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CMPAI 2026 : 2026 International Conference on Condensed Matter Physics and Artificial Intelligence | |||||||||||||
| Link: https://www.aischolar.com/conference/cmpai2026?invite=wiki | |||||||||||||
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Call For Papers | |||||||||||||
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2026 International Conference on Condensed Matter Physics and Artificial Intelligence(CMPAI 2026) will be held on April 17-19, 2026 in San Francisco, USA/ Hybrid.
๐๐ผ๐ป๐ณ๐ฒ๐ฟ๐ฒ๐ป๐ฐ๐ฒ ๐ช๐ฒ๐ฏ๐๐ถ๐๐ฒ: https://www.aischolar.com/conference/cmpai2026?invite=wiki ---๐๐ฎ๐น๐น ๐๐ผ๐ฟ ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ๐--- The topics of interest for submission include, but are not limited to: โ AI in Superconductivity and Magnetism Design and optimization of superconducting materials Prediction of magnetic properties and new phases AI-assisted study of superconducting and magnetic mechanisms Machine learning applications in magnetic quantum materials Intelligent experimental data processing and analysis Smart control for superconducting devices โ AI in Low-dimensional and Topological Physics Identification and classification of topological materials Electronic state analysis in low-dimensional systems Topological quantum computing and information processing Dynamics simulations of low-dimensional heterostructures Detection of topological phases and experimental data analysis โ AI in Non-equilibrium and Statistical Physics Simulations of non-equilibrium dynamics and phase transitions Modeling of many-body system dynamics Analysis of thermal transport and energy conversion Theoretical modeling of non-equilibrium systems Deep learning in complex dissipative systems Integration of intelligent simulations with experimental data โ Intelligent Methods in Computational and Materials Physics AI-assisted electronic structure calculations Multiscale materials simulations with machine learning High-throughput materials screening and design Analysis of defects and interfaces in electronic structures Machine-learned potentials and accelerated simulations AI research in energy materials Other ... ---๐ฆ๐ฝ๐ฒ๐ฎ๐ธ๐ฒ๐ฟ๐ (๐๐ป๐๐ฒ๐ป๐ฑ ๐๐ผ ๐ถ๐ป๐๐ถ๐๐ฒ)--- Prof. Daowen Qiu,Sun Yat-sen University, China Assoc. Prof. Siow Kim Shyong,The National University of Malaysia, Malaysia ---๐ฃ๐๐ฏ๐น๐ถ๐ฐ๐ฎ๐๐ถ๐ผ๐ป--- All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers of CMPAI 2026 will be published in the conference proceedings and will be submitted to EI Compendex and Scopus for indexing. ---๐๐บ๐ฝ๐ผ๐ฟ๐๐ฎ๐ป๐ ๐๐ฎ๐๐ฒ๐--- Full Paper Submission Date: January 31, 2026 Registration Deadline: March 31, 2026 Final Paper Submission Date: March 31, 2026 Conference Dates: April 17-19, 2026 --- ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ ๐ฆ๐๐ฏ๐บ๐ถ๐๐๐ถ๐ผ๐ป--- Please send the abstract or full paper(word+pdf) to Submission System: https://www.aischolar.com/conference/cmpai2026/submission?invite=wiki |
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