2027 International Conference on Semiconductor Process and Micro/Nano Manufacturing (SPMNM 2027)

★CONTACT US
Website: www.spmnm.org
Date: August 6–8, 2027
Venue: China
Full Paper Submission: February 20, 2027
Email: email@spmnm.org
Tel:+86-28-85586839 (International)
Monday-Friday, 9:00am-12:00pm and 1:30pm-6:00pm


★Welcome to SPMNM 2027
Welcome to the 2027 International Conference on Semiconductor Process and Micro/Nano Manufacturing (SPMNM 2027)! We are delighted to have you join us from August 6–8, 2027.
As semiconductor technology advances toward smaller nodes and more complex architectures, innovations in process technologies and micro/nano manufacturing are essential to sustaining the momentum of the electronics industry. SPMNM 2027 brings together leading researchers, engineers, and industry professionals from around the globe to explore cutting-edge advancements in lithography and patterning, thin-film deposition, etching, CMP, advanced packaging, and AI-driven process control.


★Publication Information
Registered and presented full papers will be included in the SPMNM 2027 digital conference proceedings and submitted to major citation databases (including, but not limited to Ei Compendex and Scopus) for review and indexing.


★Call for papers
Topics of Interest include but not limited to:
1. Advanced Semiconductor Process Technologies
EUV Lithography, Nanoimprint, and Next-Generation Patterning Technologies
Thin-Film Deposition (CVD, PVD, ALD, etc.)
Dry and Wet Etching Technologies
Ion Implantation and Doping Technologies
Chemical Mechanical Planarization (CMP) and Surface Engineering
High-k/Metal Gate, Contact, and Interconnect Technologies

2. Micro/Nano Manufacturing, Metrology, and Advanced Applications
Micro/Nano Fabrication Techniques (Electron-Beam, Focused Ion Beam, etc.)
MEMS/NEMS Fabrication and Integration Technologies
Nanoimprint Lithography and Self-Assembly for Nanomanufacturing
3D Integration, TSV, and Through-Silicon Interconnect Technologies
Advanced Packaging and Heterogeneous Integration
Metrology, Inspection, and Defect Characterization (SEM, TEM, AFM, etc.)