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MLES 2026 : 2026 International Conference on Machine Learning and Embedded Systems | |||||||||||||
| Link: https://ais.cn/u/QbAFnq | |||||||||||||
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Call For Papers | |||||||||||||
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2026 International Conference on Machine Learning and Embedded Systems (MLES 2026) will be held on April 24-26, 2026 in Suzhou, China. This conference is sponsored by Zhengzhou University.
𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/QbAFnq ---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀--- The topics of interest for submission include, but are not limited to: ◕ Communication Technology Communication Big Data Communication Artificial Intelligence Mobile Sensor Networks Wireless Cellular Networks Wireless Sensor Networks Internet of Things (IoT) Mobile Intelligent Devices and Human-Computer Interaction Network Control Systems Connected Vehicles ◕ Computer Vision and Algorithms Medical Image Processing Machine Learning Algorithms Computer Vision Reinforcement Learning Generative Adversarial Networks (GANs) Adversarial Machine Learning Modeling and Recognition Human-Computer Interaction ◕ Embedded Systems Technology Lightweight Model Optimization Intelligent Sensor Systems Intelligent Control Systems and Embedded Devices Embedded Processors and System-on-Chip Embedded Machine Learning (E-ML) Embedded Sensing Systems Autonomous Robotic Systems and Control Technologies Collaborative Robots Unmanned Aerial Vehicle Control Intelligent Robots Smart Cars Autonomous Vehicles ---𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀--- Prof. Por Lip Yee, Universiti Malaya, Malaysia ---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻--- All papers submitted to MLES 2026 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X), and submitted to EI Compendex, Scopus for indexing. ---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀--- Full Paper Submission Date: February 15, 2026 Registration Deadline: March 15, 2026 Final Paper Submission Date: April 1, 2026 Conference Dates: April 24-26, 2026 --- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻--- Please send the full paper(word+pdf) to Submission System: https://ais.cn/u/QbAFnq |
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