphase and complex fluid flows
- Experimental validation and thermal system optimization

Researchers worldwide are invited to contribute high-quality manuscripts relevant to the Special Issue.

Official Special Issue Website:
https://www.techscience.com/fdmp/special_detail/thermal-fluid-engineering

Contact: surachet.si@rmuti.ac.th