Therminic 2026 : International Workshop on Thermal Investigations of ICs and Systems

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Therminic 2026 : International Workshop on Thermal Investigations of ICs and Systems

When	Sep 16, 2026 - Sep 18, 2026
Where	Berlin
Submission Deadline	Apr 1, 2026
Notification Due	Jun 8, 2026
Final Version Due	Aug 3, 2026

Categories thermal thermo-mechanical reliability electronics cooling concepts investigations of ics

Call For Papers

The 32nd International Workshop on Thermal Investigations of ICs and Systems seeks original, noncommercial papers describing research and innovations related to thermal and reliability issues in electronic components and systems. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.
Conference Topics:
• Thermal Phenomena in Simulation & Experiment
• Electronics Cooling Concepts & Applications
• Thermo-Mechanical Reliability
The abstract should not exceed two pages and should be uploaded as a PDF file. The online system for abstract submission will open in December 2025.

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