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MMEAT 2026 : 2026 12th International Conference on Mechanical Engineering, Materials and Automation Technology | |||||||||||||
| Link: https://ais.cn/u/nqaeYb | |||||||||||||
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Call For Papers | |||||||||||||
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2026 12th International Conference on Mechanical Engineering, Materials and Automation Technology (MMEAT 2026) will be held in Beijing, China from June 5 to 7, 2026.
๐๐ผ๐ป๐ณ๐ฒ๐ฟ๐ฒ๐ป๐ฐ๐ฒ ๐ช๐ฒ๐ฏ๐๐ถ๐๐ฒ: https://ais.cn/u/nqaeYb ---๐๐ฎ๐น๐น ๐๐ผ๐ฟ ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ๐--- The topics of interest for submission include, but are not limited to: โMechanical Automation CNC technology and CNC system Intelligent manufacturing technology Test techniques and troubleshooting Computer Integrated Manufacturing Systems (CIMS) Molding manufacturing and automation Instrument Science and Technology Fluid Machinery and Engineering Mechatronics Automatic control and technology Automated instrumentation and equipment Factory modeling and automation Circuits and systems Communications and Information Systems Electronic systems Human-computer interaction and mechatronic engineering โControl, Automation and Information Technology Control System Modeling and Simulation technology Intelligent Optimization Algorithms and Applications Fluid Power Transmission and Control Production Process Simulation Network Control Electric Automation Vehicle Control Systems Computer Integrated Manufacturing Microelectronics Technology Embedded Systems The Photoelectron IT and System Intelligent Traffic Control Computer System Structure โAdvanced Materials Nanomaterials and Nanotechnology Semiconductor Materials and Devices Electronic Packaging and Interconnection Technology Flexible electronics and smart wearable devices High Frequency Electronic Materials and Applications Electronic ceramics and catalytic materials Photoelectric materials and LED technology Thermoelectric materials and thermal management Technology Battery Technology and Energy Storage New display technology and materials Optoelectronics and Microelectronic Materials Optoelectronic display materials Semiconductor Materials and Semiconductor Lighting Power Laser Materials and Devices Advanced Packaging Materials and Technologies Solar cell materials Electromagnetic Compatibility Technology and Materials Materials and Devices for High Frequency and Ultra High Frequency Communication ---๐ฃ๐๐ฏ๐น๐ถ๐ฐ๐ฎ๐๐ถ๐ผ๐ป--- All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing. ---๐๐บ๐ฝ๐ผ๐ฟ๐๐ฎ๐ป๐ ๐๐ฎ๐๐ฒ๐--- Full Paper Submission Date: April 22, 2026 Registration Deadline: May 29, 2026 Final Paper Submission Date: May 5, 2026 Conference Dates: June 5-7, 2026 --- ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ ๐ฆ๐๐ฏ๐บ๐ถ๐๐๐ถ๐ผ๐ป--- Please send the full paper(word+pdf) to Submission System: https://ais.cn/u/nqaeYb |
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