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CMPAI 2026 : 2026 International Conference on Condensed Matter Physics and Artificial Intelligence | |||||||||||||
| Link: https://www.aischolar.com/conference/cmpai2026?invite=wiki | |||||||||||||
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Call For Papers | |||||||||||||
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2026 International Conference on Condensed Matter Physics and Artificial Intelligence(CMPAI 2026) will be held on April 17-19, 2026 in San Francisco, USA/ Hybrid.
𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://www.aischolar.com/conference/cmpai2026?invite=wiki ---𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀--- The topics of interest for submission include, but are not limited to: ◕ AI in Superconductivity and Magnetism Design and optimization of superconducting materials Prediction of magnetic properties and new phases AI-assisted study of superconducting and magnetic mechanisms Machine learning applications in magnetic quantum materials Intelligent experimental data processing and analysis Smart control for superconducting devices ◕ AI in Low-dimensional and Topological Physics Identification and classification of topological materials Electronic state analysis in low-dimensional systems Topological quantum computing and information processing Dynamics simulations of low-dimensional heterostructures Detection of topological phases and experimental data analysis ◕ AI in Non-equilibrium and Statistical Physics Simulations of non-equilibrium dynamics and phase transitions Modeling of many-body system dynamics Analysis of thermal transport and energy conversion Theoretical modeling of non-equilibrium systems Deep learning in complex dissipative systems Integration of intelligent simulations with experimental data ◕ Intelligent Methods in Computational and Materials Physics AI-assisted electronic structure calculations Multiscale materials simulations with machine learning High-throughput materials screening and design Analysis of defects and interfaces in electronic structures Machine-learned potentials and accelerated simulations AI research in energy materials Other ... ---𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀 (𝗜𝗻𝘁𝗲𝗻𝗱 𝘁𝗼 𝗶𝗻𝘃𝗶𝘁𝗲)--- Prof. Daowen Qiu,Sun Yat-sen University, China Assoc. Prof. Siow Kim Shyong,The National University of Malaysia, Malaysia ---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻--- All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers of CMPAI 2026 will be published in the conference proceedings and will be submitted to EI Compendex and Scopus for indexing. ---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀--- Full Paper Submission Date: March 2, 2026 Registration Deadline: March 31, 2026 Final Paper Submission Date: March 31, 2026 Conference Dates: April 17-19, 2026 --- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻--- Please send the abstract or full paper(word+pdf) to Submission System: https://www.aischolar.com/conference/cmpai2026/submission?invite=wiki |
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