2026 2nd International Conference on Advanced Semiconductors and Communications(ICASC 2026) will be held on May 8-10, 2026 in Shanghai, China.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/JNNN3q

---𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕ Semiconductor manufacturing
Extreme ultraviolet lithography ( EUV ) technology
3D integrated circuit and its manufacturing process
Advanced packaging and testing technology
Semiconductor manufacturing process optimization and automation

◕ Quantum computation and quantum communication
Quantum dot and quantum bit control 
Quantum cryptography and secure communication 
Quantum Networks and the Internet
Quantum computing hardware and chip design

◕ Semiconductor materials and devices
New semiconductor materials ( such as silicon carbide, gallium nitride and two-dimensional materials ) 
Advanced CMOS Technology 
High efficiency power semiconductor devices
Nanoscale electronic devices

◕ Sensor and MEMS technology
Integrated micro-electro-mechanical system ( MEMS ) smart sensors and nano-sensors
Bioelectronic equipment and sensing technology
Environmental Monitoring and Health Management Sensors

◕ Mobile communication technology
Mobile Edge Computing ( MEC ) 
Network slicing technology 
Elastic network and adaptive communication
Internet of Vehicles ( V2X ) technology

◕ Intelligent sensing and Internet of Things (IoT)
Internet of Things node and gateway design 
Internet of things security and privacy 
Edge computing and edge intelligence
Low Power Wide Area Network (LPWAN)

◕ Data processing and transmission
High speed data link technology 
Advanced coding and modulation technology 
Data compression and transmission optimization
Fault tolerance and error correction technology

---𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Jianjun Yu,Fudan University, China
Prof. Lin Wang,Xiamen University, China
Prof. Liang Yang,Hunan University, China
Prof. Pengfei Tian,Fudan University, China
Prof. Limin Xiao,Fudan University, China
Prof. Chen Jiang,Fudan University, China
Prof. Sanming Hu,Southeast University, China
Prof. Baile Chen,Shanghai Tech University, China

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ICASC 2026 will be published in the SPIE - The International Society for Optical Engineering (ISSN: 0277-786X) Conference Proceedings, and it will be submitted to EI Compendex and Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission Date: March 6, 2026
Registration Deadline: April 3, 2026
Final Paper Submission Date: April 20, 2026
Conference Dates: May 8-10, 2026

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/JNNN3q